JPH0124889Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] The present invention relates to a coating device for chip-shaped electronic components.
This invention relates to an apparatus for cooling and solidifying a coating film after painting.

[Technical background of the invention and its problems]

Conventionally, when painting electronic components, the paint was applied, baked, and dried while the electronic components were transferred using a transfer belt, and then the paint film was solidified by air cooling, but this cooling was insufficient. If this happens, the coating film will adhere to each other when released from the transfer zone, damaging the coating film and resulting in a defective product. In addition, in order to achieve sufficient cooling, the transfer zone has to be long, resulting in an increase in the size of the device.

[Purpose of invention]

In view of the above-mentioned problems, the present invention has been proposed in a coating device that paints electronic components while being transferred by a transfer band, in which the bottom surface of the electronic component derived from the drying process is exposed to the bottom surface of the transfer band, and is cooled by the circulation of a cooling medium. The paint film is supported on a pedestal, and the painted electronic parts are forcibly cooled to completely solidify the paint film and released, thereby preventing damage to the paint film due to adhesion of the painted electronic parts to each other. .

[Summary of the invention] The present invention is a coating device that applies and dries paint while transporting electronic components with a transfer band, in which the bottom surface of the electronic component derived from the drying process is made to face the bottom surface of the transfer band. Electronic components are cooled by supporting them on a pedestal that is cooled by the flow of a cooling medium.

[Example of idea]

Embodiments of the present invention will be described with reference to the accompanying drawings.

Reference numeral 1 denotes an electronic component transfer device, which consists of an endless transfer band 4 installed between drums 2 and 3, and a guide rail 5 facing the bottom surface of the endless transfer band 4. A large number of through holes 7 are formed into which the components 6 are inserted, and cutouts 9 are formed at both ends of the through holes 7 in the width direction, into which the large diameter portions 8 that become electrodes of the electronic component 6 are engaged. and the guide rail 5
is configured to support and transfer the lower surface of the large-diameter portion 9 of the electronic component 6 protruding from the notch 9.
Further, a guide body 10 is provided along the outer circumferential surface of the drum 3, and a concave groove 1 faces the circumferential surface of the drum 3 and the inner surface of the guide body 10 and faces the passage of the through hole 7 of the transfer band 4.
1 and 12 are formed.

Further, an electronic component supply device 13, a coating device 14, a drying device 15, and a cooling device 16 are sequentially provided facing the passage of the endless transfer belt 4.

The cooling device 16 is provided with a hollow box-shaped sealed pedestal 17 that supports the bottom surface of the electronic component 6 instead of the guide rail 5 on the lower surface of the transfer zone 4, and this pedestal 17 has an inlet 18 and an outlet. 19 is formed through which a cooling medium such as cooling water flows.

Next, the operation of the above embodiment will be explained.

The electronic component 6 supplied onto the transfer band 4 from the electronic component supply device 13 is inserted into the through hole 7, and the large diameter portions 8, 8 at both ends thereof are engaged with the notches 9, 9, and the lower surface of the large diameter portions 8, 8. are transported while being supported by guide rails 5. Then, the coating device 14 coats the paint, the drying device 15 dries it, and the cooling device 16 transfers the electronic component 6 so that it comes in contact with the top surface of the cooled pedestal 17 through which cooling water flows, and its cold heat is transferred. The electronic component 6 is cooled and the coating film is completely cured.

[Effect of idea]

According to the present invention, in a coating device that applies and dries paint while transporting electronic components with a transfer band, the lower surface of the electronic component derived from the drying process is placed so as to face the lower surface of the transfer band, and the cooling medium is removed. Since the electronic components are supported by a pedestal that is cooled by circulation, the electronic components are cooled as they pass over the pedestal, and the coating film on the electronic component is cooled and hardened, preventing the coating films from adhering to each other. There is no damage to the paint film, and the occurrence of defective products due to damage to the paint film can be reduced.

[Brief explanation of the drawing]

Fig. 1 is a side view of a coating device showing an embodiment of the present invention, Fig. 2 is an enlarged vertical sectional side view of the same cradle, and Fig. 3 is a side view of a coating device showing an embodiment of the present invention.
The figure is an enlarged plan view of the transport zone same as the above, and FIG. 4 is a side view of the same. 4...transport belt, 6...electronic parts, 17...cradle.

Claims (1)

[Scope of utility model registration request] In a coating device that applies and dries paint while transporting electronic components in a transfer zone, the lower surface of the electronic component derived from the drying process is placed facing the lower surface of the transfer zone and is cooled by the flow of a cooling medium. A coating device for electronic parts, characterized in that it is supported by a stand.