JPH01272191A - Surface packaging component and packaging method using such component - Google Patents

Abstract

PURPOSE:To prevent outflow of an adhesive during transportation and to prevent splash of the adhesive during mounting of a surface packaging component by sealing a recess formed on the rear face of the component and filled with an adhesive with a resin film which can be thermally decomposed or molten by preliminary heat treatment before the packaging. CONSTITUTION:A recess 2 is formed on the rear face of a surface packaging component 1 and a known surface-packaging adhesive 3 of an epoxy- or polyurethane-type thermosetting resin is injected into the recess 2. A heat decomposable resin 4 is applied 4 so as to completely cover the recess 2 and to form a sealing film. The sealing film thus prevents the adhesive from flowing out of the recess even if the component 1 is turned such that the rear face faces down. The component 1 is mounted on a previously heated substrate with the recess 2 down. The resin 4 can be decomposed easily by the heat of the substrate and the component 1 can be adhered and fixed temporarily to the substrate. Leads 5 are then soldered at required points to complete the surface packaging of the component to the substrate. Since no adhesive flows out of the recess even if the rear face of the component faces down, the component can be packed and transported without any problem and can be mounted on the substrate without splashing the adhesive.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a surface mount fixture and a mounting method using the same, and in particular to a surface mounting device with built-in adhesive suitable for temporary fixing to a mounting board using adhesive. Concerning mounting components and mounting methods using them.

[Conventional technology]

Conventional surface mount components are disclosed in Japanese Patent Application Laid-Open No. 62-185348, for example.
As described in the above issue, a structure is known in which a recess is provided on the back surface of an electronic component and an adhesive is simply poured into the recess.

FIG. 2 shows a conventional surface-mounted component 1 in which a recess 2 is filled with an adhesive 3. As shown in FIG. When mounting the above-mentioned components on the mounting board, the process is as shown in FIG.
By flipping the adhesive cloth surface of the component onto the mounting board side and mounting the component, the filled adhesive 3 flows out and is temporarily fixed to the board 7. In this state, the leads 5 are soldered to the pad portions 6 on the wiring circuit of the board.

[Problem to be solved by the invention]

The above conventional technology does not give any consideration to the leakage of adhesive when packing and transporting surface mount components filled with the adhesive 3 or when mounting the board on the board.
The spilled adhesive may cause sticky contamination of the surrounding area, damage the product value by adhering to carriers such as tape or cases, and when mounting a board, the adhesive may leak out before it is placed in the specified position on the board. However, since it scatters in unnecessary places on the board, there is a problem that it cannot be properly bonded at the desired bonding position.

The purpose of the present invention is to solve the above technical problem,
The first object is to provide an improved adhesive-filled surface mount component, and the second object is to provide a mounting method using the same.

[Means to solve the problem]

The first object is achieved by a surface mount component having a recess filled with an adhesive on the back surface and sealing the recess with a resin film that can be thermally decomposed or melted during preheating during mounting. be done.

The second objective is to have a recess filled with adhesive on the back surface in advance when surface mounting components are surface mounted on a predetermined board, and the recess is thermally decomposed or melted during preheating treatment during mounting. a step of preparing a surface mount component sealed with a resin film to be obtained; a step of placing the component at a predetermined position on the board with the surface sealed with the resin film facing the surface of the mounting board; and a step of placing the component at a predetermined position on the board. a step of bonding the component to the substrate by causing the adhesive filled in the recess to flow out by thermally decomposing or melting the resin film while it is placed on the substrate; and a step of bonding and fixing the component to the substrate. in a state where
This is achieved by a surface mount component mounting method characterized by comprising the step of connecting and fixing the lead of the component to a predetermined pad of the board.

The resin film that seals the recess is formed at a relatively low temperature and decomposes or melts when preheated at a temperature lower than the curing temperature of the adhesive. It may be applied to form a film, or a thin film-like resin film may be adhered.The film that seals the recesses is thermally decomposed or ruptured by heating and melting, as described above, and the adhesive inside is removed. leak out,
This adhesively fixes the component to the board. As this type of resin film, well-known thin films such as polyethylene, polypropylene, polystyrene, etc. can be used.

[Effect]

By doing this, the adhesive will not flow out even if the back side of the surface mount component is facing down, so there will be no problems during packaging or transportation, and the adhesive will not leak out even when the surface mount component is placed on the board. It can prevent scattering. In addition, by mounting it on a preheated substrate, the sealing resin will easily decompose and the adhesive will flow out to the required position.
Can be glued.

〔Example〕

An embodiment of the surface mount component of the present invention will be described below with reference to FIG. A recess 2 is formed on the back surface of the surface mount component 1, and a well-known surface mount adhesive 3 made of, for example, an epoxy or polyurethane thermosetting resin is poured into the recess. after that,
A pyrolyzable resin 4 is applied to completely cover this recessed portion to form a sealing film.

Because of this structure, the adhesive will not flow out even if the back surface of this surface-mounted component is placed downward.

Next, when mounted on a preheated board with the recess 2 on the back side facing down, the resin 4 easily decomposes and the adhesive flows out to the desired position on the board, causing the surface mount component to 1 can be glued or temporarily attached.

Thereafter, the necessary parts of the leads 5 are soldered to complete the surface mounting on the board.

The above-mentioned thermally decomposable resin has a temperature of 200°C or lower, practically 1
It is desirable that the sealing film be easily decomposed at a temperature of about 00 to 200°C, and the sealing film should be thick enough to prevent the adhesive filled in the recess from flowing out. be. It is desirable to form the film as thin as possible to facilitate thermal decomposition and to have a thickness sufficient to function as a sealing film for the adhesive.

Further, in order to form the sealing film, a resin may be applied to form a film as described above, or the opening of the recess may be sealed with a thin film.

〔Effect of the invention〕

According to the present invention, since the concave part on the back surface into which the adhesive is poured is completely covered with resin and the adhesive is sealed, it is possible to prevent the adhesive from flowing out when packaging and transporting the mounted component, and at the same time, it is possible to prevent the adhesive from flowing out when packaging and transporting the mounted component. This also prevents the adhesive from scattering when the device is mounted on the device. Further, by using a thermally decomposable resin as a sealing film for the recessed portions, there is an effect that the adhesive can be reliably dropped and bonded to the required position on the substrate.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the surface mount component of the present invention;
FIG. 2 is a sectional view of a conventional product, and FIG. 3 is a process diagram of surface mounting using the conventional product of FIG. In fig. 1...Surface mount component 2...Recessed part on the back side 3...
・Adhesive 4...Pyrolytic resin 5...Lead attorney Junnosuke Nakamura Figure 1 120. A1 Cloud 4-Pyrolysis) Wang Xie Ayu 5---Lead 2 Figure 1; Surface mount parts Figure 3

Claims (1)

[Scope of Claims] 1. A surface-mounted component characterized by having a recess filled with an adhesive on the back surface and sealing the recess with a resin film that can be thermally decomposed or melted during preheating treatment during mounting. 2. When surface mounting components on a specified board,
A step of preparing a surface mount component having a recess filled with adhesive on the back surface and sealing the recess with a resin film that can be thermally decomposed or melted during preheating treatment during mounting; The concave portion is formed by placing the sealing surface at a predetermined position on the board with the sealing surface facing the mounting board surface, and by thermally decomposing or melting the resin film while the component remains placed at the predetermined position on the board. the step of bonding the component to the substrate by flowing out the adhesive filled in the component; and the step of connecting and fixing the lead of the component to a predetermined pad of the substrate while the component is adhesively fixed to the substrate. A method for mounting surface mount components, characterized by comprising: