JPH0129043B2 - - Google Patents
Info
- Publication number
- JPH0129043B2 JPH0129043B2 JP58111217A JP11121783A JPH0129043B2 JP H0129043 B2 JPH0129043 B2 JP H0129043B2 JP 58111217 A JP58111217 A JP 58111217A JP 11121783 A JP11121783 A JP 11121783A JP H0129043 B2 JPH0129043 B2 JP H0129043B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- acrylic
- resistance
- bisphenol
- methacrylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- -1 acrylic ester Chemical class 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- UNKQPEQSAGXBEV-UHFFFAOYSA-N formaldehyde;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound O=C.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 UNKQPEQSAGXBEV-UHFFFAOYSA-N 0.000 claims description 6
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002601 oligoester Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000003138 primary alcohols Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子回路に使用されるレジン系抵
抗体を製造するための抵抗インキ組成物に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resistive ink composition for producing resin-based resistors used in various electronic circuits.
従来例の構成とその問題点
従来より、レジン系抵抗体は固定抵抗器または
可変抵抗器として広く使用されてきた。従来のこ
れら抵抗体はバインダ樹脂に熱硬化型樹脂を使用
してきたため、抵抗体の製造に高温、長時間を要
し、さらに紙−フエノール樹脂基板等に積層する
場合は基板等の劣化を生じる等の問題点を有し、
改善が望まれている。Conventional Structure and Problems Resin-based resistors have been widely used as fixed resistors or variable resistors. These conventional resistors have used thermosetting resin as the binder resin, so manufacturing the resistor requires high temperatures and a long time, and furthermore, when laminated on a paper-phenol resin substrate, etc., the substrate etc. may deteriorate. It has the problem of
Improvement is desired.
発明の目的
本発明の目的は従来のレジン系抵抗体の製造に
関する上記問題点を解決するための抵抗インキ組
成物を提供することである。本目的は以下に詳述
する抵抗インキ組成物を電子線照射するかまたは
放射型の加熱装置により急速加熱して抵抗体を製
造することにより達成される。OBJECTS OF THE INVENTION An object of the present invention is to provide a resistive ink composition for solving the above-mentioned problems associated with the production of conventional resin-based resistors. This object is achieved by manufacturing a resistor by irradiating the resistive ink composition described in detail below with an electron beam or rapidly heating it with a radiation type heating device.
発明の構成
本発明にかかる抵抗インキ組成物は、バインダ
樹脂としてビスフエノールA―ホルムアルデヒド
縮合体のアクリル酸エステルまたはメタクリル酸
エステルを使用するか、または上記エステルと、
内部に少なくとも1個のアクリル基、メタクリル
基またはアリル基を含有するモノマあるいはオリ
ゴマあるいはそれらの混合物を使用してなること
を特徴とするものである。そして、これらバイン
ダ樹脂中に、金属粉、カーボンブラツク、グラフ
アイト等従来公知の導電性粉体を分散し、必要に
より溶媒を加えて製造したインキを基体上に塗布
し、必要により乾燥してのち電子線を照射するか
または放射型の加熱器により短時間加熱すること
により、極めて短時間で特性の優れた抵抗体を得
ることができる。Structure of the Invention The resistive ink composition according to the present invention uses an acrylic ester or methacrylic ester of a bisphenol A-formaldehyde condensate as a binder resin, or together with the above ester,
It is characterized by using a monomer or oligomer containing at least one acrylic group, methacrylic group, or allyl group, or a mixture thereof. Then, conventionally known conductive powder such as metal powder, carbon black, graphite, etc. is dispersed in these binder resins, and a solvent is added if necessary, and an ink prepared is applied onto the substrate, dried if necessary, and then By irradiating it with an electron beam or heating it for a short time using a radiation type heater, a resistor with excellent characteristics can be obtained in an extremely short time.
ここに述べるビスフエノールA―ホルムアルデ
ヒド縮合体とは、1モルのビスフエノールAと4
モルのホルムアルデヒドとをアルカリ触媒の存在
下で反応させたものであり、非アルコール性溶液
中でアクリル酸、メタクリル酸またはそれらの低
級アルコールエステルと反応させることによりエ
ステルを作ることができる。 The bisphenol A-formaldehyde condensate described here refers to 1 mole of bisphenol A and 4
It is a product obtained by reacting molar formaldehyde in the presence of an alkali catalyst, and esters can be produced by reacting with acrylic acid, methacrylic acid, or their lower alcohol esters in a non-alcoholic solution.
上記エステルと混合するモノマまたはオリゴマ
としては、内部に少なくとも1個のアクリル基、
メタクリル基またはアリル基を含有するものが使
用できる。これらモノマまたはオリゴマは単一で
も使用できるが、多くの場合、混合系で使用する
方が抵抗体特性のコントロールが容易である。こ
こに使用できるモノマまたはオリゴマの例として
は、アクリル酸メチル、アクリル酸エチル、アク
リル酸プロピル、アクリル酸ブチル、アクリル酸
ヒドロキシエチル、アクリル酸2―エチルヘキシ
ル、エチレングリコールジアクリレート、トリメ
チロールプロパントリアクリレート、ペンタエリ
スリトールトリアクリレート、各種エポキシアク
リレート、各種オリゴエステルアクリレート、各
種ウレタンアクリート等の第一または多価アルコ
ールのアクリルエステルまたはオリゴアクリレー
ト、メタクリル酸メチル、メタクリル酸エチル、
メタクリル酸プロピル、メタクリル酸ブチル、メ
タクリル酸ヒドロキシエチル、メタクリル酸2―
エチルヘキシル、ジエチレングリコールジメタク
リレート、トリメチロールプロパントリメタクリ
レート等の第一または多価アルコールのメタクリ
ルエステル、アリルアルコール、ジアリルエーテ
ル、ジアリルアジペート、ジアリルフタレート、
低分子量ポリウレタンの両末端アリレート等を挙
げることができる。 The monomer or oligomer to be mixed with the above ester contains at least one acrylic group,
Those containing methacrylic or allyl groups can be used. Although these monomers or oligomers can be used alone, in many cases, it is easier to control the resistor characteristics when used in a mixed system. Examples of monomers or oligomers that can be used here include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, hydroxyethyl acrylate, 2-ethylhexyl acrylate, ethylene glycol diacrylate, trimethylolpropane triacrylate, Acrylic esters or oligoacrylates of primary or polyhydric alcohols such as pentaerythritol triacrylate, various epoxy acrylates, various oligoester acrylates, various urethane acrylates, methyl methacrylate, ethyl methacrylate,
Propyl methacrylate, butyl methacrylate, hydroxyethyl methacrylate, methacrylic acid 2-
Methacrylic esters of primary or polyhydric alcohols such as ethylhexyl, diethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, allyl alcohol, diallyl ether, diallyl adipate, diallyl phthalate,
Examples include arylates at both ends of low molecular weight polyurethane.
ビスフエノールA―ホルムアルデヒド縮合体の
アクリル酸またはメタクリル酸エステル溶液と上
記モノマまたはオリゴマとの混合割合は抵抗体の
要求特性に応じて任意に選ぶことができる。 The mixing ratio of the acrylic acid or methacrylic acid ester solution of the bisphenol A-formaldehyde condensate and the above monomer or oligomer can be arbitrarily selected depending on the required characteristics of the resistor.
これら樹脂組成物中に分散させる導電性粉末と
しては、従来公知のものを使用することができ
る。例えば、銀、銅またはそれらの合金等の金属
粉末、金属酸化物粉末、金属炭化物粉末、金属窒
化物粉末、金属ホウ化物粉末、カーボンブラツ
ク、グラフアイトまたはこれらの混合物等を挙げ
ることができる。これら導電性粉末と上記バイン
ダ樹脂組成物との混合割合は従来公知の範囲で良
い。バインダ樹脂組成物と導電性粉末とは必要に
応じて溶媒を加えて公知の方法で混合、混練し、
基体上に塗布し、必要に応じて乾燥して後電子線
照射するかまたは塗布後直ちに放射型の加熱装置
で加熱して抵抗体を製造する。 As the conductive powder to be dispersed in these resin compositions, conventionally known conductive powders can be used. Examples include metal powders such as silver, copper, or alloys thereof, metal oxide powders, metal carbide powders, metal nitride powders, metal boride powders, carbon black, graphite, or mixtures thereof. The mixing ratio of these conductive powders and the binder resin composition may be within a conventionally known range. The binder resin composition and the conductive powder are mixed and kneaded by a known method, adding a solvent if necessary.
The resistor is manufactured by coating the substrate on a substrate, drying it if necessary, and then irradiating it with an electron beam, or heating it with a radiation-type heating device immediately after coating.
ここに得られた抵抗体は極めて硬いものであ
り、特に耐摩耗性を必要とされる可変抵抗器用の
抵抗体として好ましいものである。 The resistor obtained here is extremely hard and is particularly suitable as a resistor for a variable resistor that requires wear resistance.
実施例の説明 以下、実施例により本発明を説明する。Description of examples The present invention will be explained below with reference to Examples.
実施例 1
(a) ビスフエノールA―ホルムアルデヒド縮合体
アクリル酸エステル溶液
温度計、かきまぜ機、還流冷却器、滴下ロー
トを設けた4つ口フラスコにビスフエノール
A1モルと38%ホルマリン4.5モルを入れ、滴下
ロートより6Nカセーソーダ水溶液2.2モルを60
℃を越えないようにしながら滴下する。滴下終
了後、60±1℃で2時間反応させて後6N硫酸
水溶液で中和し、水洗後減圧濃縮してテトラメ
チロール化ビスフエノールAを主体とする85%
溶液を製造する。この溶液100重量部に対して
イソホロン50重量部を添加して後、減圧で残留
水分を除去する。次いで、4000ppmのヒドロキ
ノンを含有するアクリル酸70重量部およびp―
トルエンスルホン酸0.2重量部を添加し、80±
1℃で1時間反応して後、減圧で未反応のアク
リル酸を除去する。その後、エタノールを加え
て60%溶液とする。Example 1 (a) Bisphenol A-formaldehyde condensate acrylic ester solution Bisphenol was placed in a four-necked flask equipped with a thermometer, stirrer, reflux condenser, and dropping funnel.
Add 1 mol of A and 4.5 mol of 38% formalin, and add 2.2 mol of 6N caustic soda aqueous solution to 60 ml from the dropping funnel.
Add dropwise while making sure not to exceed ℃. After dropping, the reaction was carried out at 60±1°C for 2 hours, neutralized with 6N sulfuric acid aqueous solution, washed with water, and concentrated under reduced pressure to obtain 85% tetramethylolated bisphenol A.
Produce a solution. After adding 50 parts by weight of isophorone to 100 parts by weight of this solution, residual water is removed under reduced pressure. Then 70 parts by weight of acrylic acid containing 4000 ppm of hydroquinone and p-
Add 0.2 parts by weight of toluenesulfonic acid to 80±
After reacting at 1° C. for 1 hour, unreacted acrylic acid was removed under reduced pressure. Then, add ethanol to make a 60% solution.
(b) 抵抗インキ
上記溶液50g、カーボン微粉末15gおよびブ
チルカルビトール30gを混合し、三本ロールミ
ルで混練して抵抗インキを製造する。(b) Resistance ink 50 g of the above solution, 15 g of fine carbon powder, and 30 g of butyl carbitol are mixed and kneaded in a three-roll mill to produce a resistance ink.
(c) 抵抗体
上記抵抗インキを紙−フエノール樹脂基板上
に塗布、乾燥して後、165eVの電子線を
15Mrad照射して抵抗体を製造した。電子線照
射に要した時間は15cmの長さに対し0.1秒以下
であつた。ここに得られた抵抗体は、約0.5K
Ω/□の面積抵抗値を有し、8Hの鉛筆硬度を
有する硬いものであつた。この抵抗体は85℃耐
熱試験および60℃・95%耐湿試験1000時間後に
おいて、それぞれ−3.0%および1.0%の変化を
示すに止まつた。また、本抵抗体を可変抵抗器
に組み込み、摺動試験を行つた結果、3万回の
摺動後においても雑音その他に異常は認められ
なかつた。比較のため、熱硬化型の抵抗インキ
を使用した抵抗体の耐熱および耐湿試験をした
結果、それぞれ、−5.5%および2.5%の変化を
示した。(c) Resistor After coating the above resistance ink on a paper-phenol resin substrate and drying it, a 165eV electron beam was applied.
A resistor was manufactured by irradiating 15 Mrad. The time required for electron beam irradiation was less than 0.1 seconds for a length of 15 cm. The resistor obtained here is approximately 0.5K
It had a sheet resistance value of Ω/□ and was hard with a pencil hardness of 8H. This resistor showed only -3.0% and 1.0% changes after 1000 hours of 85°C heat resistance test and 60°C/95% humidity resistance test, respectively. Furthermore, when this resistor was incorporated into a variable resistor and a sliding test was performed, no noise or other abnormalities were observed even after 30,000 sliding operations. For comparison, a heat resistance test and a moisture resistance test of a resistor using thermosetting resistance ink showed changes of -5.5% and 2.5%, respectively.
実施例 2
実施例1において、アクリル酸70部に代えて35
重量部のメタクリル酸を使用し、残存モノマの除
去なしにて作つた抵抗体は0.7KΩ/□の面積抵
抗を有し、9H以上の鉛筆硬度を示し、耐熱、耐
湿試験においてそれぞれ−3.0%、1.0%の変化を
示した。Example 2 In Example 1, 35 parts of acrylic acid was replaced with 70 parts of acrylic acid.
A resistor made using parts by weight of methacrylic acid without removing residual monomers has a sheet resistance of 0.7KΩ/□, a pencil hardness of 9H or higher, and -3.0% and -3.0% in heat resistance and moisture resistance tests, respectively. It showed a change of 1.0%.
実施例 3
実施例1において、バインダ樹脂として、縮合
体のアクリル酸エステル溶液50gに加えてトリメ
チロールプロパントリメタクリレート3gおよび
エポキシアクリレート(大阪有機化学工業(株)製・
商品名ビスコート#540)30gを使用し、カーボ
ン微粉末量を30gとした場合に得られた抵抗体は
0.6KΩ/□の抵抗値で7Hの鉛筆硬度を示し、耐
熱および耐湿試験においてそれぞれ−9.5%およ
び−1.5%の変化を示した。Example 3 In Example 1, in addition to 50 g of the acrylic acid ester solution of the condensate, 3 g of trimethylolpropane trimethacrylate and epoxy acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) were used as the binder resin.
The resistor obtained when using 30g of product name Viscoat #540 and setting the amount of carbon fine powder to 30g is
It exhibited a pencil hardness of 7H with a resistance value of 0.6KΩ/□, and showed changes of -9.5% and -1.5% in the heat resistance and moisture resistance tests, respectively.
実施例 4
実施例3において、バインダ樹脂として縮合体
のアクリル酸エステル溶液50gに加えてオリゴエ
ステルアクリレート(東亜合成(株)製・商品名アロ
ニツクスM―8030)18gおよびヘキサンジオール
ジアクリレート6gを使用した場合に得られた抵
抗体は1KΩ/□の面積抵抗を有し、9Hの鉛筆硬
度を示し、耐熱、耐湿試験においてそれぞれ−
8.5%、2.5%の変化を示した。Example 4 In Example 3, in addition to 50 g of the acrylic ester solution of the condensate, 18 g of oligoester acrylate (manufactured by Toagosei Co., Ltd., trade name Aronix M-8030) and 6 g of hexanediol diacrylate were used as the binder resin. The resistor obtained in this case had a sheet resistance of 1KΩ/□, a pencil hardness of 9H, and - in heat resistance and moisture resistance tests, respectively.
It showed a change of 8.5% and 2.5%.
実施例 5
実施例1において、バインダ樹脂として縮合体
エステル溶液50gにジエチレングリコールジメタ
クリレート5gを添加した場合に得られた抵抗体
は0.5KΩ/□の面積抵抗値を有し、9H以上の鉛
筆硬度を示した。この抵抗体は耐熱および耐湿試
験においてそれぞれ−2.5%および1.5%の変化を
示した。Example 5 In Example 1, the resistor obtained when 5 g of diethylene glycol dimethacrylate was added to 50 g of the condensate ester solution as the binder resin had a sheet resistance value of 0.5 KΩ/□ and a pencil hardness of 9H or more. Indicated. This resistor showed changes of -2.5% and 1.5% in heat and humidity tests, respectively.
実施例 6
実施例3において、バインダ樹脂として縮合体
のアクリル酸エステル溶液50gに加えてジアリル
オルソフタレートプレポリマ20gおよびペンタエ
リスリトールトリアアクリレート10gを使用した
場合に得られた抵抗体は1KΩ/□の面積抵抗値
を有し、9H以上の鉛筆硬度を示した。この抵抗
体は耐熱および耐湿試験においてそれぞれ−8.0
%および1.5%の変化を示した。Example 6 In Example 3, when 20 g of diallyl orthophthalate prepolymer and 10 g of pentaerythritol triacrylate were used in addition to 50 g of the acrylic ester solution of the condensate as the binder resin, the resistor obtained had an area of 1 KΩ/□. It had a resistance value and showed a pencil hardness of 9H or higher. This resistor tested -8.0 in heat and humidity tests, respectively.
% and 1.5% change.
実施例 7
実施例1で得られた抵抗インキを紙―フエノー
ル基板上に塗布して後、直ちに1.8KWの出力を
有する遠赤外線放射型の加熱装置で60秒間加熱し
て抵抗体を製造した。加熱源と基板との距離は10
cmとした。ここに得られた抵抗体は0.6KΩ/□
の抵抗値を有し、9H以上の鉛筆硬度を示した。
この抵抗体は耐熱および耐湿試験においてそれぞ
れ−3.5%、1.2%の変化を示した。Example 7 The resistive ink obtained in Example 1 was coated on a paper-phenol substrate and immediately heated for 60 seconds using a far-infrared radiation heating device with an output of 1.8 KW to produce a resistor. The distance between the heating source and the substrate is 10
cm. The resistor obtained here is 0.6KΩ/□
It had a resistance value of 9H and a pencil hardness of 9H or higher.
This resistor showed changes of -3.5% and 1.2% in heat and humidity tests, respectively.
発明の効果
以上、実施例および比較例から判るように、本
発明にかかる抵抗インキは、電子線照射または放
射型加熱装置により極めて短時間の内に硬化して
従来の加熱硬化型の抵抗体に優る特性を示す抵抗
体を与えるものであり、産業上の効果は大なるも
のである。Effects of the Invention As can be seen from the Examples and Comparative Examples, the resistance ink according to the present invention can be cured within a very short time by electron beam irradiation or a radiation heating device, and can be cured into a conventional heat-curable resistor. This provides a resistor that exhibits excellent characteristics, and has great industrial effects.
Claims (1)
のアクリル酸エステル溶液またはメタクリル酸エ
ステル溶液と導電性微粉末とからなることを特徴
とする抵抗インキ組成物。 2 ビスフエノールA―ホルムアルデヒド縮合体
のアクリル酸エステルまたはメタクリル酸エステ
ルと、内部に少なくとも1個のアクリル基、メタ
クリル基またはアリル基を含有してなるモノマま
たはオリゴマあるいはそれらの混合物と、導電性
微粉末とからなることを特徴とする抵抗インキ組
成物。[Scope of Claims] 1. A resistive ink composition comprising an acrylic ester solution or methacrylic ester solution of a bisphenol A-formaldehyde condensate and conductive fine powder. 2. An acrylic ester or methacrylic ester of a bisphenol A-formaldehyde condensate, a monomer or oligomer containing at least one acrylic group, methacrylic group, or allyl group, or a mixture thereof, and a conductive fine powder. A resistance ink composition comprising:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111217A JPS603101A (en) | 1983-06-20 | 1983-06-20 | Resistance ink composition |
| US06/620,331 US4603162A (en) | 1983-06-17 | 1984-06-12 | Radiation curable resin, paint or ink vehicle composition comprising said resin and magnetic recording medium or resistor element using said resin |
| US06/735,110 US4610810A (en) | 1983-06-17 | 1985-05-17 | Radiation curable resin, paint or ink vehicle composition comprising said resin and magnetic recording medium or resistor element using said resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111217A JPS603101A (en) | 1983-06-20 | 1983-06-20 | Resistance ink composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603101A JPS603101A (en) | 1985-01-09 |
| JPH0129043B2 true JPH0129043B2 (en) | 1989-06-07 |
Family
ID=14555490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58111217A Granted JPS603101A (en) | 1983-06-17 | 1983-06-20 | Resistance ink composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603101A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH626388A5 (en) * | 1976-12-31 | 1981-11-13 | Alkor Gmbh | |
| US6995356B2 (en) | 2002-04-11 | 2006-02-07 | Agilent Technologies, Inc. | Optical encoder device |
-
1983
- 1983-06-20 JP JP58111217A patent/JPS603101A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS603101A (en) | 1985-01-09 |
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