JPH0573151B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-based resistor in which conductor powder such as carbon powder or metal powder is dispersed in an organic resin film, and a method for manufacturing the same.

[Conventional technology]

Resin-based resistors are broadly classified into solvent-type resin-based resistors and electron beam-curable resin-based resistors, depending on the type of organic resin constituting the organic resin film.

The former, that is, a solvent-based resin resistor, is
A resistive ink composition prepared by mixing conductive powder and a thermosetting resin is coated onto a substrate made of paperboard, phenol resin, etc., and cured by heating. This solvent-based resin-based resistor takes a long time to cure and also requires heating for curing, so the substrate material needs to be heat resistant.
Moreover, even if a heat-resistant substrate material is selected, there is still a drawback that the substrate tends to deteriorate during heat curing.

The latter, electron beam-curable resin-based resistors, were developed to eliminate these drawbacks of solvent-based resin-based resistors;
A resistive ink composition prepared by mixing conductive powder and resin-forming components such as electron beam curable oligomers and monomers is applied onto a substrate made of paperboard, phenolic resin, etc., and subjected to short-term electron irradiation. It is cured by electron beam.

[Problem that the invention seeks to solve]

Although this electron beam-curable resin resistor does not require a high-temperature, long-time heating process unlike a solvent-type resin resistor, it is unavoidable that it will be heated to some extent. Therefore, attempts have been made to use acrylic esters of polyhydric alcohols or methacrylic esters of polyhydric alcohols, which have excellent heat resistance, as binders, but in this case, the dispersibility of the conductive powder into the binder is poor. The drawback is that the surface properties of the resistive ink composition to which it is applied are inferior.

If oligoester acrylate or the like, which has excellent dispersibility, is used as a binder in order to overcome this drawback, the heat resistance will be insufficient and the performance of the completed resin-based resistor will be unbalanced.

In short, the dispersibility of the conductor powder and the surface characteristics of the coated surface are mutually exclusive with the characteristic imbalance of the heat-resistant resin-based resistor, and there is still room for improvement, and even better resins It has been desired to develop a system resistor and a method for manufacturing the same.

The purpose of the present invention is to meet the above-mentioned requirements.The dispersibility of the conductor powder is excellent, and therefore the surface properties of the applied surface are excellent.At the same time, the heat resistance is excellent, the properties are balanced, and the resistance is An object of the present invention is to provide an electron beam-curable resin resistor having many advantages such as less variation in value and high dielectric strength, and a method for manufacturing the same.

[Means for solving problems]

The means taken by the present invention to achieve the above first object are as follows: a conductive powder, an allicrylic acid ester or a methacrylic acid ester of a polyhydric alcohol having at least three hydroxyl groups in the molecule, and a phenol formaldehyde ester. A resistance ink composition produced by mixing and kneading a glycidyl ether derivative of a condensate or a glycidyl ether derivative of a cresol formaldehyde low condensate and an addition reaction product of acrylic acid or methacrylic acid,
The resistor obtained by electron beam curing is used as an element of a resin-based resistor.

The means taken by the present invention to achieve the above-mentioned second object is that, in order to manufacture a resin-based resistor, conductive powder and acrylic acid, a polyhydric alcohol having at least three hydroxyl groups in the molecule, are used. A resistive ink composition containing an ester or methacrylic acid ester and an addition reaction product of a glycidyl ether derivative of a phenol formaldehyde low condensate or a glycidyl ether derivative of a cresol formaldehyde low condensate with acrylic acid or methacrylic acid is applied on a substrate. The resistive ink composition coated on the substrate is cured by irradiating the resistive ink composition with an electron beam.

In other words, the gist of the present invention is to use (a) at least three or more acryloyl groups obtained by reacting a hydroxyl group of a trihydric or higher polyhydric alcohol with acrylic acid or methacrylic acid as a binder for a resistive ink composition; An addition reaction product of polyol poly(meth)acrylate having a methacryloyl group, (b) a glycidyl ether derivative of a phenol formaldehyde low condensate or a cresol formaldehyde low condensate, and acrylic acid or methacrylic acid (hereinafter referred to as novolac acrylate, etc.) (3) to use this mixture as a binder for a resistive ink composition.

<Polyol poly(meth)acrylate> As the polyol poly(meth)acrylate, a polyol poly(meth)acrylate having at least three acryloyl groups or methacryloyl groups in the molecule can be used. These polyol poly(meth)acrylates can be used alone or in a mixed yarn. Polyol poly(meth) that can be used for this
Examples of acrylates include (meth)acrylic acid ester of trimethylolpropane, alkylene oxide of trimethylolpropane (carbon number 2 -
4) (meth)acrylic ester of adduct, (meth)acrylic ester of tris((hydroxyethyl)isocyanurate, alkylene oxide (2 to 4 carbon atoms) adduct of tris(hydroxyethyl)isocyanurate (meth) ) Acrylic acid ester, (meth)acrylic acid ester of pentaerythritol, alkylene oxide (carbon number 2-4) adduct (meth) of pentaerythritol
Examples include acrylic esters, (meth)acrylic esters of dipentaerythritol, and (meth)acrylic esters of alkylene oxide (carbon atoms 2 to 4) adducts of dipentaerythritol.

Preferred polyol poly(meth)acrylates include poly(meth)acrylates of trimethylolpropane, pentaerythritol, and dipentaerythritol. These polyol poly(meth)acrylates are particularly suitable when a high-performance resistor paste with low temperature dependence of resistance value (the property that the resistance value changes with temperature) is required.

<Mixing ratio of polyol poly(meth)acrylate and novolatile acrylate, etc.> The mixing ratio of the above polyol poly(meth)acrylate and novolatile acrylate, etc. can be arbitrarily selected depending on the characteristics required of the resistor. However, in order to achieve a good balance between the resistance/temperature characteristics and surface smoothness of the resistor after curing, the mixing ratio (former/latter) of polyol poly(meth)acrylate and novolac acrylate, etc. should be adjusted by weight. A ratio of 500/500 to 999/1 is preferred.

As the polyol poly(meth)acrylate in the binder, low viscosity liquid polyol poly(meth)acrylate {(meth)acrylic ester of trimethylolpropane, alkylene oxide of trimethylolpropane (2 to 4 carbon atoms)
It is also possible to produce a solvent-free resistor paste by selecting the additive ((meth)acrylic ester, etc.).

On the other hand, the polyol poly(meth) in the binder
As acrylate, high viscosity liquid or solid polyol poly(meth)acrylate {(meth) of tris(hydroxyethyl)isocyanurate
Acrylic esters, (meth)acrylic esters of alkylene oxide (2 to 4 carbon atoms) adducts of tris(hydroxyethyl)isocyanurate, (meth)acrylic esters of pentaerythritol, alkylene oxides of pentaerythritol (2 to 4 carbon atoms) ~4) Select (meth)acrylic ester of adduct, (meth)acrylic ester of dipentaerythritol, (meth)acrylic ester of alkylene oxide (2 to 4 carbon atoms) adduct of dipentaerythritol, etc. In this case, the viscosity of the resistor paste becomes too high, so it is desirable to use butyl cellosolve, butyl carbitol, butyl cellosolve acetate, butyl carbitol acetate, etc. as a solvent.

However, when a solvent is used, after the resistive ink composition is screen printed on the substrate and before curing of the resistor by electron beam irradiation, the resistive ink composition is
Requires a step of drying the solvent for 30 minutes.

<Novolac Acrylate> Novolac acrylate and the like can be obtained by an addition reaction between a commercially available phenol (or cresol) novolac resin-modified glycidyl ether and (meth)acrylic acid.

Commercially available phenol novolac resin (or cresol novolac resin) modified glycidyl ethers include Epiclon N-665, N-690, N-
730, N-740, N-775 (manufactured by Dainippon Ink Chemical Co., Ltd.)
Ya, Epotote YDCN-701, YDCN-704,
YDCN-638 (manufactured by Toto Kasei Co., Ltd.), EOCN-102,
Examples include EOCN-104 (manufactured by Nippon Kayaku Co., Ltd.).

Since most of the above epoxy resins are solid at room temperature, it is preferable to carry out the addition reaction with acrylic acid in a solvent system. As a solvent, ketones such as methyl isobutyl ketone and methyl ethyl ketone,
Toluene, xylene, butyl acetate, ethyl acetate, etc., and mixtures thereof, which dissolve the epoxy resin, are used. The charging ratio of epoxy resin and (meth)acrylic acid is preferably 0.9 to 2.0 in molar ratio of epoxy group/carboxyl group.

The method of producing epoxy acrylate by reacting an epoxy resin with (meth)acrylic acid is known, such as Japanese Patent Publication No. 44-31472, Japanese Patent Publication No. 45-40069,
The method described in Japanese Patent Publication No. 56-4565 is used.

Although the reaction can be carried out without a catalyst, it is advantageous to use a catalyst because the reaction time can be shortened and the reaction temperature can be lowered.

As catalysts, Lewis acids such as BF ₃ and etherite, quaternary ammonium salts such as tetrabutylammonium chloride, triethylbenzyl, ammonium bromide, and choline chloride are used.
The amount of catalyst added is 0.1 to 10%, more preferably 0.5 to 10%.
It is 5%.

The reaction temperature is preferably 50-200°C, more preferably 70-150°C.

<Conductor Powder> As the conductor powder to be dispersed in these resin compositions, conventionally known ones can be used. Examples include metal powders such as silver, copper, or alloys thereof, metal oxide powders, metal nitride powders, metal carbide powders, metal boride powders, metal silicide powders, various carbon blacks, graphite, or mixtures thereof. I can do it.

<Mixing ratio of conductor powder and binder composition> The mixing ratio of these conductor powders and the binder composition may be within a conventionally known range. The binder composition and the conductive powder are mixed and kneaded by a known method, adding a solvent if necessary, and applied onto the substrate.
If necessary, after drying, it is irradiated with an electron beam of 0.1 to 50 Mrad to form a resistor.

<Heat treatment after electron beam irradiation> Depending on the type of resistor cured by electron beam irradiation, the resistance value may fluctuate slightly for about 48 hours after curing. If this fluctuation becomes a problem, the resistance value can be quickly stabilized by heat treatment at 100° C. to 200° C. for 3 minutes to 30 minutes.

<Providing moisture resistance> Normally, it is not necessary to add non-conductive inorganic filler to the resistor obtained here, but if a high degree of moisture resistance is required for a particularly high resistance resistor, colloid silica, fused silica,
A high degree of moisture resistance can be imparted by using a non-conductive inorganic filler such as alumina powder, talc powder, mica powder, or iron oxide powder.
Examples of the filler include Micro Ace K-1 manufactured by Nippon Talc Co., Ltd., Fuzurex E-2, Fuzurex X, and Fuzurex available from Ryumori Co., Ltd.
RD-8, Aerosil R- manufactured by Nippon Aerosil Co., Ltd.
Commercial products such as 972, Aerosil 300, etc. can be suitably used, but non-conductive inorganic fillers other than these may be used alone or in combination. With the addition of non-conductive inorganic fillers, especially in high resistance
The change in resistance value when left in a constant temperature and humidity chamber for 240 hours is suppressed to about 1/2.

<Abrasion Resistance> The resistor obtained here has excellent abrasion resistance, and is particularly preferred as a resistor for a variable resistor that requires this.

[Effect]

Mainly, polyol poly(meth)acrylate increases the crosslinking density of the binder and imparts heat resistance, but if the binder is made entirely of polyol poly(meth)acrylate, it has poor dispersibility in conductive fine powder. As a result, the surface of the manufactured resistor becomes uneven.

Furthermore, since the resistive ink composition adheres to the stage, it becomes difficult to repeatedly print using a screen printing method, and the resistance value of the resistor produced in this way is not stable and varies widely.

On the other hand, novolac acrylate etc. can provide the binder with dispersibility for conductive fine powder, but if the binder is made entirely of novolac acrylate etc., the heat resistance will be poor and the conductivity will deteriorate. or

Therefore, as a result of intensive study on the above-mentioned problems, the present inventors were able to solve the above-mentioned problems by using both polyol poly(meth)acrylate and novolac acrylate in combination. .

Metal powder, carbon black,
A resistive ink composition prepared by dispersing conventionally known conductive fine powder such as graphite and adding a solvent if necessary is applied onto a substrate by screen printing, dried if necessary, and then irradiated with an electron beam. By doing so, as seen in the examples, a resistor with excellent characteristics can be obtained in an extremely short period of time.

〔Example〕

This will be explained below using specific examples.

Reference example 1 <Synthesis method of phenol novolac epoxy resin acrylic acid adduct> Epotote YDPN-638 manufactured by Toto Kasei Co., Ltd. (phenol novolac resin: epoxy equivalent 180 g/eq)
After mixing 180 g and 200 g of toluene, a solution containing 1 g of tetrabutylammonium bromide as a catalyst was placed in a three-necked flask, and while stirring at 95°C, 72 g of acrylic acid was added dropwise from the dropping funnel over 1 hour. The reaction was continued for about 10 hours until it was confirmed by neutralization titration that the acrylic acid had reacted sufficiently. After removing the catalyst, tetrabutylammonium bromide, by washing with water, toluene was distilled off to synthesize a phenol novolac epoxy resin acrylic acid adduct solution with a solid content of 75 wt%.

Reference example 2 <Synthesis method of cresol novolac epoxy resin acrylic acid adduct> Epotote YDCN-701 manufactured by Toto Kasei Co., Ltd. (cresol novolac resin: epoxy equivalent 200 g/eq)
After mixing 220 g and 200 g of toluene, a solution of 1 g of tetrabutylammonium bromide as a catalyst was placed in a three-necked flask, and while stirring at 95°C, 72 g of acrylic acid was added dropwise from the dropping funnel over 1 hour. The reaction was continued for about 10 hours until it was confirmed by neutralization titration that the acrylic acid had reacted sufficiently. After removing the catalyst, tetrabutylammonium bromide, by washing with water, the triene was distilled off to synthesize a cresol novolac epoxy resin acrylic acid adduct solution with a solid content of 75 wt%.

Reference Example 3 <Synthesis method of phenol novolac epoxy resin acrylic acid adduct> Epiclon N-740 manufactured by Dainippon Ink Chemical Co., Ltd. (phenol novolac resin: epoxy equivalent 185 g/
eq) After mixing 185g and 200g of toluene, add 1g of tetrabutylammonium bromide as a catalyst.
The added solution was placed in a three-necked flask, and while stirring at 95°C, 72 g of acrylic acid was added dropwise from the dropping funnel over 1 hour. Allowed time to react. After removing the catalyst, tetrabutylammonium bromide, by washing with water, toluene was distilled off to synthesize a phenol novolac epoxy resin acrylic acid adduct solution with a solid content of 75 wt%.

Example 1 Dipentaerythritol hexaacrylate (Aronix M-400 manufactured by Toagosei Kagaku Kogyo Co., Ltd.) 17
4 g of the phenol novolac epoxy resin acrylic acid adduct synthesized in Example 1, 5 g of carbon powder, and 10 g of butyl cellosolve were mixed and kneaded in a three-rule mill to prepare a resistance ink composition. This resistive ink composition was screen printed on a paper-phenolic resin substrate and heated at 150°C.
After drying for 5 minutes, a resistor was manufactured by irradiating the resistor with an electron beam of 10 Mrad at an acceleration voltage of 165 KeV. 15cm
The time required to irradiate the length was 0.05 seconds.

The resistor obtained here had a sheet resistance of 19KΩ/□, and its surface was smooth. In addition, 40
℃, 95% humidity test and 70°C heat resistance test for 1000 hours, changes were 2% and -2%, respectively. For comparison, the currently used thermosetting resistor paste (using phenolic resin)
A similar test showed changes of 5.5% and -4.5%, respectively.

Example 2 Dipentaerythritol hexaacrylate (Aronix M-400 manufactured by Toagosei Kagaku Kogyo Co., Ltd.) 10
13.3 g of the phenol novolac epoxy resin acrylic acid adduct synthesized in (Reference Example 1), 5 g of carbon powder, and 10 g of butyl cellosolve were mixed and kneaded in a three-roll mill to prepare a resistance ink composition. This resistance ink composition is applied to paper.
Screen printed on phenolic resin substrate, 150
After drying at ℃ for 5 minutes, a resistor was manufactured by irradiating 10 Mrad of electron beam with an acceleration voltage of 165 KeV.

The resistor obtained here had a sheet resistance of 590KΩ/□, and its surface was smooth. 40 more
℃, 95% humidity test and 70°C heat resistance test for 1000 hours, the change was only 5% and -5%, respectively.

Example 3 Acrylic acid ester of trimethylolpropane (Aronix M-309 manufactured by Toagosei Chemical Industry Co., Ltd.) 17
4 g of the cresol novolac epoxy resin acrylic acid adduct synthesized in (Reference Example 2) and 5 g of carbon powder were kneaded in a three-roll mill to prepare a resistance ink composition. This resistance ink composition is applied to paper.
After screen printing on the phenolic resin substrate,
By irradiating 10Mrad with an electron beam at an acceleration voltage of 165KeV,
A resistor was manufactured using a solvent-free system.

The resistor obtained here had a sheet resistance of 10KΩ/□, and its surface was smooth. 40 more
C., 95% humidity test and 70.degree. C. heat resistance test for 1000 hours, the change was only 1.5% and -2%, respectively.

Example 4 Acrylic acid ester of ethylene oxide adduct of trimethylolpropane (Toagosei Chemical Industry Co., Ltd.)
After mixing 17 g of Aronix M-310), 4 g of the cresol novolac epoxy resin acrylic acid adduct synthesized in Reference Example 2, and 5 g of carbon powder, the mixture was kneaded in a three-roll mill to prepare a resistance ink composition. After screen printing this resistive ink composition onto a paper-phenolic resin substrate,
By irradiating 10Mrad with an electron beam of 165KeV acceleration voltage,
A resistor was manufactured using a solvent-free system.

The resistor obtained here had a sheet resistance of 10KΩ/□, and its surface was smooth. 40 more
C, 95% humidity test and 70°C heat resistance test for 1000 hours, the change was only 2.0% and -2.6%, respectively.

Example 5 17 g of acrylic acid ester of tris(hydroxyethyl)isocyanurate (Aronix M-315 manufactured by Toagosei Kagaku Kogyo Co., Ltd.), 4 g of the phenol novolac epoxy resin acrylic acid adduct synthesized in (Reference Example 3), carbon After mixing 5 g of powder and 10 g of butyl cellosolve, the mixture was kneaded in a three-roll mill to prepare a resistance ink composition. This resistive ink composition was screen printed on a paper-phenolic resin substrate, dried at 150°C for 5 minutes, and then 165KeV
A resistor was manufactured in a solvent-free system by irradiating the electron beam with an acceleration voltage of 10 Mrad.

The resistor obtained here had a sheet resistance of 14KΩ/□, and its surface was smooth. 40 more
C., 95% humidity test and 70.degree. C. heat resistance test for 1000 hours, the change was only 3% and -3%, respectively.

Example 6 Acrylic acid ester of tris(hydroxyethyl)isocyanurate (Aronix M-315 manufactured by Toagosei Chemical Industry Co., Ltd.) 8.5%, triacrylate of trimethylolpropane (Aronix M-309 manufactured by Toagosei Chemical Industry Co., Ltd.) ), 4 g of the phenol novolac epoxy resin acrylic acid adduct synthesized in (Reference Example 1), 5 g of carbon powder, and 5 g of butyl cellosolve were mixed and kneaded in a three-roll mill to prepare a resistance ink composition. This resistive ink composition was screen printed on a paper-phenolic resin substrate, dried at 150°C for 5 minutes, and then
By irradiating 10Mrad with an electron beam of 165KeV acceleration voltage,
A resistor was manufactured using a solvent-free system.

The resistor thus obtained had a sheet resistance of 12KΩ/□, and its surface was smooth. In addition, 40
C., 95% humidity test and 70.degree. C. heat resistance test for 1000 hours, the change was only 3% and -2%, respectively.

Example 7 In Example 1, when a 1:1 mixture of graphite powder and carbon powder with an average particle size of 5 μm was used instead of carbon powder, the area resistance
A resistor of 6KΩ/□ was obtained.

Example 8 In Example 1, when 20 g of tin dioxide powder with an average particle size of 0.2 μm was used in place of the carbon powder, a resistor with a sheet resistance of 45 KΩ/□ was obtained.

Example 9 In Example 1, when 80 g of silver powder with an average particle size of 1 μm was used in place of the carbon powder, a resistor with an area resistance of 0.13 Ω/□ was obtained.

Example 10 Using the printed resistor manufactured in Example 1 as is, a precision potentiometer was made using a wire brush, and its sliding life was measured.
It was able to withstand 15 million sliding movements.

Incidentally, the sliding life of currently used precision potentiometers using thermosetting resistors is about 10 million times.

Comparative Example 1 Dipentaerythritol hexaacrylate (Aronix M-400 manufactured by Toagosei Chemical Industry Co., Ltd.) 20
g, 5 g of carbon powder, and 7 g of butyl cellosolve were mixed, and then kneaded in a three-roll mill,
A resistive ink composition was created. This resistive ink composition was screen printed on a paper-phenol resin substrate, dried at 150° C. for 5 minutes, and then irradiated with an electron beam of 10 Mrad at an acceleration voltage of 165 KeV to produce a resistor.

The resistor obtained here has a sheet resistance of 1.7KΩ/□, and a resistance of 1.2% and -0.7% in a 95% humidity test at 40°C and a 1000-hour humidity test at 70°C, respectively.
showed a change in However, the surface was extremely rough, with textured irregularities originating from the screen.

Comparative Example 2 After mixing 26.7 g of phenol novolac epoxy resin acrylic acid adduct (synthesized product of Example 1), 5 g of carbon powder, and 18 g of butyl cellosolve, the mixture was kneaded in a three-roll mill to create a resistance ink composition. . This resistive ink composition was screen printed on a paper-phenol resin substrate, dried at 150° C. for 5 minutes, and then irradiated with 10 Mrad of electron beam at an acceleration voltage of 165 KeV to produce a resistor.

The resistor obtained here had a sheet resistance of 18KΩ/□, and showed a change of 34% and -74% in a 40°C, 95% humidity test and a 70°C heat resistance test for 1000 hours, respectively.

Comparative Example 3 Polyurethane acrylate (Osaka Organic Chemical Industry)
Viscoat Co., Ltd. #823) 56g, epoxy acrylate (Osaka Organic Chemical Industry Co., Ltd. Viscoat #540)
A printed resistor was created using a resistor paste prepared by mixing 25 g of trimethylolpropane trimethacrylate, 5 g of carbon powder, and 40 g of cyclohexanol and kneading it in a three-roll mill. A precision potentiometer made using this texture had a very large output fluctuation during sliding.

〔Effect of the invention〕

As explained above, the present invention comprises (a) a polyol poly(meth)acrylate obtained by reacting the hydroxyl group of a polyhydric alcohol with at least three or more acrylic or methacryl groups, and (b) a phenol formaldehyde low condensation product. or a glycidyl ether derivative of a cresol formaldehyde low condensate and an addition reaction product of acrylic acid or methacrylic acid to produce a mixture, and (c) use this mixture as a binder for a resistive ink composition. (d) According to the first invention, the conductive powder has excellent dispersibility, and therefore the surface properties of the applied surface are excellent, and the heat resistance is also excellent; It is possible to provide a resin-based resistor that has little variation in resistance value, large dielectric strength, good heat resistance and moisture resistance, and has a good overall balance of characteristics; Therefore, since the conductive powder has excellent dispersibility and the surface properties of the applied surface are excellent, it is easy to manufacture using a screen printing method, etc., and therefore there is little variation, making it possible to It can be cured easily, reliably, and in a short time at a lower temperature than the wire-curing type, and the resulting resistor has excellent heat resistance, so it can be cured with high efficiency by short-time electron beam irradiation. It is possible to provide a method for manufacturing a resin-based resistor that can manufacture a resin-based resistor.

Claims (1)

[Scope of Claims] 1. A conductive powder, an acrylic ester or methacrylic ester of a polyhydric alcohol having at least three hydroxyl groups in the molecule, and a glycidyl ether derivative of a phenol formaldehyde low condensate or a cresol formaldehyde low condensate. A resin-based resistor comprising, as a resistor element, an electron beam irradiation cured product of a resistive ink composition containing an addition reaction product of a glycidyl ether derivative and acrylic acid or methacrylic acid. 2 The acrylic ester or methacrylic ester of polyhydric alcohol having at least three hydroxyl groups in the molecule is trimethylolpropane, alkylene oxide (carbon number 2 to 4) adduct of trimethylolpropane, tris(hydroxyethyl) Isocyanurate, alkylene oxide (2 to 4 carbon atoms) adduct of tris(hydroxyethyl)isocyanurate, pentaerythritol, alkylene oxide (2 to 4 carbon number) adduct of pentaerythritol, dipentaerythritol, and dipentaerythritol alkylene oxide (carbon number 2
-4) The resin-based resistor according to claim 1, which is selected from the group consisting of acrylic esters or methacrylic esters of polyhydric alcohols selected from adducts. 3 Acrylic ester or methacrylic ester of a polyhydric alcohol having at least three hydroxyl groups in the molecule, the glycidyl ether derivative of the phenol formaldehyde low condensate or the glycidyl ether derivative of the cresol formaldehyde low condensate, and acrylic acid or methacrylic acid. The resin resistor according to claim 1 or 2, wherein the mixing weight ratio of the addition reaction product with the acid is in the range of 500/500 to 999/1. 4. The conductor powder is a powder of silver, copper or an alloy thereof, a metal oxide powder, a metal nitride powder, a metal carbide powder, a metal boride powder, a metal silicide powder, or The resin-based resistor according to claim 1, 2 or 3, which is carbon or graphite powder, or a mixture thereof. 5 Conductor powder, acrylic ester or methacrylic ester of polyhydric alcohol having at least three hydroxyl groups in the molecule, glycidyl ether derivative of phenol formaldehyde low condensate or glycidyl ether derivative of cresol formaldehyde low condensate, and acrylic. A resistive ink composition containing an acid or an addition reaction product with methacrylic acid is applied onto a substrate, and the resistive ink composition applied onto the substrate is irradiated with an electron beam to be cured. A method for manufacturing a resin-based resistor. 6 The acrylic ester or methacrylic ester of polyhydric alcohol having at least three hydroxyl groups in the molecule is trimethylolpropane, alkylene oxide (carbon number 2 to 4) adduct of trimethylolpropane, tris(hydroxyethyl) Isocyanurate, alkylene oxide (2 to 4 carbon atoms) adduct of tris(hydroxyethyl)isocyanurate, pentaerythritol, alkylene oxide (2 to 4 carbon number) adduct of pentaerythritol, dipentaerythritol, and dipentaerythritol alkylene oxide (carbon number 2
-4) The method for producing a resin resistor according to claim 5, wherein the resin-based resistor is selected from the group consisting of acrylic esters or methacrylic esters of polyhydric alcohols selected from adducts. 7 Acrylic ester or methacrylic ester of a polyhydric alcohol having at least three hydroxyl groups in the molecule, the glycidyl ether derivative of the phenol formaldehyde low condensate or the glycidyl ether derivative of the cresol formaldehyde low condensate, and acrylic acid or methacrylic acid. The method for manufacturing a resin-based resistor according to claim 5 or 6, wherein the mixing weight ratio of the addition reaction product with the acid is in the range of 500/500 to 999/1. 8. The conductor powder is a powder of silver, copper or an alloy thereof, a metal oxide powder, a metal nitride powder, a metal carbide powder, a metal boride powder, a metal silicide powder, or The method for manufacturing a resin-based resistor according to claim 5, 6, or 7, wherein the material is carbon or graphite powder, or a mixture thereof. 9. The method for manufacturing a resin-based resistor according to claim 5, 6, 7, or 8, wherein a solvent is mixed into the resistance ink composition. 10 The intensity of the electron beam irradiation is 0.1 to 50 Mrad. Claims 5, 6, 7, and 8
9. A method for manufacturing a resin-based resistor according to item 9. 11 After the completion of the above process, for 3 to 30 minutes, 100 to 200
Claims 5, 6, 7, and 8 include a step of heat treatment at ℃.
A method for manufacturing a resin-based resistor according to item 1, 9 or 10.