JPH01291405A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To manufacture electronic components free from printing failure, maintaining sufficient mechanical strength of a printing cover mask, by using a mask with through holes whose entrance side aperture diameter is larger than the exit side aperture diameter, as a printing cover mask. CONSTITUTION:The entrance side aperture sections 24 of through holes 20 are made in the first uniform aperture-diameter from the entrance sides to the middle sections, and the exit side aperture sections 26 are also uniform in diameter from the middle sections to the exist sides. Besides, the aperture sections 26 are made in the second aperture diameter, larger than the first aperture diameter. Accordingly, when a component-mark is printed using the printing cover mask 22 with through holes 20 cut in a larger aperture shape, the transfer surface 12 of a printing pad 10 can be pushed into a through hole sufficiently deeply. As the result, the transfer surface 12 is pressed onto the component-mark indicating region surface 16 of an electronic component 14 with sufficient strength, and a good component-mark can be printed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention is characterized in that, because the shape of the electronic component is small, such as a chip type electronic component, the display area of the component mark such as the type, characteristics, quality, etc. The present invention relates to a method of manufacturing an electronic component in which a printing pad is used to print a component mark on the display area of the electronic component, which is extremely limited.

(Prior Art) FIGS. 5 and 6 are diagrams for explaining a conventional method of manufacturing electronic components. In this conventional electronic component manufacturing method, first, as shown in FIG. 5, a printing plate 4 is set on a printing table 2.

Printing ink S-
i? Fill. Next, after pressing the transfer surface 12 of the printing pad 10 against the grooves 6 on the surface of the printing plate 4 in the direction of the downward arrow in the figure, the printing pad 10 is pressed in the direction of the upward arrow in the figure and the printing plate Move away from 4. As a result, the printing ink 8 within the grooves 6 is transferred to the transfer surface 12 of the printing pad 10.

In this way, the printing pad 10 with the printing ink 8 transferred to the transfer surface 12 is used to transfer the transfer surface 12 to the component mark on the surface of the electronic component I4 placed on the printing table 2, as shown in FIG. Press it toward the display area surface 16 (in the direction of the downward arrow in the figure). As a result, the component mark display area surface on the surface of electronic component i4! The printing of the part mark for 6 is completed.

By the way, the following problems are pointed out in the conventional manufacturing method described above. In other words, according to this manufacturing method, the electronic component is not a relatively large one as shown in FIG. teeth,
Since the area of the display area of the component mark becomes extremely small, printing ink and oil components from the printing pad tend to adhere to the external electrode during the above-mentioned transfer, and as a result of this adhesion, the external electrode Soldering when soldering to the wiring pattern of a printed circuit board is likely to cause defects.

Another problem is that because of the light weight, electronic components tend to stick to the transfer surface of the printing pad during the above-mentioned transfer.

As another conventional technique for solving such problems, as shown in FIGS. 7 and 8 (an enlarged cross-sectional view of the main part of FIG. Electronic parts! 4... and the printing pad 10, a printing cover mask 22 having a plurality of through holes 20 corresponding to the number of the electronic components 14... is arranged, and in the arranged state, the through holes 20... Transfer surface 1 of printing pad IO through holes 20...
2 and the component mark display area surface 16 on each surface of the electronic component 14 are arranged to face each other.

Then, in the facing state, the printing pad 10 is inserted through the entrance side opening 24 of each through hole 20, and the transfer surface 12 is exposed from the exit side opening 26, and the exposed transfer surface 2 Parts mark display area surface I6
By pressing the printing ink on the transfer surface 12 onto the parts mark display area surface! I am trying to retransfer it to 6.

(Problems to be Solved by the Invention) However, in the conventional technology shown in FIGS. 7 and 8, as the size of the chip-type electronic component 14 becomes further smaller, the following problems occur. A new point was made.

That is, as the size of the electronic component 14 becomes smaller, the area of the component mark display area surface 16 also becomes smaller (but then, inevitably, the opening diameter of the through hole 20 of the print cover mask 22 also becomes smaller. However, when the opening diameter of the through hole 20 becomes smaller, when the printing pad 10 is inserted through the entrance side opening 24 of the through hole 20, the transfer surface 12 becomes smaller as shown in FIG. As a result, the transfer surface 12 is not exposed from the exit side opening 26 toward the component mark display area surface 16 of the electronic component 14. In such an exposed state, as shown in FIG. As is clear from the above, the transfer surface 12 cannot be sufficiently pressed against the component mark display area surface 16, resulting in printing defects such as so-called printing defects.

Therefore, in order to eliminate such defects, the through hole 20
or increase the opening diameter of the printed cover mask 22.
However, the opening diameter of the through hole is determined by the area of the component mark display area surface 16 of the electronic component 14 and cannot be made arbitrarily large. Decreasing the thickness poses a problem in that the mechanical strength of the printed cover mask 22 is reduced.

The present invention has been made in view of the above-mentioned problems, and when printing a required part mark on the parts mark display area surface of a small and lightweight electronic component using a printed cover mask, the mechanical strength of the printed cover mask is improved. It is an object of the present invention to provide a method for manufacturing an electronic component that can be sufficiently held and does not cause printing defects such as missing characters.

(Means for Solving the Problems) In order to solve such problems, the present invention provides a through hole between a printing pad on which printing ink is transferred to a transfer surface and a part mark display area surface of an electronic component. In the arranged state, the printing pad is inserted through the entrance side opening of the through-hole of the printing cover mask, and its transfer surface is exposed from the exit side opening. In the method for manufacturing an electronic component, in which printing ink on the transfer surface is retransferred to the display area surface by pressing the transfer surface against the component mark display area surface, the printing ink on the entrance side of the through hole is used as the print cover mask. It is characterized in that the opening diameter of the opening is larger than the opening diameter of the outlet side opening.

(Function) According to the above configuration, the opening diameter of the entrance side opening of the through hole in the printing cover mask is larger than that of the exit side opening, so the printing plate can fully enter the through hole of the printing cover mask. As a result, the part mark can be printed by pressing the printing plate against the part mark display area surface of the electronic part with the transfer surface of the printing plate exposed from the exit side opening.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view for explaining a method of manufacturing an electronic component according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a main part of the printed cover mask shown in FIG. 1.

In these figures, the same reference numerals as those shown in FIGS. 5 to 8 according to the conventional example indicate parts, parts, etc. that are the same as or equivalent to those indicated by the reference numerals, unless otherwise specified. There is.

First, the manufacturing method of this embodiment is basically the same as that of the conventional example except for the printed cover mask. In other words, a printing cover mask with through holes is placed between the printing pad, which has transferred the printing ink on the surface of the printing plate to its transfer surface, and the part mark display area surface of the electronic component. Inserting the printing pad through the entrance side opening of the through-hole and exposing the transfer material from the exit side opening thereof, and pressing the exposed transfer surface against the surface of the part mark display area, so that the printing pad is placed on the transfer surface. The process of retransferring the printing ink to the display area is the same in this embodiment as in the conventional example.

This embodiment differs from the conventional example in the following points.

That is, in this embodiment, the printing cover mask 22 used is one in which the opening shape of the through hole 20 is such that the opening diameter of the entrance side opening 24 is larger than that of the exit side opening 26. That is, as is clear from FIG. 2, which is an enlarged cross-sectional view of the main part of the printed cover mask 22 shown in FIG. is formed to have a uniform first opening diameter, and the exit side opening 26 is uniform from the middle part to the exit side and is formed to have a second opening diameter larger than the first opening diameter. It is what was done.

Therefore, when a part mark is printed using the printing cover mask 22 in which the through-hole 20 is formed in such an opening shape, the transfer surface 12 of the printing pad 10 is Through hole 20 of printing cover mask 22
As a result, the transfer surface 12 can be pressed against the component mark display area surface 16 of the electronic component 14 with sufficient strength, and a good component mark can be printed.

FIG. 4(a) and FIG. 4(b) are diagrams showing respective modified examples of the print cover mask 22. FIG.

In the printed cover mask 22 shown in FIG. 4(a), the opening shape of the through hole 20 is formed in a straight taper shape from the entrance side opening 24 to the exit side opening 26.

In the print cover mask 22 shown in FIG. 4(b), the through hole 20 is formed in a curved tapered shape from the entrance side opening 25 to the exit side opening 26.

Note that the planar shape of the through hole 20 of the print cover mask 22 described in the above embodiment can be various shapes such as a circle, an ellipse, a rectangle, and a square. In short, it is sufficient that the opening diameter of the entrance side opening of the through hole is larger than that of the exit side opening.

(Effects of the Invention) As is clear from the above explanation, according to the present invention,
When printing a required part mark on the part mark display area surface of a small and lightweight electronic component using a print cover mask, the mechanical strength of the print cover mask can be maintained sufficiently, but there may be problems such as print chips etc. It is possible to provide a method for manufacturing electronic components that does not cause defects.

[Brief explanation of the drawing]

1 to 4 are diagrams for explaining a method of manufacturing an electronic component according to an embodiment of the present invention, FIG. 1 is a sectional view for explaining the entire manufacturing method, and FIG. FIG. 3 is an enlarged sectional view of the main part of the printing cover mask shown in FIG. 1, and FIG. ) and the fourth
Figure (b) is an enlarged sectional view of a main part showing another modification of the printed cover mask. 5 to 8 relate to a conventional method for manufacturing electronic components, FIG. 5 is a cross-sectional view for explaining the case where printing ink on the surface of a printing plate is transferred to the transfer surface of a printing pad, and FIG. The figure provides an explanation of re-transferring printing ink onto the part mark display area surface of an electronic component using the transferred printing pad, and FIG. FIG. 8 is an enlarged sectional view of the main part of FIG. 7. 4...Printing plate, 8...Printing ink, IO...Printing pad, 12...Transfer surface,! 4...Electronic parts, 16
... Parts mark display area surface, 20 ... Through hole, 22
...Printed cover mask, 24...Entrance side opening,
26...Exit side opening.

Claims (1)

[Claims] (1) A printing cover mask having a through hole is arranged between the printing pad on which the printing ink is transferred to the transfer surface and the part mark display area surface of the electronic component, and in the above arrangement state, the printing pad is transferred to the printing pad. The printing on the transfer surface is inserted through the entrance side opening of the through hole of the cover mask, and the transfer surface is exposed from the exit side opening, and the exposed transfer surface is pressed against the part mark display area surface. In the method of manufacturing an electronic component in which ink is retransferred onto the surface of the display area, the printed cover mask has an opening diameter of the entrance side opening of the through hole larger than an opening diameter of the exit side opening thereof. A method of manufacturing an electronic component, characterized by: