JPH03104149A - Semiconductor package - Google Patents

Abstract

PURPOSE:To facilitate registration at the time of mounting on a printed board, by arranging register pins at positions separated from leads a specified distance apart, which leads are positioned at two diagonal corners of leads arranged in a matrix type. CONSTITUTION:Many pin leads 2 connecting electrodes of a semiconductor chip with the outside are arranged in a matrix type on the lower surface of a package main body 1. Register pins 3 longer than the leads 2 are arranged at four corners of the leads 2, so as to have the same pitch as the pitch P of the leads 2 on the diagonal corners. The positions of the lead pins 3 have the same pitch as the leads 2, but the pins 3 have no adjacent pins, so that the pin 3 is positioned from the nearest lead 2 2<1/2>XP apart. Positioning through holes for mounting can be arranged with the above pitch, so that the pins 3 are inserted into the through holes and the registration to the printed board is facilitated at the time of mounting on a printed board.

Description

[Detailed Description of the Invention] [Summary] Regarding a surface-mounted pin grid array package for a semiconductor device, a large number of pin-like leads are arranged in a predetermined position on the back surface of the package in order to facilitate alignment during surface mounting. In a surface mount type pin grid array package arranged in a matrix with a pitch, at least two diagonal corners of the four corners of the leads arranged in the matrix are spaced apart from the leads by a distance longer than the predetermined pitch. A positioning pin having a longer length than the lead is provided at the position shown in FIG.

[Industrial application field]

The present invention relates to a surface-mounted pin grid array package for semiconductor devices.

[Conventional technology]

FIG. 4 is a diagram showing an example of a conventional pin grid array package. This is the package body 1 of Serakutsuku etc.
A semiconductor chip is housed in the package body I, and a large number of pin-shaped glues 2 are arranged in a matrix on the lower surface of the package body I as terminals for connecting the electric shuttle of the semiconductor chip to the outside. .

[Problems to be Solved by the Invention] In the conventional pin grid array package as described above, all the leads are the same length and are surface mounted, so when mounting the package on a printed board, the package must be mounted on a gauge plate. It was necessary to use an image processing device to guide the image, or to perform alignment using an image processing device.

However, the method using a gauge plate has a problem in that when the package body is made of ceramic, the dimensional accuracy of the outer shape is poor, resulting in poor positioning accuracy, and the method using an image processing device increases the number of man-hours.

SUMMARY OF THE INVENTION In view of the above conventional problems, it is an object of the present invention to provide a semiconductor package that is easy to align when mounted on a printed board.

[Means for Solving the Problems] In order to achieve the above object, the semiconductor device of the present invention uses a surface-mounted pin grid array in which a large number of pin-shaped leads are arranged in a matrix at a predetermined pitch on the back surface of the package. In the package, at least two diagonal corners of the four corners of the leads 2 arranged in a matrix are located at positions spaced apart from the leads 2 by a distance longer than a predetermined pitch. It is characterized by having a pin 3.

[For production]

In a pin grid array package, pins longer than the leads arranged in a matrix at a predetermined pitch are inserted from the leads at at least two diagonal corners of the four corners of the leads arranged in a matrix at a predetermined pitch. By providing the pin grid array package at positions separated by a long distance, when mounting the pin grid array package on a printed circuit board by surface mounting, guide holes are placed on the printed board at positions opposite to the long pins for connection of surface mount leads. It can be installed without affecting the hole, and can be easily positioned by inserting a long pin into the hole.

(Embodiment) FIG. 1 is a diagram showing an embodiment of the present invention, in which (a) is a front view and (b) is a view taken along the Z arrow in FIG.

In the figure, reference numeral 1 denotes a package body with a built-in semiconductor chip, and on the bottom surface of the package body 1, there are many pin-shaped leads 2 having a diameter of 0.15 am, for example, to connect the electrodes of the semiconductor chip to the outside. The fact that they are arranged in a matrix is the same as the conventional example explained in FIG. For example, a diameter of 0.0 mm is used for positioning, which has the same pitch as the pitch of the lead 2 and has a longer length than the lead 2. The reason is that the pin 3 of about 4 rrrra is provided. The position of the positioning pins 3 is the same as the pitch of the leads 2, but since there are no adjacent pins, they are located 7' TP from the nearest lead 2.

Therefore, even in the case of a fine pitch, such as P=1.27 mm, from the nearest lead 2, Px,7'T=1.
It is quite possible to provide a through hole for positioning the printed board to be mounted at a distance of 8 mm.

In this embodiment, the alignment pins 3 are long and have a small number of pins, so they are made thicker in diameter than the leads 2 to increase their strength.

This embodiment thus configured is implemented as shown in FIG. 3 in the order shown in FIG. That is, preliminary solder is applied to each lead 2, and at the same time, solder paste is printed on the pads 5 of the printed board 4 to be mounted.

Note that this printed board 4 is provided with a through hole 6 for positioning in advance. Next, the positioning pin 3 of this embodiment is inserted into the positioning through hole 6 of this printed board 4, and the present embodiment is placed thereon.Then, the solder is melted by reflow heating and the lead 2 is soldered to the pad 5. do. Next, the positioning pins 3 are soldered to the positioning through-holes 6 by solder dipping on the back side of the printed board 4 to complete the process.

According to the present embodiment described above, positioning can be performed extremely easily when mounting on a printed circuit board without requiring any special equipment as in the prior art.

〔Effect of the invention〕

As explained above, according to the present invention, in a pin grid array package, at least two diagonal corner leads of the four corners of the leads arranged in a matrix at a predetermined pitch are spaced apart from each other by a distance longer than the pitch of the leads. By providing positioning pins at the same positions, alignment during mounting on a printed board becomes easy, and there is no occurrence of misalignment.

[Brief explanation of drawings]

Fig. 1 shows an embodiment of the present invention; Fig. 2 shows a procedure for mounting an embodiment of the invention on a printed board; Fig. 3 shows an embodiment of the invention mounted on a printed board. FIG. 4 is a diagram showing a conventional pin grid array package. In the figure, 1 is a package body, 2 is a lead, 3 is a positioning pin, 4 is a print handle, 5 is a pad, and 6 is a through hole.

Claims (1)

[Claims] 1. In a surface mount type pin grid array package in which a large number of pin-shaped leads are arranged in a matrix at a predetermined pitch on the back of the package, at least the diagonal corners of the four corners of the leads (2) arranged in the matrix are A semiconductor package characterized in that positioning pins (3) having a longer length than the leads (2) are provided at positions separated from the leads (2) at two corners by a distance longer than the predetermined pitch. .