JPH01291434A - 樹脂封止型電子部品の製造方法 - Google Patents

樹脂封止型電子部品の製造方法

Info

Publication number
JPH01291434A
JPH01291434A JP63122622A JP12262288A JPH01291434A JP H01291434 A JPH01291434 A JP H01291434A JP 63122622 A JP63122622 A JP 63122622A JP 12262288 A JP12262288 A JP 12262288A JP H01291434 A JPH01291434 A JP H01291434A
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
molding cavity
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63122622A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514423B2 (da
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63122622A priority Critical patent/JPH01291434A/ja
Publication of JPH01291434A publication Critical patent/JPH01291434A/ja
Publication of JPH0514423B2 publication Critical patent/JPH0514423B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP63122622A 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法 Granted JPH01291434A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63122622A JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63122622A JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01291434A true JPH01291434A (ja) 1989-11-24
JPH0514423B2 JPH0514423B2 (da) 1993-02-25

Family

ID=14840521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63122622A Granted JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01291434A (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920768A (en) * 1996-12-19 1999-07-06 Denso Corporation Manufacturing method for a resin sealed semiconductor device
JP2024048817A (ja) * 2022-09-28 2024-04-09 住友ベークライト株式会社 樹脂成型用金型、樹脂成型品の製造方法、及び樹脂成型品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920768A (en) * 1996-12-19 1999-07-06 Denso Corporation Manufacturing method for a resin sealed semiconductor device
JP2024048817A (ja) * 2022-09-28 2024-04-09 住友ベークライト株式会社 樹脂成型用金型、樹脂成型品の製造方法、及び樹脂成型品

Also Published As

Publication number Publication date
JPH0514423B2 (da) 1993-02-25

Similar Documents

Publication Publication Date Title
US5133921A (en) Method for manufacturing plastic encapsulated electronic semiconductor devices
WO1998029903A1 (fr) Dispositif a semiconducteur encapsule dans de la resine et son procede de production
JPH0513536B2 (da)
JP2009152507A (ja) 樹脂封止金型および半導体パッケージの樹脂封止成形方法
KR102407742B1 (ko) 수지 성형된 리드 프레임의 제조 방법, 수지 성형품의 제조 방법 및 리드 프레임
US7795712B2 (en) Lead frame with non-conductive connective bar
JPH0514423B2 (da)
JPH06232195A (ja) 半導体装置の製造方法およびリードフレーム
JP2525555Y2 (ja) 樹脂封止型半導体装置用リードフレーム組立体
JPH0213462B2 (da)
JPH04729A (ja) 樹脂封止形電子部品の製造方法
JP2841932B2 (ja) 樹脂封止型電子部品の製造方法
JP3787131B2 (ja) Ｂｇａパッケージの製造に用いるモールド金型
JP3609821B1 (ja) 半導体装置封止用金型およびそれを用いた半導体装置封止方法
JPH0550132B2 (da)
JP3185354B2 (ja) 半導体装置の製造方法及び半導体装置の樹脂封止装置
JP3077632B2 (ja) 樹脂封止金型とその金型によるマトリクス型リードフレームの樹脂封止方法
JPH0720917Y2 (ja) 樹脂モ−ルド装置
JPH0514422B2 (da)
JPH06132458A (ja) 樹脂封止型半導体装置およびそのリードフレーム
JPH1027814A (ja) 樹脂封止型半導体装置及びその樹脂封止方法並びに樹脂封止用金型
JPH0744193B2 (ja) 樹脂封止型電子部品の製造方法
JPH03184349A (ja) 樹脂封止形電子部品の製造方法
JPH08153845A (ja) 樹脂封止型半導体装置及びリードフレームの製造方法
JPH0461131A (ja) 樹脂封止型電子部品の製造方法