JPH0514423B2 - - Google Patents

Info

Publication number
JPH0514423B2
JPH0514423B2 JP63122622A JP12262288A JPH0514423B2 JP H0514423 B2 JPH0514423 B2 JP H0514423B2 JP 63122622 A JP63122622 A JP 63122622A JP 12262288 A JP12262288 A JP 12262288A JP H0514423 B2 JPH0514423 B2 JP H0514423B2
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
molding cavity
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63122622A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01291434A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63122622A priority Critical patent/JPH01291434A/ja
Publication of JPH01291434A publication Critical patent/JPH01291434A/ja
Publication of JPH0514423B2 publication Critical patent/JPH0514423B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP63122622A 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法 Granted JPH01291434A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63122622A JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63122622A JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01291434A JPH01291434A (ja) 1989-11-24
JPH0514423B2 true JPH0514423B2 (da) 1993-02-25

Family

ID=14840521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63122622A Granted JPH01291434A (ja) 1988-05-19 1988-05-19 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01291434A (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
JP2024048817A (ja) * 2022-09-28 2024-04-09 住友ベークライト株式会社 樹脂成型用金型、樹脂成型品の製造方法、及び樹脂成型品

Also Published As

Publication number Publication date
JPH01291434A (ja) 1989-11-24

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