JPH0129495Y2 - - Google Patents
Info
- Publication number
- JPH0129495Y2 JPH0129495Y2 JP1984105907U JP10590784U JPH0129495Y2 JP H0129495 Y2 JPH0129495 Y2 JP H0129495Y2 JP 1984105907 U JP1984105907 U JP 1984105907U JP 10590784 U JP10590784 U JP 10590784U JP H0129495 Y2 JPH0129495 Y2 JP H0129495Y2
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- semiconductor stack
- terminal mounting
- terminal
- mounting base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984105907U JPS6121262U (ja) | 1984-07-13 | 1984-07-13 | 沸騰冷媒式冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984105907U JPS6121262U (ja) | 1984-07-13 | 1984-07-13 | 沸騰冷媒式冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6121262U JPS6121262U (ja) | 1986-02-07 |
| JPH0129495Y2 true JPH0129495Y2 (lt) | 1989-09-07 |
Family
ID=30665212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984105907U Granted JPS6121262U (ja) | 1984-07-13 | 1984-07-13 | 沸騰冷媒式冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6121262U (lt) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0339574U (lt) * | 1989-08-25 | 1991-04-16 |
-
1984
- 1984-07-13 JP JP1984105907U patent/JPS6121262U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6121262U (ja) | 1986-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5519184A (en) | Reusable laser welded hermetic enclosure and method | |
| US3190952A (en) | Welded hermetic seal | |
| US4392151A (en) | Semiconductor device | |
| US3005867A (en) | Hermetically sealed semiconductor devices | |
| US3242555A (en) | Method of making a semiconductor package | |
| JPS63293865A (ja) | 水冷ジャケット構造 | |
| JPS6321340B2 (lt) | ||
| JPS62221435A (ja) | 真空容器の密封構造 | |
| JPS6012287Y2 (ja) | 半導体装置 | |
| JP2623650B2 (ja) | 薄肉パイプの浴接方法 | |
| US3962662A (en) | Metal welding gasket | |
| JP7575068B2 (ja) | 蓋つき容器用封止装置と、それを用いた蓋つき容器の封止方法 | |
| JP2550667B2 (ja) | ハーメチックシール蓋の製造方法 | |
| JPS6011410B2 (ja) | 真空バルブの製造方法 | |
| JPH0310684Y2 (lt) | ||
| US4048460A (en) | Method of welding a cover to a container | |
| JPH01132021A (ja) | 真空遮断器用真空バルブ | |
| JPS63226948A (ja) | 混成集積装置 | |
| JPS5848401Y2 (ja) | アキユ−ムレ−タ− | |
| JPH02301116A (ja) | 固体電解コンデンサ | |
| JPS637892B2 (lt) | ||
| JPS594413Y2 (ja) | 真空しや断器 | |
| JPS6121262U (ja) | 沸騰冷媒式冷却装置 | |
| JPS6233283Y2 (lt) | ||
| JPH01129423A (ja) | 平形半導体装置 |