JPH01316198A - Paper-made carrier tape and its manufucture and metallic mold used in manufucture thereof - Google Patents
Paper-made carrier tape and its manufucture and metallic mold used in manufucture thereofInfo
- Publication number
- JPH01316198A JPH01316198A JP14276388A JP14276388A JPH01316198A JP H01316198 A JPH01316198 A JP H01316198A JP 14276388 A JP14276388 A JP 14276388A JP 14276388 A JP14276388 A JP 14276388A JP H01316198 A JPH01316198 A JP H01316198A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- tape
- carrier tape
- hole
- chipped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000010893 paper waste Substances 0.000 abstract description 4
- 238000009966 trimming Methods 0.000 abstract 2
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Packages (AREA)
- Advancing Webs (AREA)
Abstract
Description
【発明の詳細な説明】
〕１上の利用分野〕
本発明は、チップ化された電子部品、例えば、抵抗、コ
ンデンサ、半導体素子、あるいはバリコン、ボリュム等
を、自動挿入機等により、電子機器に装着する時に都合
がよい紙製キャリアテープおよびその製造方法ならびに
その製造方法に使用する金型に関するものである。[Detailed Description of the Invention] [Field of Application in 1.] The present invention is for inserting chipped electronic components, such as resistors, capacitors, semiconductor elements, variable capacitors, volume controllers, etc., into electronic equipment using an automatic insertion machine or the like. The present invention relates to a paper carrier tape that is convenient for mounting, a manufacturing method thereof, and a mold used in the manufacturing method.
以下、チップ化された電子部品等は１．上記部品を指す
ものである。Below, the electronic components etc. that have been made into chips are listed in 1. This refers to the above parts.
コ従来の技術〕
電子機器に使用されている電子部品は、小型化が進み、
チップ化されるようになった。このようなチップ化され
た電子部品を人手によって電子機器に装着することは、
高度の技術と時間とを必要とした２
１−かし、自動挿入的の開発が進むにしながい、キャリ
アテープに実装されているチップ化された電子部品は、
自動挿入機によって電子機器に人手を使用せずに短時間
で正確に取り付けられるようになった。[Conventional technology] Electronic components used in electronic devices are becoming smaller and smaller.
Now chipped. Attaching such chipped electronic components to electronic devices manually is difficult.
However, as the development of automatic insertion systems progresses, chipped electronic components mounted on carrier tapes require advanced technology and time.
Automatic insertion machines have made it possible to quickly and accurately attach electronic devices without the use of human hands.
このように、チップ化された電子部品が自動挿入−によ
って電子１ｅ’４器に取り付けられるためには、自動挿
入（轡とキャリアテープとの精度が問題になる、
そにで、キャリアテープにおけるチップ化された電子部
品を収納するくぼみ穴の位置およびキャリアテープ送り
孔の位置は、Ｅ Ｉ Ａ Ｊ 、（日本電子！？！５［
工業会規格）によって定められている、そして、チップ
化された電子部品の小型化が進むｔこしたがい、自動挿
入的も小型化高速化が進むようになった。In this way, in order for chipped electronic components to be attached to electronic devices by automatic insertion, the precision between the chip and the carrier tape becomes a problem. The position of the recessed hole for storing the converted electronic components and the position of the carrier tape feed hole are E I A J, (JEOL!?!5 [
As electronic parts made into chips have become smaller, automatic insertion systems have also become smaller and faster.
第３図は、従来例における紙製のキャリアテープ説明図
である
第３図において、Ｃは紙製のキャリアテープ、１は紙製
テープ、２はチ・・Ｉプ化された電子部品を収容するた
めのくぼみ穴となる開孔、３はキャリアテープ送り孔を
示す。Fig. 3 is an explanatory diagram of a paper carrier tape in a conventional example. In Fig. 3, C is a paper carrier tape, 1 is a paper tape, 2 is a chip-shaped electronic component. 3 indicates a carrier tape feeding hole.
オ氏製キャリアテープＣは、紙テープ（こキャリアテー
プ送り孔３とチップ化された電子部品を収容する開孔２
とを一つの金型であけることにより製造される、
そして、紙製キャリアテープＣに図示されていないテー
プを貼ることにより前記開孔２の一方を封止して底部と
１−１図示されていないチ・・Ｉブ化された電子部品を
前記開孔２の他方から挿入し、その上から前記と同様な
テープを貼る。Carrier tape C made by Mr. Oh is a paper tape (carrier tape feed holes 3 and openings 2 for accommodating chipped electronic components).
The hole 2 is manufactured by punching the hole 2 in one mold, and one side of the hole 2 is sealed by pasting a tape (not shown) on the paper carrier tape C to form the bottom part 1-1. A non-chip electronic component is inserted from the other side of the opening 2, and the same tape as above is applied over it.
このようにしてできたチップ化された電子部品を収容し
た紙製キャリアテープＣは、巻かれて出荷され、絹六工
場において自動挿入機によって紙製キャリアテープＣか
らチップ化された電子部品が、真空ビンセット等により
自動的に取り出されて、電子（僅器のプリント配線基板
等に取っ付けられろ２
キャリアテープが紙の場合は、価格の点と柔軟性の点と
では申し分がない２
″発明が解決しようとする課題ご
１−かじ、祇テープの厚さとチップ化された電子部品の
高さとがほぼ等しい時は良いが、いずれか一方に差があ
る場合には、チップ化された電子部品がキャリアテープ
のくぼみ穴の中で３ｎんだつ、り）るいはキャリアテー
プが膨らんだりして、高速で自動挿入機にかけるのに不
都合が生じるという問題があった。The paper carrier tape C containing the chipped electronic components produced in this way is rolled up and shipped, and the electronic components chipped from the paper carrier tape C by an automatic insertion machine at the Kinuroku factory are It can be automatically taken out with a vacuum bin set, etc., and attached to an electronic (small printed wiring board, etc.2) If the carrier tape is paper, it is perfect in terms of price and flexibility.2'' Problem to be solved by the invention 1 - It is good when the thickness of the tape and the height of the chipped electronic component are almost equal, but if there is a difference in either of them, the height of the chipped electronic component There was a problem in that the parts were stuck in the recessed holes of the carrier tape, or the carrier tape swelled, making it inconvenient to insert the parts into an automatic insertion machine at high speed.
また、紙テープを金型で開孔する場合には、相かい紙屑
が散乱して、その処理に人手がかかるという問題が７）
っな２
本発明は、以卜のような問題を解決するためのものであ
り、チップ化された電子部品の高さに相当する深さのく
ぼみ穴を有する紙製キャリアテープおよびその製造方法
を提供することを目的とする。In addition, when punching paper tape with a metal mold, there is a problem that paper waste is scattered and it takes a lot of manpower to dispose of it.7)
2 The present invention is intended to solve the above problems, and provides a paper carrier tape having recessed holes with a depth corresponding to the height of chipped electronic components, and a method for manufacturing the same. The purpose is to provide.
本発明は、紙製キャリアテープの製造中に、オヨかい紙
屑の散乱を防１）７するためのもので、紙製キャリアテ
ープの製造に使用する金型を提供することを目的とする
６ ′
′″課題解決するための手段〕
本発明は、上記目的を達成するなめに、紙製テープにテ
ープ送り孔と、チップ化された電子部品を収容するビク
抜き孔からなるくぼみ穴と、からなることを特徴とする
７
本発明は、紙製テープにテープ送り了１をあける第一工
程と、チップ化された電子部品を収容するくぼみ穴をビ
ク抜き加工により設ける第二工稈と、からなることを特
徴とする６
本発明は、前記ビク抜き加工を行なう金型において、先
端に設けられなビク抜き用刃と、ビク抜きにより切り取
られた紙を収容するビク抜き用刃の開口に続く紙溜め部
と、原紙溜め部の紙を排除するための排出口と、からな
ることを特徴とする特コ実施例〕
第１図は、本発明の詳細な説明図で、キャリアテープの
一部断面拡大図、第２図は本発明の一実施例に使用する
金型の断面拡大図である８第１図および第２図において
、Ｃは紙製キャリアテープ、１は紙テープ、２はチップ
化された電子部品を収容するくぼみ穴、３はキャリアテ
ープ送り孔、４は金型、５は刃、６は開口、７は祇溜め
部、８は排出口、ｔは前記くぼみ穴２の深さあるいは金
型４の刃５の高さ、ｄは紙テープの厚さを示す。The present invention is intended to prevent scattering of paper waste during the production of paper carrier tapes, and aims to provide a mold for use in the production of paper carrier tapes. ``Means for Solving the Problems'' In order to achieve the above object, the present invention provides a paper tape comprising a tape feed hole and a recessed hole for accommodating a chipped electronic component. Characteristic 7 The present invention comprises a first step of making a tape feed end 1 in a paper tape, and a second step of making a recessed hole for accommodating a chipped electronic component by punching. 6. The present invention is characterized in that, in the mold for performing the blanking process, a blanking blade provided at the tip and a paper following the opening of the blanking blade that accommodates the paper cut out by the blanking process are provided. A special embodiment characterized by comprising a reservoir and a discharge port for removing paper from the base paper reservoir] FIG. 1 is a detailed explanatory diagram of the present invention, showing a partial cross section of the carrier tape. An enlarged view and FIG. 2 are enlarged cross-sectional views of a mold used in an embodiment of the present invention.8 In FIGS. 1 and 2, C is a paper carrier tape, 1 is a paper tape, and 2 is a chipped 3 is a carrier tape feeding hole; 4 is a mold; 5 is a blade; 6 is an opening; 7 is a reservoir; 8 is a discharge port; t is the depth of the hollow hole 2; The height of the blade 5 of the mold 4, d, indicates the thickness of the paper tape.
たとえば、抵テープ１の厚さｄは、１ ｎｎの厚さを有
する紙繊岬が積層されたもので、これを第１図図示の如
き金型４の刃５でビク抜きする、ここで、ビク抜きとは
、本発明の明細書では次のように定義する。For example, the thickness d of the resistance tape 1 is a laminated paper fiber cape having a thickness of 1 nn, which is punched with the blade 5 of the mold 4 as shown in FIG. In the specification of the present invention, the term "de-marking" is defined as follows.
すなわち、紙繊維が積層されているテープに対１−て金
型４の刃５が押されると、刃５の形状に基づく切り込み
が入る２ 次に、金型４の刃５を抜くと、刃５の高さと
同に紙貨帷の層が刃５に付１）て持ちトげられろ
以トのよう２４ビク抜き加工を行なうと金型４の刃５の
高さと同じ深さのチップｆヒされた電子部品を収容する
くぼみ穴ができる４
したがって、チップ化された電子部品の高さ（こ応じて
金型４の刃５の高さを任意に選べば、いかなる深さのく
ぼみ穴をも作ることが可能となるまた、ビク抜きした後
の積層されたｔＨ令は、散乱し易いので、金型４の開口
６に連袂した部分が紙溜め部７を構成する。そして、溜
った紙屑は、排出口８から真空装置？ｉ′等により吸引
して処理される。That is, when the blade 5 of the mold 4 is pressed against the tape on which the paper fibers are laminated, a cut is made based on the shape of the blade 5.Next, when the blade 5 of the mold 4 is pulled out, the blade When a layer of paper baggage is attached to the blade 5 at the same height as the height of the mold 4 and is lifted up, a chip f of the same depth as the height of the blade 5 of the mold 4 is produced. Therefore, if the height of the blade 5 of the mold 4 is arbitrarily selected according to the height of the chipped electronic component (4), a hollow hole of any depth is formed to accommodate the chipped electronic component. In addition, since the stacked tH layers after punching are easily scattered, the part connected to the opening 6 of the mold 4 constitutes the paper storage section 7. is suctioned from the discharge port 8 by a vacuum device ?i' or the like and treated.
排出口８の位置は、第２図図示では左（ｊ＋ｊｌに設け
られているが、左右前後あるいは上部に設けることも可
能である、
さらに、図示されていないが、金型４に対して、刃５を
ヒ下方向にスライドできるスライド１乃槽と、該スライ
ド機構をＩトめる止め撮椅とを設けておくと、チップ化
された電子部品の高さに応にでこれを収容するくぼみ穴
の深さを簡単に調節できろ。The position of the discharge port 8 is shown in FIG. 2 on the left (j+jl), but it can also be provided on the left, right, front, back, or top. By providing a slide 1 that can slide the slide mechanism 5 in the downward direction and a stopper that locks the slide mechanism, a recess that accommodates the chipped electronic component can be created depending on the height of the chipped electronic component. Easily adjust the depth of the hole.
二発明の効果：
本発明によれば、ビク抜き加工によりチップ化された電
子部品を収容するくぼみ孔を設けたので、簡単な金型の
刃で、しかも金型の刃の高さを調節すれば、くぼみ穴の
深さを自由に作ることができる、
本発明によれば、ビク抜き加工により切り取られた紙屑
は、金型の紙溜め部に一時溜められた後に、自動的に吸
引することができるので、廃棄処理が簡単であるや2. Effects of the Invention: According to the present invention, since a recessed hole is provided to accommodate the electronic component that has been made into a chip by the punching process, the height of the mold blade can be adjusted with a simple mold blade. For example, the depth of the recessed hole can be freely created.According to the present invention, the paper scraps cut out by the punching process are temporarily stored in the paper reservoir of the mold, and then automatically sucked out. It is easy to dispose of it because it can be
第１図は本発明の詳細な説明図で、キャリアテープの一
部断面拡大図、第２図は本発明の一実艙例に使用する金
型の断面拡大図で、第３図は従来例における紙製のキャ
リアテープ説明図である。
図中、
Ｃ−−・・キャリアテープ
１ ・・・・（氏製テーフ。
２ −、−、−、、＜ぼみ穴
３ ・−・・キャリアテープ送り孔
４ ・・−金型 。
５ ・・・−刀
６−・・・開口
ア −・−・−紙溜め部
８ ・・・−排出口Fig. 1 is a detailed explanatory diagram of the present invention, with an enlarged partial cross-sectional view of a carrier tape, Fig. 2 is an enlarged cross-sectional view of a mold used in one embodiment of the present invention, and Fig. 3 is a conventional example. FIG. 2 is an explanatory diagram of a paper carrier tape in FIG. In the figure, C---...Carrier tape 1...(Tape made by Mr.) 2 -, -, -,, < Recessed hole 3...Carrier tape feed hole 4...-Mold. 5 ・...-Sword 6--Opening a--Paper storage section 8--Discharge port
Claims (1)
くぼみ穴２と、 からなることを特徴とする紙製キャリアテープ、（２）
紙製テープにテープ送り孔をあける第一工程と、 チップ化された電子部品を収容するくぼみ穴をビク抜き
加工により設ける第二工程と、 からなることを特徴とする紙製キャリアテープの製造方
法。 （３）請求項（２）記載の製造方法に使用するビク抜き
用金型において、 先端に設けられたビク抜き用刃５と、 ビク抜きにより切り取られた紙を収容するビク抜き用刃
５の開口６に続く紙溜め部７と、 該紙溜め部７の紙を排除するための排出口８と、からな
ることを特徴とする紙製キャリアテープを製造するため
の金型。[Scope of Claims] (1) A paper carrier tape comprising: a tape feed hole 3; and a recessed hole 2 consisting of a punched hole for accommodating a chipped electronic component; (2)
A method for manufacturing a paper carrier tape characterized by comprising: a first step of making tape feeding holes in a paper tape; and a second step of making hollow holes for accommodating chipped electronic components by punching. . (3) In the blanking die used in the manufacturing method according to claim (2), the blanking blade 5 provided at the tip, and the blanking blade 5 for storing the paper cut out by blanking. A mold for manufacturing a paper carrier tape, comprising: a paper reservoir 7 following an opening 6; and a discharge port 8 for removing paper from the paper reservoir 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63142763A JPH0741595B2 (en) | 1988-06-11 | 1988-06-11 | Manufacturing method of paper carrier tape and mold used in the manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63142763A JPH0741595B2 (en) | 1988-06-11 | 1988-06-11 | Manufacturing method of paper carrier tape and mold used in the manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01316198A true JPH01316198A (en) | 1989-12-21 |
| JPH0741595B2 JPH0741595B2 (en) | 1995-05-10 |
Family
ID=15323015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63142763A Expired - Lifetime JPH0741595B2 (en) | 1988-06-11 | 1988-06-11 | Manufacturing method of paper carrier tape and mold used in the manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741595B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07112399A (en) * | 1993-10-19 | 1995-05-02 | Tdk Corp | Punching method for tape-form member |
| US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
| US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
| GB2404654A (en) * | 2003-08-08 | 2005-02-09 | Ivan Semenenko | Cone shape closure device made of elastomeric material for store of flowable material |
| CN115072103A (en) * | 2021-03-12 | 2022-09-20 | 株式会社村田制作所 | Electronic component carrier tape and electronic component carrier reel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623470A (en) * | 1979-07-23 | 1981-03-05 | Nippon Electric Co | Chip electronic part continuous material |
| JPS6399198A (en) * | 1987-04-10 | 1988-04-30 | 芝 悦嗣 | Chip burying recessed-section forming method of plastic card |
-
1988
- 1988-06-11 JP JP63142763A patent/JPH0741595B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623470A (en) * | 1979-07-23 | 1981-03-05 | Nippon Electric Co | Chip electronic part continuous material |
| JPS6399198A (en) * | 1987-04-10 | 1988-04-30 | 芝 悦嗣 | Chip burying recessed-section forming method of plastic card |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07112399A (en) * | 1993-10-19 | 1995-05-02 | Tdk Corp | Punching method for tape-form member |
| US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
| US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
| GB2404654A (en) * | 2003-08-08 | 2005-02-09 | Ivan Semenenko | Cone shape closure device made of elastomeric material for store of flowable material |
| CN115072103A (en) * | 2021-03-12 | 2022-09-20 | 株式会社村田制作所 | Electronic component carrier tape and electronic component carrier reel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741595B2 (en) | 1995-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01316198A (en) | Paper-made carrier tape and its manufucture and metallic mold used in manufucture thereof | |
| JP3880799B2 (en) | Method for manufacturing paper carrier tape | |
| JP2989772B2 (en) | Embossed carrier tape for chip-shaped electronic components and method of manufacturing the same | |
| CN100415610C (en) | Method of making paper carrier strip | |
| KR102061330B1 (en) | paper carrier tape manufacturing method | |
| KR102061328B1 (en) | paper carrier tape manufacturing device | |
| JPS61178878A (en) | Carrier tape | |
| CN101362224B (en) | Cutting method of circuit board | |
| JPS6344606B2 (en) | ||
| KR200290931Y1 (en) | paper carrier tape for packing chip parts | |
| JPS61142153A (en) | Carrier tape and its manufacturing method | |
| JPH0340441Y2 (en) | ||
| JP2838818B2 (en) | Manufacturing method of carrier tape made of chip component paper | |
| JPH01314150A (en) | Manufacture of plastic carrier tape | |
| JPH0382099A (en) | Plastic carrier tape and manufacture thereof | |
| JPH11165786A (en) | Structure of tape-like packaged body for electronic parts | |
| JPH0529102A (en) | Electronic parts | |
| JPS61123200A (en) | Carrier tape | |
| JPS6253414B2 (en) | ||
| JPH0662172B2 (en) | Plastic carrier tape and method for manufacturing the same | |
| JPH0779194B2 (en) | Mounting method of electric parts on flexible board | |
| JPH02205573A (en) | Carrier tape | |
| JPS6399907A (en) | Production unit for green sheet | |
| JP2001219396A (en) | Metal mold for printed wiring other board work, and working method of printed wiring mother board | |
| JP2001270591A (en) | Carrier tape |