JPS61123200A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPS61123200A JPS61123200A JP59244796A JP24479684A JPS61123200A JP S61123200 A JPS61123200 A JP S61123200A JP 59244796 A JP59244796 A JP 59244796A JP 24479684 A JP24479684 A JP 24479684A JP S61123200 A JPS61123200 A JP S61123200A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- carrier tape
- recessed hole
- chipped
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000012050 conventional carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 235000001270 Allium sibiricum Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
ｎ＋発明の技術分野
本発明は、チップ化された電子部品を自動挿入機により
、電子機器に装着する時に都合の良いキャリアテープに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a carrier tape that is convenient for mounting chipped electronic components into electronic equipment using an automatic insertion machine.
（２）発明の技術的背景
電子機器に使用されている部品は、小型化が進み、チッ
プ化されているため、このような電子部品を人手によっ
て電子機器に装着することは、高度の技術と時間を必要
とした。しかし、自動挿入機の開発が進むに従い、チッ
プ化された電子部品は、キャリアテープに実装され、電
子機器に人手を使わずに、短時間のうちに正確に取付け
られるようになった。このように、チップ化された電子
部品が自動挿入機によって正確で、しかも短時間に電子
機器に取付けられるようにするためには、自動挿入機だ
けではなく、キャリアテープの精度も問題になり、チッ
プ化された電子部品の実装位置およびキャリアテープの
送り孔の位置は、ＪＩＳ規格によって定められている。(2) Technical background of the invention As the parts used in electronic devices are becoming smaller and in the form of chips, it requires advanced technology to manually attach such electronic components to electronic devices. It took time. However, as the development of automatic insertion machines progresses, chipped electronic components can now be mounted on carrier tapes and accurately attached to electronic equipment in a short time without the need for human intervention. In this way, in order to be able to accurately and quickly attach chipped electronic components to electronic devices using an automatic insertion machine, not only the accuracy of the automatic insertion machine but also the accuracy of the carrier tape is a problem. The mounting position of the chipped electronic component and the position of the feed hole of the carrier tape are determined by the JIS standard.
（３）従来技術とその問題点
チップ化された電子部品を自動挿入機により電子機器に
装着する場合、その速度と精度を上げるに従って、紙或
いはプラスチック製である従来のキャリアテープは、い
ずれも伸びが生じ、その目的を十分に達成することはで
きなかった。(3) Prior art and its problems When mounting electronic components in the form of chips into electronic devices using an automatic insertion machine, as the speed and accuracy increases, conventional carrier tapes made of paper or plastic tend to expand. , and the purpose could not be fully achieved.
そこで、従来のキャリアテープの伸びによる欠点を除去
するために、第１図に示すようなキャリアテープを金属
テープ１とし、キャリアテープの送り孔５、およびチッ
プ化された電子部品（図示されていない）をキャリアテ
ープ１から真空ピンセット（図示されていない）によっ
て引き出す時、キャリアチー プがチップ化された電子
部品と共に、真空ビ／セットに吸着しないように、キャ
リアテープに空気を入れるための開口６を穿設し、カマ
ボッ形のプレス金型で金属テープに押し出し加工を施し
て、チップ化された電子部品を収容するくぼみ穴２を作
った。Therefore, in order to eliminate the drawbacks caused by the elongation of the conventional carrier tape, the carrier tape as shown in FIG. ) from the carrier tape 1 with vacuum tweezers (not shown), an opening 6 is provided to let air into the carrier tape so that the carrier chip and the chipped electronic components are not attracted to the vacuum set. A recessed hole 2 for accommodating the chipped electronic component was created by extruding the metal tape using a kamabot-shaped press mold.
このくぼみ穴２の肉は、プレス金型で押し出す時にくぼ
み穴２の両側面の開口３とバリ４とに変わる。そして、
このバリ４がストッパーとなってチップ化された電子部
品の脱落を防止していた。The flesh of this recessed hole 2 turns into openings 3 and burrs 4 on both sides of the recessed hole 2 when extruded with a press die. and,
This burr 4 acted as a stopper to prevent the chipped electronic component from falling off.
しかし、上記バリ４は、出来力が不安定であるため、自
動挿入機を高速で操作する場合に、脱落し、その結果チ
ップ化された電子部品も脱落するという欠点があった。However, since the burr 4 is unstable, it falls off when the automatic insertion machine is operated at high speed, and as a result, the chipped electronic components also fall off.
（４）発明の目的
本発明は、キャリアテープが伸びるという欠点を除去す
ると共に、チップ化された電子部品を収容するくぼみ穴
の両側面の開口を塞ぎ、自動挿入機を高速で操作しても
、上記電子部品の脱落を防止するものである。(4) Purpose of the Invention The present invention eliminates the drawback that the carrier tape stretches, and also closes the openings on both sides of the recessed hole that accommodates the chipped electronic components, even when the automatic insertion machine is operated at high speed. , which prevents the electronic components from falling off.
（５）発明の構成
本発明のキャリアテープ１は、厚さが約０．１ ｍｒｒ
ｔの金属製テープで、このキャリアテープｌに送り孔５
およびチップ化された電子部品を収容するくぼみ穴２の
予定位置のほぼ中央に、キャリアテープ１の進行方向に
沿ったスリット６を穿設する。(5) Structure of the Invention The carrier tape 1 of the present invention has a thickness of about 0.1 mrr.
Make a feed hole 5 in this carrier tape l with metal tape t.
A slit 6 is formed along the traveling direction of the carrier tape 1 approximately at the center of the intended position of the recessed hole 2 for accommodating the chipped electronic component.
次に、スリット６の上からカマボッ形の金型で押し出し
加工を行う。この時、スリット６′は、テ゛プの左右方
向に幅を広げるように破れ、どの破れた部分の肉がくぼ
み穴２の両側面の肉となって、従来例における開口３が
閉塞され、閉塞面３′となる。Next, extrusion processing is performed from above the slit 6 using a kamabot-shaped die. At this time, the slit 6' is torn so as to widen in width in the left and right direction of the tape, and the flesh of which torn part becomes the flesh of both sides of the hollow hole 2, and the opening 3 in the conventional example is closed, and the closed surface It becomes 3'.
チップ化された電子部品は、上記くぼみ穴２に収容され
、この電子部品の上面は、薄いプラスチックフィルム（
図示されていない）を貼って、自動挿入機にかける。The chipped electronic component is housed in the recessed hole 2, and the top surface of this electronic component is covered with a thin plastic film (
(not shown) and place it in an automatic insertion machine.
自動挿入機からチップ化された電子部品を電子機器に装
着する場合、押し出し加工によって破れたスリット６′
は、空気の流入口となり、キャリアテープ１から真空ピ
ンセットによってチップ化された電子部品を引き出す時
、キャリアテープ１がチップ化された電子部品と共に真
空ピンセットに吸着するのを防止する。When inserting chipped electronic components into electronic equipment from an automatic insertion machine, slits 6' torn by extrusion
serves as an air inlet and prevents the carrier tape 1 from being attracted to the vacuum tweezers together with the chipped electronic components when the chipped electronic components are pulled out from the carrier tape 1 with the vacuum tweezers.
スリット６の数は、チップ化された電子部品の大きさ、
すなわち、くぼみ穴２の縦、横、および深さ等に従って
、一本から数本に増加した方が閉塞面３が安定して成形
される。The number of slits 6 depends on the size of the chipped electronic component,
That is, depending on the length, width, depth, etc. of the recessed hole 2, the closed surface 3 is more stably formed when the recessed hole 2 is increased from one to several.
また、スリット６の数だけでなく、くぼみ穴２の形状に
従ってスリット６の形状も、第４図に示すように、（イ
）直線状のスリット、（ロ）スリットの両端に小円を設
けたもの、（ハ）スリットの幅を少し広げ、その両端を
円形としたもの、など少しづつ変形した方が良く、単な
る直線状のスリットに限定されるものではない。In addition to the number of slits 6, the shape of the slits 6 is also changed according to the shape of the recessed hole 2, as shown in Fig. 4. (c) It is better to make the slit slightly wider and make both ends circular, etc., and it is not limited to just a straight slit.
要するに、くぼみ穴２の大きさに従って、スリットの数
および形状を適当に組合すこきによって、くぼみ穴２の
両端の閉塞面３′をより安定ζこ成形することができる
。In short, by appropriately combining the number and shape of the slits according to the size of the hollow hole 2, the closed surfaces 3' at both ends of the hollow hole 2 can be formed more stably.
（６）発明の効果
本発明は、ｉヤリアテープを紙或いはプラスチックのか
わりに、金属テープとしたため、自動挿入機を高速で操
作しても、テープの伸びがないから、チップ化された電
子部品を高精度に装着することができると共に、チップ
化された電子部品を収容するくぼみ穴に、キャリアテー
プの進行方向と平行な向きの少なくとも一つのスリット
を設けることにより、上記くぼみ穴の両側面には、安定
した閉塞面ができ、前記電子部品の脱落を防止すること
ができる。(6) Effects of the Invention The present invention uses a metal tape instead of paper or plastic for i-yaria tape, so even if the automatic insertion machine is operated at high speed, the tape does not stretch, so chipped electronic parts cannot be used. In addition to being able to mount with high precision, by providing at least one slit parallel to the traveling direction of the carrier tape in the recessed hole that accommodates the chipped electronic component, both sides of the recessed hole are , a stable closed surface is created, and the electronic components can be prevented from falling off.
また、本発明は、チップ化された電子部品を収容するく
ぼみ穴の両側面が閉塞されているにもかかわらず、従来
の金属テープにおける開口６の形状を変えるかまたはス
リットの数を増加するだけであるから、工程数は全く同
じで効果は非常に大きいものである。Furthermore, although both sides of the recessed hole housing the chipped electronic component are closed, the present invention merely changes the shape of the opening 6 in the conventional metal tape or increases the number of slits. Therefore, the number of steps is exactly the same and the effect is very large.
以上の他、導電性の良い金属（例えばアルミ板）等を使
用する事により、静電気の発生を防上出来、ダイオード
等の、静電気による特性障害を受は易いチップ部品の収
容にも、使用出来る。In addition to the above, by using a metal with good conductivity (for example, an aluminum plate), the generation of static electricity can be prevented, and it can also be used to house chip components such as diodes that are easily susceptible to characteristic damage due to static electricity. .
第１図は、従来の金属製キャリアテープ。第２、第３図
は、本発明の金属製キャリアチーブのくぼみ穴を作る前
と後。第４図は、本発明のスリットの形状。
１・・金属テープ
２・・くぼみ穴
３ テープの両側面の開口
３ ・閉塞面
４９１．パリ
５・・テープ送り孔
６ ・開口
６・・・スリット
６ スリットの破れ口Figure 1 shows a conventional metal carrier tape. Figures 2 and 3 are before and after making the recessed holes in the metal carrier chive of the present invention. FIG. 4 shows the shape of the slit of the present invention. 1... Metal tape 2... Hole 3 Openings 3 on both sides of the tape - Closed surface 491. Paris 5...Tape feed hole 6 ・Opening 6...Slit 6 Slit tear
Claims (1)
れるだけの厚さを有する金属テープに、テープ送り孔と
、上記くぼみ穴の肉部をくぼみ穴の両側面に逃がすため
のテープ進行方向と平行な向きの少なくとも一つのスリ
ット上に押し出し加工を施こすことによってできたチッ
プ化された電子部品を収容するくぼみ穴とを設けたキャ
リアテープ。A metal tape having a thickness sufficient to provide a recessed hole capable of accommodating a chipped electronic component is provided with a tape feeding hole and a tape traveling direction for letting the flesh of the recessed hole escape to both sides of the recessed hole. A carrier tape having at least one parallel oriented slit and a recessed hole for accommodating a chipped electronic component produced by extrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59244796A JPS61123200A (en) | 1984-11-20 | 1984-11-20 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59244796A JPS61123200A (en) | 1984-11-20 | 1984-11-20 | Carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61123200A true JPS61123200A (en) | 1986-06-11 |
| JPH0451431B2 JPH0451431B2 (en) | 1992-08-19 |
Family
ID=17124059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59244796A Granted JPS61123200A (en) | 1984-11-20 | 1984-11-20 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123200A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6329332U (en) * | 1986-08-11 | 1988-02-26 | ||
| JP2016069037A (en) * | 2014-09-30 | 2016-05-09 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package and take-out method of electronic component |
-
1984
- 1984-11-20 JP JP59244796A patent/JPS61123200A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6329332U (en) * | 1986-08-11 | 1988-02-26 | ||
| JP2016069037A (en) * | 2014-09-30 | 2016-05-09 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package and take-out method of electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451431B2 (en) | 1992-08-19 |
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