JPH0139999B2 - - Google Patents

Info

Publication number
JPH0139999B2
JPH0139999B2 JP14532581A JP14532581A JPH0139999B2 JP H0139999 B2 JPH0139999 B2 JP H0139999B2 JP 14532581 A JP14532581 A JP 14532581A JP 14532581 A JP14532581 A JP 14532581A JP H0139999 B2 JPH0139999 B2 JP H0139999B2
Authority
JP
Japan
Prior art keywords
solution
growth
composition
layer
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14532581A
Other languages
Japanese (ja)
Other versions
JPS5845193A (en
Inventor
Kazuo Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14532581A priority Critical patent/JPS5845193A/en
Publication of JPS5845193A publication Critical patent/JPS5845193A/en
Publication of JPH0139999B2 publication Critical patent/JPH0139999B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00Liquid-phase epitaxial-layer growth
    • C30B19/10Controlling or regulating
    • C30B19/103Current controlled or induced growth

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

【発明の詳細な説明】 本発明は液相エピタキシヤル成長により形成さ
れる成長層の組成の制御および厚膜成長方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for controlling the composition of a grown layer formed by liquid phase epitaxial growth and a method for growing a thick film.

液相エピタキシヤル(以下LPEと略称する)
成長法によつてアルミニウム(Al)を含む化合
物を成長せしめる場合に、溶液中に溶解するAl
の量が非常に少く、また分配係数が非常に大きい
ために成長層近傍で溶液のAl濃度不足を生じて
成長速度を遅くすることを余儀なくされ、或いは
全溶液中のAl濃度の急激な減少を招いて成長層
の厚さが制限される。
Liquid phase epitaxial (hereinafter abbreviated as LPE)
When growing a compound containing aluminum (Al) using a growth method, Al dissolved in the solution
Since the amount of Al in the solution is very small and the distribution coefficient is very large, the Al concentration in the solution becomes insufficient near the growth layer, forcing the growth rate to slow down, or the Al concentration in the entire solution decreases rapidly. This limits the thickness of the grown layer.

具体的にInP基板上へのAlxGayIn1−x−yAs
四元化合物のLPE成長を例として説明する。InP
基板からのPの解難が700℃以上で大きくなるこ
とを考慮して成長温度を700℃とするとき、
AlxGayIn1−x−yAsの成長溶液中のAlのモル分
率は最大Xl Al=0.0002に止まり、LPE成長により
溶液中のAl濃度が急激に低下して成長層の厚さ
は0.4μm程度が限度となる。仮に成長温度を800
℃まで上昇せしめてAlの溶解量を増加しても、
成長層の厚さは1μm程度が限度である。半導体受
光素子の光吸収層等を対象とする場合にはこの程
度の厚さでは不足であつて、良好な受光素子を構
成することができない。
Specifically, AlxGayIn 1 −x−yAs on InP substrate
This will be explained by taking LPE growth of a quaternary compound as an example. InP
When the growth temperature is set to 700°C, taking into consideration that the difficulty of releasing P from the substrate increases above 700°C,
The mole fraction of Al in the growth solution for AlxGayIn 1 −x−yAs remains at a maximum of X l Al = 0.0002, and the Al concentration in the solution decreases rapidly due to LPE growth, and the thickness of the grown layer is about 0.4 μm. This is the limit. If the growth temperature is set to 800
Even if the temperature is raised to ℃ to increase the amount of Al dissolved,
The thickness of the growth layer is limited to about 1 μm. When the target is a light absorption layer of a semiconductor light receiving element, etc., this thickness is insufficient and a good light receiving element cannot be constructed.

前記例のみならず、LPE成長法においては固
相の成長に伴なつて溶液成分のモル分率は次第に
変化し、成長層の組成も溶液成分の変化に応じて
変化する。従来技術においては、溶液の組成、成
長開始温度、過冷却度、冷却速度及び成長時間等
の選択を成長層の組成変化への対応手段としてい
るが、成長層の組成分布を制御し或いは所望の組
成及び厚さを有する成長層を得るための方法とし
ては極めて不充分である。
In addition to the above example, in the LPE growth method, the mole fraction of the solution components gradually changes as the solid phase grows, and the composition of the grown layer also changes in accordance with the change in the solution components. In the conventional technology, the composition of the solution, the growth start temperature, the degree of supercooling, the cooling rate, the growth time, etc. are selected as a means of responding to changes in the composition of the growth layer. This is a very unsatisfactory method for obtaining a grown layer with the same composition and thickness.

本発明はLPE成長により形成される成長層の
組成を制御し、更に所望の組成及び厚さを有する
成長層を得ることを目的とする。
The present invention aims to control the composition of a grown layer formed by LPE growth, and to obtain a grown layer having a desired composition and thickness.

本発明の前記目的は、エレクトロエピタキシ法
において溶液の少くとも一成分を含む物質よりな
る電極を溶液に接触させ、基板と該電極との間の
溶液を介する電流によつて、溶液への該成分の溶
解、従つて溶液中の該成分の濃度をエピタキシヤ
ル成長中に制御することによつて達成される。
The object of the present invention is to bring an electrode made of a substance containing at least one component of a solution into contact with the solution in an electroepitaxy method, and to introduce the component into the solution by an electric current passing through the solution between the substrate and the electrode. This is achieved by controlling the dissolution of, and thus the concentration of, the components in solution during epitaxial growth.

本発明を実施例により図面を参照して具体的に
説明する。図はInP基板上にAlxIn1−xAs三元化
合物を本発明の方法により成長させる実施例を示
す模式図である。図において、1はボートの固定
部、2はボートのスライダであつていずれもカー
ボンよりなり、3は硼素窒化物(Boron Nitride
=BN)よりなる絶縁層である。ボートの固定部
1に挿入された電極4はボートの固定部1に電気
的に接触し、引出導線に接続される。更にボート
の固定部1の上面の凹部にInP基板5が収容され
ている。
The present invention will be specifically described by way of examples with reference to the drawings. The figure is a schematic diagram showing an example of growing an AlxIn 1 -xAs ternary compound on an InP substrate by the method of the present invention. In the figure, 1 is a fixed part of the boat, 2 is a slider of the boat, both of which are made of carbon, and 3 is a boron nitride.
= BN). The electrode 4 inserted into the fixed part 1 of the boat makes electrical contact with the fixed part 1 of the boat and is connected to the lead wire. Further, an InP substrate 5 is housed in a recess on the upper surface of the fixed part 1 of the boat.

AlxIn1−yAs三元化合物のLPE成長層形成時に
は、溶液6がInP基板5に図の如く接する位置に
スライダ2が位置し、溶液6はAl−As−In三元
溶液である。
When forming the LPE growth layer of the AlxIn 1 -yAs ternary compound, the slider 2 is positioned at a position where the solution 6 contacts the InP substrate 5 as shown in the figure, and the solution 6 is an Al-As-In ternary solution.

本実施例においては、図に示す如く、固相Al
7及びInAs結晶8が溶液6に接触してその上に
置かれ、かつそれぞれ独立して引出導線9及び
9′が接続されている。本実施例のAl7は断面が
円形の棒状であつてその側面はアルミナ
(Al2O3)円筒に包まれて、溶液6に接する面は
その下端面に限られ、更にAl7が溶液6中に溶
解するに伴つて円筒内の溶液面が上昇して、常に
Al7の一定面積が溶液に接する構造として制御
を容易確実にしている。
In this example, as shown in the figure, solid phase Al
7 and InAs crystal 8 are placed on top of the solution 6 in contact with it, and lead wires 9 and 9' are connected independently to each other. Al7 in this example has a rod shape with a circular cross section, its side surface is wrapped in an alumina (Al 2 O 3 ) cylinder, and the surface in contact with the solution 6 is limited to its lower end surface, and furthermore, Al7 is in the solution 6. As the solution melts, the level of the solution inside the cylinder rises, constantly
The structure allows a certain area of Al7 to be in contact with the solution, making control easy and reliable.

LPE成長開始前の溶液を形成する材料の混合
物はIn:InAs:Al=5.9695g:1.0g:0.00029gの
否率とし、その他に前記の如きAl7、InAs結晶
8及びInP基板5を配置する。図に示す装置全体
を反応管内に収容し、純水素を流しつつ温度を上
昇させて前記混合物を溶解し、650℃に到達すれ
ば、以後は成長終了までこの温度に保つ。650℃
に到達30分後にボートのスライダ2をスライドし
てInP基板5上に溶液6を導き、両者を接触させ
る。
The mixture of materials forming the solution before the start of LPE growth has a rejection ratio of In:InAs:Al=5.9695g:1.0g:0.00029g, and in addition, Al7, InAs crystal 8, and InP substrate 5 as described above are arranged. The entire apparatus shown in the figure is housed in a reaction tube, and the mixture is dissolved by raising the temperature while flowing pure hydrogen, and once it reaches 650°C, it is maintained at this temperature until the end of growth. 650℃
30 minutes after reaching , slide the slider 2 of the boat to introduce the solution 6 onto the InP substrate 5 and bring them into contact.

InP基板5に溶液6を接触させると同時に、ボ
ートの固定部1側を正(プラス)、Al7及びInAs
8側を負(マイナス)の極性として、InP基板5
−溶液6−Al7間及びInP基板5−溶液6−InAs
8間に電流を通ずる。Al7とInAs8とは電気的
に独立してそれぞれ別個に電流値を制御すること
が可能であつて、電流値に対応してAl7或いは
InAs8の溶液6への溶解速度が定まる。
At the same time as the solution 6 is brought into contact with the InP substrate 5, the fixed part 1 side of the boat is turned positive (plus), Al7 and InAs
InP board 5 with 8 side as negative polarity.
-Solution 6-Al7 and InP substrate 5-Solution 6-InAs
A current is passed between 8 and 8. Al7 and InAs8 are electrically independent and it is possible to control the current value separately, and it is possible to control the current value of Al7 or InAs8 depending on the current value.
The rate of dissolution of InAs 8 into solution 6 is determined.

Al7或いはInAs8の溶解と同時に、InP基板5
上にAlInAs結晶がエレクトロエピタキシ成長す
るが、このAlInAs三元成長層の組成は溶液6へ
のAl7或いはInAs8の溶解速度即ち夫々を通ず
る電流によつて制御することが可能である。本実
施例においては、InP基板5の単位面積につい
て、InAs8側10A/cm2、Al側0.1A/cm2として、20
分間のエレクトロエピタキシ成長により約2μmの
厚さのAl0.5In0.5As成長層を得た。
At the same time as melting Al7 or InAs8, InP substrate 5
An AlInAs crystal is electroepitatically grown thereon, and the composition of this AlInAs ternary growth layer can be controlled by the rate of dissolution of Al7 or InAs8 into the solution 6, ie, by the current flowing through each. In this example, the unit area of the InP substrate 5 is 20 A/cm 2 on the InAs side and 0.1 A/cm 2 on the Al side.
An approximately 2 μm thick Al 0.5 In 0.5 As grown layer was obtained by electroepitaxy growth for 1 minute.

前記実施例の如き本発明によるエレクトロエピ
タキシ成長法においては、従来のLPE成長法の
如き溶液成分濃度の時間的変化を無くし、成長層
の組成を均一にすることが可能である。又この結
果として従来のLPE成長法によつては成長不可
能であつた厚さの成長層を得ることも可能であ
る。
In the electroepitaxy growth method according to the present invention as in the above-mentioned embodiments, it is possible to eliminate the temporal change in the concentration of solution components as in the conventional LPE growth method, and to make the composition of the grown layer uniform. As a result, it is also possible to obtain a grown layer with a thickness that could not be grown using conventional LPE growth methods.

更に電流をエレクトロエピタキシ成長中に故意
に変化することによつて溶液成分の濃度を時間的
に変化させて、成長層の厚さ方向に組成の変化を
与えること、又は必要に応じて溶液成分元よりな
る電極の移動を付加して溶液従つて成長層を構成
する元素数を増減することも可能である。
Furthermore, by intentionally changing the current during electroepitaxy growth, the concentration of the solution components can be changed over time to give a change in the composition in the thickness direction of the grown layer, or if necessary, the concentration of the solution components can be changed over time. It is also possible to increase or decrease the number of elements constituting the solution and thus the growth layer by adding movement of the electrodes.

又、前記実施例においては成長層形成中の温度
を一定温度に保つたが、従来のLPE成長法と同
様の温度制御を付加することも可能である。
Further, in the above embodiments, the temperature during the growth layer formation was kept constant, but it is also possible to add temperature control similar to the conventional LPE growth method.

本発明は以上説明した如く、エレクトロエピタ
キシ法において、溶液の少くとも一成分を含む物
質よりなる電極を溶液に接触させ、基板と該電極
との間に溶液を介する電流を通じ、溶液への該成
分の溶解、従つて成長層の組成を該電流によつて
制御するものであつて、例えば化合物半導体によ
るダブルヘテロ構造の形成等のエピタキシヤル成
長層の形成に大きい効果を有する。
As explained above, the present invention uses an electroepitaxy method in which an electrode made of a substance containing at least one component of a solution is brought into contact with the solution, and a current is passed through the solution between the substrate and the electrode, thereby introducing the component into the solution. The dissolution and therefore the composition of the grown layer are controlled by the current, and it has a great effect on the formation of epitaxially grown layers, such as the formation of double heterostructures of compound semiconductors.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の実施例を示す模式図である。 図において、1はボートの固定部、2はボート
のスライダ、3は絶縁層、4は電極、5はInP基
板、6は溶液、7はAl、8はInAs、9及び9′は
引出導線を示す。
The drawings are schematic diagrams showing embodiments of the present invention. In the figure, 1 is a fixed part of the boat, 2 is a slider of the boat, 3 is an insulating layer, 4 is an electrode, 5 is an InP substrate, 6 is a solution, 7 is Al, 8 is InAs, 9 and 9' are lead wires. show.

Claims (1)

【特許請求の範囲】[Claims] 1 二以上の元素を含む溶液を基板結晶表面に接
触させ、該溶液の成分元素よりなる成長層を形成
するエピタキシヤル成長方法において、該成分元
素の少くとも一を含む物質よりなる電極を該溶液
に接触させ、該基板と該電極との間に該溶液を介
する電流を通じ、前記成長層の組成を該電流によ
り制御することを特徴とするエピタキシヤル成長
方法。
1. In an epitaxial growth method in which a solution containing two or more elements is brought into contact with a substrate crystal surface to form a growth layer made of the component elements of the solution, an electrode made of a substance containing at least one of the component elements is brought into contact with the substrate crystal surface. An epitaxial growth method, characterized in that a current is passed through the solution between the substrate and the electrode, and the composition of the growth layer is controlled by the current.
JP14532581A 1981-09-14 1981-09-14 Epitaxial growth method Granted JPS5845193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14532581A JPS5845193A (en) 1981-09-14 1981-09-14 Epitaxial growth method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14532581A JPS5845193A (en) 1981-09-14 1981-09-14 Epitaxial growth method

Publications (2)

Publication Number Publication Date
JPS5845193A JPS5845193A (en) 1983-03-16
JPH0139999B2 true JPH0139999B2 (en) 1989-08-24

Family

ID=15382546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14532581A Granted JPS5845193A (en) 1981-09-14 1981-09-14 Epitaxial growth method

Country Status (1)

Country Link
JP (1) JPS5845193A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065799A (en) * 1983-09-19 1985-04-15 Fujitsu Ltd Process for crystal growth

Also Published As

Publication number Publication date
JPS5845193A (en) 1983-03-16

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