JPH0140114B2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a partial plating device, particularly a partial plating device suitable for partially plating a target portion to be plated, which has a pair of left and right opposite fork-like tips of the plating object. Regarding.

<Prior art> Conventionally, various techniques have been adopted when partially plating the target part of the connector terminal 2 [described later] as the "fork-shaped tip" of the plating object 1 as shown in FIG. It has been.

This connector terminal 2 is formed in a plurality of comb-like shapes at predetermined intervals on a continuous band-shaped portion 3, and the plating target portion 4 of this connector terminal 2 is separated from the end portion 5 by a predetermined gap. This refers to the side surfaces of the convex portions 6 that are formed to face each other on the left and right sides.

A conventional technique for partially plating the part 4 to be plated is a dipping device that immerses the entire end part 5 including the convex part 6 in a plating tank, and specifies the part to be coated with the plating solution by controlling the liquid level. , or a spray plating device that covers parts that do not require plating with a mask and sprays plating liquid onto the exposed parts [JP-A-126784-1984, JP-A-161084-1984, and JP-A No. 161084. 1955-83180] is generally known as a partial plating device.

<Problems to be Solved by the Invention> However, in the conventional partial plating device, the periphery of the end portion 5 of the connector terminal 2 is uniformly plated, and the area to be plated 4 is not coated. In comparison, since the peripheral part of the plating target part 4 is plated thickly, it is difficult to clearly define the plating area, and therefore, when performing precious metal plating, precious metal is consumed more than necessary.

On the other hand, in spray plating equipment that uses a mask,
Generally, as the plating target part 4 becomes smaller,
Also, as the shape of the plating target part 4 becomes more complex,
It became difficult to completely maintain the mask state during mask processing and plating, and as with the above, precious metals were consumed more than necessary.

Therefore, there has been a desire for a partial plating device that can perform desired partial plating with less precious metal consumption.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a partial plating device that can reduce precious metal consumption by performing partial plating with high precision and efficiency.

<Means for Solving the Problems> The structure of the present invention for achieving the above object will be explained with reference to FIGS. 1 to 4, which correspond to embodiments.

In the partial plating device according to the present invention, a plating liquid supply body 10 interposed between a plating target portion 4 of a connector terminal 2 as a fork-shaped tip of a plating object 1 has inclined guide surfaces 16 on the left and right sides. A mountain-shaped top 17 is provided, and the upper end 1 of this top 17 is
8 or near the upper end thereof, a support 13 is provided with an opening 19 for the plating liquid to ooze out, and a passage 20 for supplying the plating liquid communicating with the opening 19 is formed. line (in the diagram)
PL), and the surfaces of the anode 14 and the top part 17 of the support 13 are coated and wound by moving in the direction [direction of arrow A] intersecting the pass line. It is made up of a mesh body 15 that is flexible and forms a "delivery section" 25 for the plating solution at a portion corresponding to the above-mentioned pass line.

<Operation> According to the above-mentioned means, the "plating object" 1 to be plated is moved by a predetermined pitch, and the plating liquid supply body 1 is moved between the left and right pair of plating target parts 4.
0, the plating liquid 12 is absorbed into the exuding net 15 through the passage 20 of the support 13 through the opening 19 provided at or near the upper end 18 of the top portion 17, thereby infiltrating the net 15. .

This plating liquid 12 is sucked and infiltrated not only into the net 15 near the top 17 of the support 13 but also into the portion corresponding to the side surface of the upper anode 14 due to the capillary action of the net 15 itself. A part of the plating liquid 12 is allowed to seep out from the surface 28 of the mesh body 15 to the outside, thereby constantly supplying fresh plating liquid 12 to the area corresponding to the pass line PL of the plating target area 4.
It forms a "delivery section" 25 for plating solution that can be supplied in an appropriate amount.

The plating target part 4 contacts or approaches the "delivery part" 25 soaked with the plating liquid 12 and maintains a non-contact state, thereby limiting the plating area to only this plating target part 4. The plating liquid 12 is evenly distributed over the entire part 4 to be plated.

By energizing the anode 14 disposed close to the plating target part 4, a high current density can be obtained, and the desired plating can be applied to the plating target part 4 with high precision and efficiency.

Then, the net 15 moves in a direction crossing the pass line PL (in the direction of arrow A) and is wound up to an appropriate length to form a new "delivery section" 25, but the timing for winding this net 15 is can be set regardless of the movement of the plating object 1, and when the plating object 1 is moving continuously or intermittently or when the plating object 1 is stopped, the net body 15 is continuously or intermittently wound up and a new "delivery" is performed. 25 is formed.

Even if the plating target part 4 is directly contacted with the net body 15 and plating is applied in this way,
Care is taken so that only a specific part of the net 15 does not come into contact with the plating target part 4 of the "plating object" 1 and wear out.

<Example> An example of the present invention will be described below with reference to FIGS. 1 to 4.

Incidentally, the same reference numerals are used for parts common to the conventional one, and redundant explanation will be omitted.

First, the plating liquid supply body 10 in the partial plating apparatus 9 according to the present invention is arranged in the plating processing tank 11 and mainly supplies the plating liquid 12, and also includes a support body 13 that supports an anode (described later), and a support body 13 that supports an anode (described later). body 1
Pass line at the upper end of 3 [described later] [PL arrow indicates in the figure]
An anode 14 arranged along the plating liquid 12, and a delivery section for the plating liquid 12, which covers the surfaces of the anode 14 and the top of the support 13 (described later) and can be moved and wound up in a direction crossing the pass line PL. It is mainly composed of a mesh body 15 forming a mesh body 15 [described later].

The support body 13 is made of an insulating material and has a substantially mountain-shaped top portion 17 having inclined guide surfaces 16 on the left and right sides, and an opening 19 for the plating liquid 12 to seep out is provided at the upper end 18 of the top portion 17. A plating liquid supply passage 20 communicating with the opening 19 is formed through the opening 19. A passage forming body 22 having a frame-shaped flow passage 21 is fitted into the passage 20, and one end 23 of the passage forming body 22 protrudes from the opening 19 of the support body 13 to support the anode 14 and the support body 13. The gap portion 22a of the passage forming body 22 protruding from the upper end 18 serves as an opening 19 for the plating liquid 12 to seep out, so that the plating liquid 12 can seep out to the left and right sides of the top portion 17.

Although this embodiment shows an example in which the passage forming body 22 is provided inside the support body 13 to support the anode 14, it is needless to say that the passage forming body 22 is not limited to this. A plurality of recesses may be formed at intervals.

The anode 14 is a round bar-shaped member disposed along the pass line at the upper end 18 of the top 17 of the support body 13, and in the illustrated example, it is in the form of one end 23 of the passage forming body 22.
It is attached and fixed to the connector terminal 2 through the mesh body 15, and is insulated from the connector terminal 2 through the mesh body 15, and the part to be plated 4.
It is formed in the shape of a round bar so that a high current density can be obtained as close as possible to the net body 15, and so that it does not become an obstacle when winding and moving the net body 15, which will be described later.

The net body 15 is capable of retaining the plating liquid 12, and is moved in the direction crossing the pass line PL by the winding devices 24 disposed in the plating liquid 12 on both sides in the direction along the pass line PL. Arrow A direction]
It is said that it can be moved and rolled up freely,
This net 15 covers the periphery of the anode 14 from the inclined guide surface 16 along its surface shape. The area between the opening 19 and the anode 14 is the most constricted part, and has a pair of concave shapes corresponding to the pair of convex portions 6 of the connector terminal 2. Path line
This is a part corresponding to the PL, and serves as a delivery part 25 for the plating liquid 12.

26 is a pump, 27 is a pipe, and 29 is a plating liquid management tank, which pumps the plating liquid 12, collects it, and circulates it.

Next, the usage status will be explained.

In a state where the connector terminal 2 to be plated has moved a predetermined pitch and the plating liquid supply body 10 is interposed between the pair of left and right parts 4 to be plated, the pump 26
The plating liquid 12 pumped by the plating liquid 12 oozes out to both left and right sides of the top portion 17 through the passage 20 and the opening 19. This plating liquid 12 is infiltrated into the mesh 15 near the top 17 and further into the part corresponding to the side surface of the upper anode 14 due to the capillary action of the mesh 15 itself, and a part of the mesh 15 is infiltrated into the mesh 15 near the top 17. It oozes out from the surface 28. The part with the most constricted shape between the opening 19 and the anode 14 is a "delivery part" 25 formed corresponding to the pass line PL of the plating target part 4, and is a "delivery part" 25 where fresh plating liquid 1 is
2 is always supplied in an appropriate amount.

The plating target part 4 of the connector terminal 2 receives the plating liquid 12 exuding from the surface 28 of the net body 15 in contact with or in the vicinity of this "delivery part" 25, and this plating liquid 12 contains a limited plating target. Part 4
It will be applied evenly throughout.

At this time, by energizing the anode 14, a high current density is obtained, and the desired plating can be applied to the plating target portion 4 with high precision and efficiency.

Then, when the plating is completed and the connector terminal 2 moves a predetermined pitch, and the contact or non-contact proximity state between the plating liquid supply body 10 and the connector terminal 2 is released, the mesh body 15 is moved to the pass line by the winding device 24. It is moved in a direction transverse to the PL (in the direction of arrow A) and wound up to an appropriate length, after which a new "delivery section" 25 is formed, and the plating target section 4 is attached to the net body 15. Even when plating is performed by direct contact, only a specific portion of the mesh body 15 does not come into contact with the part to be plated 4 and wear out.

Incidentally, the timing of winding up the mesh body 15 is not limited to only when the contact or proximity state between the plating liquid supply body 10 and the connector terminal 2 is released as in this embodiment;
The "delivery section" 25 may be continuously formed by continuously winding up the net 15 while maintaining contact or proximity between the plating liquid supply body 10 and the plating liquid supply body 10.

FIG. 5 shows another embodiment of the passage forming body 29, in which a plurality of vertical slit-shaped passages 30 are formed, and the upper end portion of each passage 30 is connected to the plating liquid 12.
It is designed to provide an opening 19 for seepage.

The other contents are substantially the same as those in the previous embodiment, so redundant explanation will be omitted.

<Effects> Since the partial plating device according to the present invention has the contents as described above, many effects can be expected, and the main ones are listed below.

(b) A plating liquid delivery section is formed corresponding to the pass line of the plating target area, and an appropriate amount of fresh plating liquid is always supplied there, so that the plating liquid is delivered only to the plating target area and other parts Since there is no need to apply plating to the part to be plated, and even if the area is to be plated, it only receives an appropriate amount of plating liquid seeping out through the mesh, so the plating is not applied to a thickness greater than necessary. This eliminates the need to use more precious metal than is necessary, and the plating solution adheres to the plating target area on the left and right sides of the fork-shaped tip, including the plating target area where only the side surfaces are intended, and prevents the plating process. The amount of precious metal used can be reduced and costs can be reduced compared to the conventional technology, in which the net body moves in a direction crossing the pass line, is wound up to an appropriate length, and is reused as a new one. Since a transfer part for the plating liquid is formed, there is an effect that even if the part to be plated comes into contact with the net, only a specific part of the net will not be worn out. By changing the inclination angle of the top, the size and shape of the anode and the passage forming body, etc., it can be applied to plated objects having various shapes and sizes; (d) The thickness size of the passage forming body, the formed By appropriately setting the number of flow passages, there is an additional effect that the amount and pressure of the plating liquid to be supplied can be easily adjusted.

[Brief explanation of drawings]

FIG. 1 is an overall perspective sectional view showing the operating state of the partial plating device according to the present invention, FIG. 2 is a sectional view seen from the direction of the arrow in FIG. 1, and FIG.
FIG. 4 is a perspective explanatory view showing a passage forming body; FIG. 5 is a passage forming body showing another embodiment; and FIG. The figure is a schematic perspective enlarged explanatory view of a plated object in a conventional example. DESCRIPTION OF SYMBOLS 1... Plating object, 2... Fork-shaped tip (connector terminal), 3... Continuous band-shaped part, 4... Plating target part, 9... Partial plating device, 10... Plating liquid supply body, 12... Plating liquid, 13...Support,
14... Anode, 15... Net body, 16... Inclined guide surface, 17... Top, 18... Upper end, 19...
...Opening, 20...Aisle, 25...Delivery department, PL
...Pass line, A...Pass line crossing direction.

Claims (1)

[Scope of Claims] 1. For a plating object having a pair of left and right opposite plating target parts on a plurality of fork-like tip parts formed from a continuous band-shaped part, a plating target part along the path line of the plating target part and both the left and right pair of plating target parts. A partial plating device in which a plating liquid supply body is disposed interposed between parts to be plated, and electroplating is applied to each part of the plating object that moves in contact with or in close proximity to the plating liquid supply body. The plating liquid supply body has a substantially mountain-shaped top having inclined guide surfaces on the left and right sides, an opening for plating liquid to ooze out at or near the upper end of the top, and a plating liquid communicating with the opening. A support having a supply passage formed therein, a substantially round rod-shaped anode disposed along the pass line at the upper end of the top of the support, and an anode covering the anode and the top surface of the support and extending along the pass line. 1. A partial plating device comprising: a net that can be moved and wound up in intersecting directions and that forms a plating liquid delivery section at a portion corresponding to the pass line.