JPH0142395Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to high frequency equipment such as a television tuner, and more specifically relates to a shield structure for high frequency equipment.

[Prior art and problems]

High-frequency equipment such as a television tuner is internally divided into multiple circuit blocks, and the circuit blocks are separated by a frame and a shield plate that constitute the high-frequency equipment, and the frame and the shield plate are separated by a frame and a shield plate. In order to satisfy the performance of each circuit block, it is necessary to make a close contact with the circuit block.

For this reason, in the past, the joint between the frame and the shield plate was bonded by manual soldering, and this manual work made it difficult to mass-produce, and the quality was also unstable.

This conventional high frequency device will be explained with reference to FIGS. 1 to 3a and 3b. Reference numeral 1 denotes a frame constituting the high frequency device A, and a shield plate 2 is incorporated into the frame 1. The frame body 1 is formed by punching and bending a metal plate, and a plurality of first shield plates 1a, 1b, 1c are integrally formed. In particular, the present invention relates to an improvement in a structure in which a frame and a shield plate are connected by soldering. Grooves 1d, 1e formed in the first shield plates 1a, 1b, 1c of this frame 1,
The second shield plate 2 is engaged with 1f, and the engaged portions are joined by solder.

At this time, the widths of the grooves 1d, 1e, and 1f of the frame 1 are as follows:
Groove 1 of frame 1 must be approximately 1.3 times the plate thickness t of frame 1.
It is known that the life of the mold punch (not shown) for processing the grooves 1d, 1f of the second shield plate 2 and the frame body 1 is significantly reduced.
The gaps e and 1f had to be made relatively wide. Therefore, after molten solder plating is applied to the high frequency device A consisting of the frame body 1 and the shield plate 2 configured as described above, the molten solder 3 filled in the gap will be removed as shown in FIG. 3b, for example. The solder 3 flows to the bottom of the groove 1d and does not adhere to the top of the groove 1d. Therefore, it is necessary to manually solder the upper part of the groove 1d using a soldering iron in a later process, which increases the number of man-hours and because the soldering is done by hand, the amount of solder may vary, resulting in poor quality. It was also becoming unstable.

[Purpose of invention]

The purpose of this invention is to provide a solution to the above-mentioned drawbacks, and it is possible to naturally solder the joint between the frame and the shield plate when surface-treating it with molten solder plating without manual soldering. The purpose is to provide high-frequency equipment that is easy to adhere to, has excellent mass productivity, and has stable quality.

[Example of idea]

FIG. 4a shows an embodiment of the present invention, and is a sectional view taken along line BB' in FIG. FIG. 4b is a diagram showing the state of FIG. 4a after soldering.

In FIG. 4a, the groove 6 formed in the frame 4 is provided by cutting out the frame 4 by press working, and its shape is the same size as the thickness t of the second shield plate 5 or slightly smaller. It has an uneven shape consisting of a wide narrow portion 6a and a wide portion 6b that is, for example, about 1.6 times the thickness t of the second shield plate 5.

The second shield plate 5 is engaged with the groove 6 formed in the frame 4 as described above, and the high frequency device is immersed in a molten solder bath (not shown). In this way, the solder 7 (see FIG. 4b) enters the gap between the second shield plate 5 and the groove 6, thereby filling the groove 6 (gap).

At this time, the solder 7 is prevented from flowing by the narrow portion 6a, and does not flow to the bottom of the groove 6 as in the conventional shield structure, and the second shield plate 5 and the frame 4 are sufficiently bonded. Ru.

Note that in this embodiment, the narrow width portion 6a and the wide width portion 6b are formed at three locations, but
Of course, this number is not limited to this and can be set arbitrarily.

[Function and effect of the idea]

As mentioned above, the high frequency device of the present invention provides an uneven portion in the groove of the frame in which the second shield plate is incorporated,
The convex portion of the groove is close to the shield plate, and the concave portion is separated from the shield plate. Because the convex portion of the groove is close to the second shield plate to be incorporated, the molten solder plating does not flow through the groove 6 of the frame, and the fourth
As shown in Figure b, there is an effect that the solder adheres to the entire groove. Therefore, there is no need to perform manual soldering in the post-process, making it highly suitable for mass production.
Quality is improving. Also, the recess 4 of the frame 4
In b, the groove width in this part is wider than before, and the strength of the mold punch for punching the groove 6 is higher than before, which improves the life of the mold for pressing the frame. It's also effective.

In this way, by providing an uneven part in the groove of the frame into which the shield plate is assembled, it is possible to automate soldering and stabilize the quality of soldering, as well as to reduce the lifespan of the mold that forms the frame. Since an improvement is also observed, this has the practical effect of making it possible to obtain a shield structure with excellent mass productivity.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a high-frequency device, FIGS. 2 and 3 a and b show conventional examples, and A--A in FIG.
A' cross-sectional view, and FIG. 3a is a cross-sectional view taken along line B-B' in FIG. FIG. 3b is a diagram showing a state in which solder plating has been applied to FIG. 3a. 4a and 4b show an embodiment of the present invention, and FIG. 4a is a sectional view taken along line BB' in FIG. 1. FIG. 4b is a diagram showing the state of FIG. 4a after soldering. 1, 4... Frame, 2, 5... Shield plate, 3, 7
...Solder, 4a...Protrusion, 4b...Concave, 6...
Groove, 6a...narrow width part, 6b...wide width part.

Claims (1)

[Scope of utility model registration request] In a high-frequency device comprising a frame made of a metal plate and a shield plate that divides the inside of the frame into a plurality of blocks, the frame has a narrow portion having a width approximately equal to the thickness of the shield plate in the middle portion. 1. A shield structure for high-frequency equipment, comprising a cut groove provided in the cut groove, and the shield plate is engaged with and soldered to the cut groove.