JPH0142632B2 - - Google Patents
Info
- Publication number
- JPH0142632B2 JPH0142632B2 JP58075009A JP7500983A JPH0142632B2 JP H0142632 B2 JPH0142632 B2 JP H0142632B2 JP 58075009 A JP58075009 A JP 58075009A JP 7500983 A JP7500983 A JP 7500983A JP H0142632 B2 JPH0142632 B2 JP H0142632B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- exterior
- resin
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、特に樹脂封止されたリードフレーム
に連なつた集積回路装置をラツキングしない状態
で外装メツキする方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a method of exterior plating without racking an integrated circuit device connected to a resin-sealed lead frame.
集積回路装置はプリント基板へ半田により接合
する際、その接合性を向上させるためにあらかじ
め半田やスズなどの外装メツキが実施され、それ
は一般には樹脂封止されリードフレームに連なつ
た状態で行なわれてきた。 When an integrated circuit device is bonded to a printed circuit board by soldering, the exterior plating with solder or tin is applied in advance to improve the bonding properties, and this is generally done while the device is sealed in resin and connected to a lead frame. It's here.
従来のそのためのメツキ方法は、樹脂封止が完
了がした多数のリードフレームをラツク内のピン
等の保持具へさし込んで組込み、各メツキ処理工
程を経由して行なうものであつた。しかしなが
ら、この様な方法では、ラツクへのリードフレー
ムのピン等保持具による取付け、取り外しに多く
の工数を必要としなければならない欠点が有つ
た。また、適用するリードフレームの寸法が変わ
つた場合、その都度ラツクを用意しておいて変え
なければならない欠点も生じていた。 The conventional plating method for this purpose involves inserting a large number of lead frames, which have been completely resin-sealed, into a holder such as a pin in a rack and assembling them, and going through each plating process. However, this method has the disadvantage that a large number of man-hours are required to attach and detach the lead frame to the rack using holders such as pins. Furthermore, when the dimensions of the lead frame to be applied change, a rack has to be prepared and changed each time.
本発明の目的は、ラツクを用いない外装メツキ
方法を提供するものである。 An object of the present invention is to provide an exterior plating method that does not use a rack.
さらに他の目的とする所は、外装メツキ装置へ
のリードフレームの供給、収納に治具を提供して
作業を自動化するところに有る。 Another purpose is to automate the work by providing a jig for supplying and storing lead frames to an exterior plating device.
すなわち、本発明の要旨とする所は、樹脂封止
されたリードフレームに連なつた集積回路装置を
収納治具から１枚づつ分離してとり出し、連続的
に移動するメツキ装置の瓜に直接クランプしてメ
ツキを行ない、終了したものを再び収納治具へ収
納する外装メツキ方法に有る。 That is, the gist of the present invention is to separate and take out the integrated circuit devices connected to the resin-sealed lead frame one by one from the storage jig, and directly to the melons of the continuously moving plating device. There is an exterior plating method in which the plating is performed by clamping, and the finished product is stored in a storage jig again.
以下、本発明による実施例を図面により説明す
る。 Embodiments according to the present invention will be described below with reference to the drawings.
第１図は樹脂封止されたリードフレームに連な
つた集積回路装置が収納治具に収納された状態を
示すものである。リードフレーム１は収納治具２
の両端コの字型ガイド面にそつてガイドブロツク
３の上に置かれ順次積み重ねられる。第１図で黒
く示したのが樹脂封止部である。 FIG. 1 shows a state in which an integrated circuit device connected to a resin-sealed lead frame is stored in a storage jig. Lead frame 1 is storage jig 2
Both ends of the blocks are placed on the guide block 3 along the U-shaped guide surface and stacked one after another. The resin sealing portion is shown in black in FIG.
第２図は収納治具２からリードフレーム１が順
次１枚づつとり出され、外装メツキ装置瓜に取り
付け、そして外装メツキが完了したものが取り出
され、再び収納治具へ収納される状態を示すもの
である。 Figure 2 shows a state in which lead frames 1 are taken out one by one from the storage jig 2, attached to the exterior plating device, and those on which the exterior plating has been completed are taken out and stored in the storage jig again. It is something.
供給側について、収納治具２に入つたリードフ
レーム１は、ガイドブロツク３がリードフレーム
１の積み重ねの１ピツチ分だけ上昇し、一番上の
リードフレームをキヤリアハンド４がつかみ、供
給ステージ５へ移送し開放する（第２図ａ，ｂ）。
移送されたリードフレーム１はピツクハンド６に
持ちかえ、90゜回転して外装メツキ装置のクラン
プ７の下まで移動し、さらに上昇して開放してい
る瓜７が閉じてフレーム１はクランプされる（第
２図Ｃ）。そして外装メツキが行なわれる。同様
の動作が繰り返えされる。 On the supply side, the lead frame 1 that has entered the storage jig 2 is moved up by the guide block 3 by one pitch of the stack of lead frames 1, the carrier hand 4 grabs the topmost lead frame, and the lead frame 1 is transferred to the supply stage 5. Transfer and release (Fig. 2 a, b).
The transferred lead frame 1 is transferred to the pick hand 6, rotated 90 degrees, moved to below the clamp 7 of the exterior plating device, and further raised to close the open gourd 7 and clamp the frame 1 ( Figure 2C). Exterior plating is then performed. Similar operations are repeated.
収納側について、外装メツキを終了したリード
フレーム１は、瓜７を開放して上昇してきたピツ
クハンド８に持ちかえられ、90゜回転して収納ス
テージ９へ移送する（第２図ｄ，ｅ）。 On the storage side, the lead frame 1 that has undergone exterior plating is transferred to the pick hand 8 that has been raised by opening the gourd 7, rotated 90 degrees, and transferred to the storage stage 9 (FIGS. 2d and 2e).
移送されたリードフレーム１はキヤリアハンド
１０がつかみ、収納治具１１へ移動し、と同時に
ガイドブロツク１２が積み重ね分だけ１ピツチ下
がり、キヤリアハンドが開いて順次積み重ねられ
以後同様の動作が繰り返えされる（第２図ｆ。
尚、各々の収納治具は空や満杯になつた時点で交
換される）。 The transferred lead frame 1 is grabbed by the carrier hand 10 and moved to the storage jig 11, and at the same time, the guide block 12 is lowered by one pitch by the amount of stacking, and the carrier hand is opened and the lead frames 1 are stacked one by one and the same operation is repeated thereafter. (Fig. 2 f.
Note that each storage jig is replaced when it becomes empty or full.)
第３図は前記外装メツキ方法による外装メツキ
装置の機能部を示したものである。樹脂封止され
たリードフレームに連なる集積回路装置は、供給
部１３から１枚づつ送り出され連続的に移動する
瓜１４にくわえられ、処理槽１５を径て一連の外
装メツキ処理を終了し、収納部１６でとり出され
収納される。 FIG. 3 shows the functional parts of the exterior plating device using the exterior plating method. The integrated circuit devices connected to the resin-sealed lead frame are fed out one by one from the supply section 13, held in the continuously moving gourd 14, passed through the processing tank 15, completed a series of exterior plating treatments, and then stored. It is taken out and stored in the section 16.
以上の様な本発明に従つた集積回路装置の外装
メツキ方法によれば、ラツキングが不要となり、
工数が大巾に削減できる。また、適用するリード
フレームの寸法が変わつた場合にその都度ラツク
を変える必要がないという欠点りおいても有利で
ある。 According to the method for plating the exterior of an integrated circuit device according to the present invention as described above, racking is not necessary.
Man-hours can be drastically reduced. Another advantage is that it is not necessary to change the rack each time the dimensions of the lead frame to which it is applied change.
第１図は本発明の一実施例による樹脂封止され
たリードフレームに連なる集積回路装置が収納治
具に納まつた状態の斜視図である。第２図ａ乃至
ｆは本発明の一実施例による外装メツキ方法の動
作順序を示す図である。第３図は本発明の一実施
例による外装メツキ装置機能部の平面図である。
１……リードフレーム、２……収納治具、３…
…ガイドブロツク、４……キヤリアハンド、５…
…供給ステージ、６……ピツクハンド、７……
瓜、８……ピツクハンド、９……収納ステージ、
１０……キヤリアハンド、１１……収納治具、１
２……ガイドブロツク、１３……供給部、１４…
…瓜、１５……処理槽、１６……収納部。
FIG. 1 is a perspective view of an integrated circuit device connected to a resin-sealed lead frame according to an embodiment of the present invention, which is housed in a storage jig. FIGS. 2a to 2f are diagrams showing the operational sequence of an exterior plating method according to an embodiment of the present invention. FIG. 3 is a plan view of a functional part of an exterior plating device according to an embodiment of the present invention. 1... Lead frame, 2... Storage jig, 3...
...Guide block, 4...Carrier hand, 5...
...Supply stage, 6...Pick hand, 7...
Melon, 8...Pick hand, 9...Storage stage,
10...Carrier hand, 11...Storage jig, 1
2... Guide block, 13... Supply section, 14...
...melon, 15...processing tank, 16...storage section.
Claims (1)
収納治具から１枚づつ分離してとり出し、連続的
に移動するメツキ装置の瓜により、直接クランプ
してメツキを行ない、終了したものを再び収納治
具へ収納することを特徴とする集積回路装置の外
装メツキ方法。1. Separate and take out lead frames with a large number of resin-sealed parts one by one from the storage jig, directly clamp and plate them using the continuously moving plating device, and then store the finished pieces again. A method for plating the exterior of an integrated circuit device, characterized by storing it in a jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58075009A JPS59200450A (en) | 1983-04-28 | 1983-04-28 | Sheath plating method of integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58075009A JPS59200450A (en) | 1983-04-28 | 1983-04-28 | Sheath plating method of integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59200450A JPS59200450A (en) | 1984-11-13 |
| JPH0142632B2 true JPH0142632B2 (en) | 1989-09-13 |
Family
ID=13563758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58075009A Granted JPS59200450A (en) | 1983-04-28 | 1983-04-28 | Sheath plating method of integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59200450A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0261094A (en) * | 1988-08-26 | 1990-03-01 | Electroplating Eng Of Japan Co | Supplying/drawing equipment for object to be treated |
-
1983
- 1983-04-28 JP JP58075009A patent/JPS59200450A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59200450A (en) | 1984-11-13 |
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