JPH0143025B2 - - Google Patents

Description

Detailed Description of the Invention The present invention uses water-soluble polyvinyl butyral as a main ingredient, melamine as a crosslinking agent, rapizole as a surfactant, and ethyl alcohol as a solvent on transparent plastics such as glass and acrylic, which are said to be relatively difficult to electroless plate. and water, or 2-hydroxyethyl methacrylate as the main ingredient, a polymerizing agent benzoin ethyl ether, a surfactant trioxyethylene nonylphenol ether,
Manufacture of an encoder slit plate obtained by coating a solution containing ethylene glycol monoethyl ether as a solvent by a dipping, spinner or roll coater method, curing it, and patterning it by selective electrolytic plating using ultraviolet light exposure. It's about the method.

Conventionally, encoder slit plates have been made by etching metal or depositing chromium on a glass substrate to form a chromium coating and patterning it into a desired shape. However, in the case of metal etching, there is a limit to the fine etching of the slit hole diameter, and there is a limit to this as an encoder with a high resolution function. Furthermore, encoder slit plates made by patterning a metallic chromium film obtained by vapor deposition of chromium on glass into a desired shape cannot be made in large quantities or with a large surface area at one time. Furthermore, since vacuum equipment is used, it has been difficult to reduce costs.

The present invention aims to solve these problems, and its purpose is to provide a method for manufacturing an encoder slit plate that has high quality, high resolution function, and can reduce costs.

The gist of the method for manufacturing an encoder slit plate in the present invention is to coat an organic polymer containing water-soluble polyvinyl petyral as a main ingredient, melamine as a crosslinking agent, rabisol as a surfactant, and ethyl alcohol and water as a solvent on a transparent substrate. 2 for coating or main agent
- Forming an organic polymer film containing hydroxyethyl methacrylate, benzoin ethyl ether as a polymerization agent, trioxyethylene nonyl phenol ether as a surfactant, and ethylene glycol monoethyl ether as a solvent, and the organic polymer film a step of forming stannous chloride on the stannous chloride, a step of closely contacting a photomask with a slit pattern formed on the stannous chloride and irradiating it with ultraviolet rays, and patterning the stannous chloride by immersing it in a palladium chloride solution. and an electroless nickel plating step performed on the patterned stannous chloride.

The substrate used in the present invention may be any optically transparent substrate, but acrylic resin, Polyester, polycarbonate resin, CR
-39 resin, V polymer resin, polysulfone resin, polyethersulfone resin, spiran resin, glass, etc. 100μ to several mm as a substrate
A thick one is used. In order to enable electroless plating on these substrates and to improve adhesion, polyvinyl butyral is coated onto a transparent substrate using a solvent, a crosslinking agent, and a surfactant. Alternatively, 2-hydroxyethyl methacrylate is coated using a solvent, a polymerizing agent, and a surfactant. The thickness of these coats is 1000 Å to 30000 Å.
A thickness of 3,000 to 10,000 Å is usually used, taking into account pinholes if the film is too thin and flatness accuracy if it is too thick. These films are applied by a dipping method, a spinner method, a spray method, a roll coater method, etc., and are cured at the upper limit temperature that the substrate can withstand. This organic film improves the wettability of the substrate surface to enable plating, and improves the adhesion of the plating film.
It plays an important role in improving gloss.

Next, electroless plating is performed. Since one of the purposes of this manufacturing method is to reduce costs and shorten the process, we also established a patterning method using selective electroless plating using ultraviolet light exposure to form a slit pattern. The selective electroless plating method using ultraviolet light exposure is as follows: (1) The coated substrate described above is immersed in a SnCl ₂ (acidic HCl) solution and dried after a few minutes. The drying method is 70~
A temperature below 80℃ is suitable. Alternatively, substitution drying using alcohol or Diflon may also be used.

(2) A photomask made of quartz glass is closely attached to the substrate, and ultraviolet rays with a wavelength of 2000 Å or more are irradiated for an appropriate amount of time.

(3) Immerse the substrate in PdCl ₂ (acidic HCl) solution, rinse with water, and then place in an electroless nickel bath for several minutes to plate.

The UV exposure in (2) changes Sn ²⁺ UV ---→ Sn ⁴⁺ , and the reaction in the non-exposed area is reduced by immersion in the PdCl ₂ solution in (3).
Sn ²⁺ + Pd ²⁺ → Sn ⁴⁺ + Pd ⁰ , and it is thought that nickel is precipitated on the palladium metal. Furthermore, since the UV-exposed area is Sn ⁴⁺ , it is impossible to reduce Pd ²⁺ . Therefore, no nickel is deposited.

We take into consideration hardness, adhesion, and low price for the metal fittings.
Ni-P was used. The coating thickness is about 300 Å to 1 μm, and in the case of encoder slit plates, a few pinholes are not a problem as long as the slit side edges are firm, so a thickness of 1000 Å to 3000 Å is sufficient.

The encoder slit plate thus obtained can be formed into a fine pattern, and the cost reduction and process shortening of production cannot be overlooked. moreover,
Since no resist is used, quality can be improved.

Next, the present invention will be explained in detail with reference to examples.

Example 1 Coating components Water-soluble polyvinyl butyral (main agent) Melamine (crosslinking agent) Rapizol (surfactant) 100wt% 2 〃 0.2 〃 Ethyl alcohol water 50Vol% 50 〃 A:B=1:3 Mix well with the solvent Stir. The above mixture was applied to well-washed glass using a dipping method or a spinner method, and was cured by drying at 135° C. for 2 hours. The film thickness at this time is 2000Å
It was hot. Next, the upper substrate was immersed in a 1% SnCl ₂ solution for 1 minute, washed with water, dried at 70°C, and then
Irradiate with V. (The irradiation time varies depending on the capacity of the ultraviolet exposure equipment.) After washing the substrate with water for about one minute using a PdCl ₂ solution (in the experiment, a 5-fold dilution of Red Schumer 608 manufactured by Nippon Kanigen Co., Ltd.), the Ni-P
Ni film thickness was immersed in a metal bath (Shiuma S680 manufactured by Nippon Kanigen Co., Ltd. diluted 8 times with pure water) at 45°C for 4 minutes.
Obtained 2500Å. Adhesion was also good, and the plating film was uniform.

Example 2 Coating component 2-Hydroxyethyl methacrylate (base ingredient) 20 c.c. Benzoin ethyl ether (polymerization agent) 0.1 g Trioxyethylene nonyl phenol ether (surfactant) 1 g Ethylene glycol monoethyl ether (solvent) 80 c.c. Stir and mix the above ingredients thoroughly and apply the mixture onto thoroughly cleaned glass using the dipping method.
It was cured by polymerization for 45 hours at ±5°C. The coating thickness at this time was 1.4 μm. The method for forming a selective electroless plating film by exposure to ultraviolet light is as described in Example 1 below.

Example 3 Using the coating components of Example 1, a film was formed on an acrylic board. The preparation method was to mix and stir, apply by spinner method, and harden by drying at 80° C. for 5 hours. The film thickness was narrowed down to between 1800 Å and 2200 Å. The method for forming a selective electroless plating film by exposure to ultraviolet light is as described in Example 1 below. As described above, according to the present invention, since an organic polymer film having the above-described structure is formed on a transparent substrate, the adhesion between this organic polymer film and the stannous chloride formed thereon is improved. As a result, the contour shape of the pattern formed on this stannous chloride will be formed accurately following the contour shape of the pattern on the photomask, and the electroless The outline shape of the pattern of the nickel layer formed by the nickel plating process is also formed with extremely high precision, and has the effect that fine patterns can be formed. In addition, compared to the conventional technology of forming a metallic chromium film on glass, for example, the cost is low because it cannot be made in large quantities or with a large surface area at once, and there are no constraints such as the need for vacuum equipment. It also has the advantage that it can be manufactured in a number of ways.

Claims (1)

[Claims] 1 On a transparent substrate, an organic polymer film containing water-soluble polyvinyl petyral as a main ingredient, melamine as a crosslinking agent, Ravisol as a surfactant, ethyl alcohol and water as a solvent, or 2-hydroxyethyl methacrylate as a main ingredient, and a polymerization agent. a step of forming an organic polymer film containing benzoin ethyl ether as a surfactant, trioxyethylene nonyl phenol ether as a surfactant, and ethylene glycol monoethyl ether as a solvent; and forming stannous chloride on the organic polymer film. a step of closely contacting a photomask with a slit pattern formed on the stannous chloride and irradiating it with ultraviolet rays; a step of patterning the stannous chloride by being immersed in a palladium chloride solution; A method for manufacturing an encoder slit plate, comprising the step of electroless nickel plating performed on the stannous chloride.