JPH0146549B2 - - Google Patents

Info

Publication number
JPH0146549B2
JPH0146549B2 JP61235258A JP23525886A JPH0146549B2 JP H0146549 B2 JPH0146549 B2 JP H0146549B2 JP 61235258 A JP61235258 A JP 61235258A JP 23525886 A JP23525886 A JP 23525886A JP H0146549 B2 JPH0146549 B2 JP H0146549B2
Authority
JP
Japan
Prior art keywords
adhesive
layer
film
conductive particles
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61235258A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6389584A (ja
Inventor
Toshuki Kawaguchi
Hideki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP61235258A priority Critical patent/JPS6389584A/ja
Publication of JPS6389584A publication Critical patent/JPS6389584A/ja
Publication of JPH0146549B2 publication Critical patent/JPH0146549B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
JP61235258A 1986-10-02 1986-10-02 異方導電性接着膜 Granted JPS6389584A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61235258A JPS6389584A (ja) 1986-10-02 1986-10-02 異方導電性接着膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61235258A JPS6389584A (ja) 1986-10-02 1986-10-02 異方導電性接着膜

Publications (2)

Publication Number Publication Date
JPS6389584A JPS6389584A (ja) 1988-04-20
JPH0146549B2 true JPH0146549B2 (2) 1989-10-09

Family

ID=16983417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61235258A Granted JPS6389584A (ja) 1986-10-02 1986-10-02 異方導電性接着膜

Country Status (1)

Country Link
JP (1) JPS6389584A (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JP3326806B2 (ja) * 1991-12-26 2002-09-24 扇化学工業株式会社 回路接続用異方性導電接着剤
DE4228312A1 (de) * 1992-08-26 1994-03-10 Licentia Gmbh Ultraschallmotor mit einem metallischen Schwingkörper als Stator
JPH08111124A (ja) * 1994-10-11 1996-04-30 Sony Chem Corp 異方導電性接着剤フィルム
JP3622792B2 (ja) * 1994-11-25 2005-02-23 日立化成工業株式会社 接続部材及び該接続部材を用いた電極の接続構造・接続方法
JP4896585B2 (ja) * 2006-05-22 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続方法
JP4720814B2 (ja) * 2007-10-29 2011-07-13 住友電気工業株式会社 配線板の接続方法
JP6785126B2 (ja) * 2016-10-31 2020-11-18 日鉄パイプライン＆エンジニアリング株式会社 導線付きパイプラインおよび導線付きパイプラインの製造方法

Also Published As

Publication number Publication date
JPS6389584A (ja) 1988-04-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees