JPH0146550B2 - - Google Patents

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention relates to a sealing member for a container filled and stored with a chemical used in the manufacture of semiconductors. Conventional Technology Advances in microfabrication technology for integrated circuits, transistors, etc. have been remarkable, and requirements for quality control of organic chemicals such as resists, developers, and rinse solutions used in their manufacture are becoming increasingly strict. In particular, the contamination of fine particles and foreign matter that directly affects product yield is contraindicated, so the liquid is usually microfiltered and filled into a clean container in a clean environment (in a clean room) to become a product. Generally, the container used is a glass bottle sealed with an inner lid made of plastic such as polyethylene, or a corrosion-resistant metal container sealed with rubber packing such as NBR or silicone rubber. However, during storage in such a container, fine particles and foreign matter get mixed into the contents, which have been carefully filtered to be pinhole-free, and when used for semiconductor manufacturing, pinholes occur during the resist coating process. There is a problem in that defects occur during pattern formation. In order to solve this problem, the present inventors first investigated the cause of the contamination of fine particles and foreign matter. As a result, the plastic inner lid or rubber packing used as a sealing member of the container was damaged by the drug contents, and high-boiling compounds eluted from the sealing member became the cause of fine particles and foreign matter. I found out that there is. Problems to be Solved by the Invention As a result of intensive study in order to solve the drawbacks of the sealing members currently in use, the present inventors have discovered the use of a fluorine-containing polymer as a member of the liquid-contacting part of the container. The inventors have discovered that this problem can be solved, and have completed the present invention. Means for Solving the Problems An object of the present invention is to prevent the contamination of fine particles and foreign matter when semiconductor chemicals are stored in containers, and to reduce the occurrence of pinholes in the resist coating process. This object of the present invention is achieved by using a fluorine-containing polymer as a liquid contact member of a semiconductor drug storage container. The fluorine-containing polymer used in the present invention is not particularly limited, and any so-called fluorine resin or fluorine rubber can be used. Examples include copolymers of vinylidene fluoride and hexafluoropropene, chlorotrifluoroethylene, pentafluoropropene, tetrafluoroethylene, perfluoroalkoxyfluoroethylene, and the like. The container for storing the drug used in the present invention is not particularly limited, and may be either a currently used glass bottle or a corrosion-resistant metal container. The semiconductor chemicals to which the present invention is applied are resist fixing agents such as hexamethyldisilazane, silane coupling agents, and titanate coupling agents. EXAMPLES The present invention will be described in more detail with reference to Examples below. Example 1 Hexamethyldisilazane (hereinafter abbreviated as HMDS), which had been precisely filtered with a 0.22 micron filter, and polyisoprene-based negative photoresist (trade name OMR83 (Tokyo Ohka Kogyo Co., Ltd.) were placed in a glass bottle that had been precisely cleaned in a clean room. )), novolak positive photoresist (product name: OFPR)
―800 manufactured by Tokyo Ohka Kogyo Co., Ltd.) respectively, and fill them with
The container was sealed tightly with an inner lid made of the material shown in 1. The container was placed on its side for 1 minute once a day at room temperature, and stored for 1 month. Pinholes during resist application were measured. The results are shown in Table-2.

[Table] Carbon polymer pinhole measurement method 1 HMDS pinhole measurement After spin-coating HMDS on a silicon wafer having a silicon oxide layer with a thickness of 4000 Å by a conventional method, positive photoresist (product name
OFPR800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spin-coated onto the silicon wafer and baked at a temperature of 90°C for 20 minutes to form a photoresist film with a thickness of 1 μm. Surface defect inspection equipment (Surf S Scan)
The number of pin poles was measured using a Tencor Co., Ltd.).
The number of pinpoles per unit area (1 cm ² ) was measured five times, and the average value was taken as the number of pinpoles. 2 Number of photoresist pinholes Spin coating on a silicon wafer with a 4000 Å thick silicon oxide layer using a conventional method, and at a temperature of 85°C.
The measurement was carried out in exactly the same manner as in the case of HMDS pinhole measurement, except that a photoresist film with a thickness of 1 μm was formed by prebaking for 20 minutes.

[Table] Effects of the Invention As shown in the above-mentioned examples of the present invention and comparative examples, according to the present invention, semiconductor chemicals can be stably stored for a long period of time in the same state as when they were filled. Therefore, quality control of chemicals for semiconductors becomes extremely easy, and this invention can be said to be useful for semiconductor manufacturing.

Claims (1)

[Claims] 1. A storage container member for semiconductor chemicals, characterized in that a fluorine-containing polymer is used as a liquid contacting member of the resist fixer storage container for semiconductors.