JPH0153636B2 - - Google Patents
Info
- Publication number
- JPH0153636B2 JPH0153636B2 JP59058658A JP5865884A JPH0153636B2 JP H0153636 B2 JPH0153636 B2 JP H0153636B2 JP 59058658 A JP59058658 A JP 59058658A JP 5865884 A JP5865884 A JP 5865884A JP H0153636 B2 JPH0153636 B2 JP H0153636B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- prepreg
- surface layer
- cem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
本発明は、打抜き加工性が良好な金属箔張エポ
キシ樹脂積層板に関する。
近年、印刷配線板としては、打抜き加工性が良
好であり一般性能として耐熱性、電気性能に優れ
るCEM−１材、すなわち中間層が紙基材、表面
層がガラス布基材の金属箔張エポキシ樹脂積層板
の需要が増大している。高密度配線化により、現
在では２mmφのランドに１mmφの部品取付け用穴
を打抜き加工にて明ける事も多くなつた。しか
し、現在市販されるCEM−１材を用い、前記打
抜き加工を行なうと、後工程の部品の半田付け工
程、あるいは部品の足切り工程等においてランド
がはがれる現象が起こる。この現象は、高温で打
抜く場合、打抜きプレスのプレス能力が不足する
場合に特に顕著となる。このような状況から、
CEM−１材としては高密度配線においても打抜
き加工性の優れた素材の開発が望まれている。
本発明は、CEM−１材、すなわち中間層が紙
基材、表面層がガラス布基材のエポキシ樹脂金属
箔張り積層板の欠点がある打抜き加工性を向上さ
せることを目的とするものである。
本発明者は、打抜き加工性を向上させる為、
CEM−１材の表面層であるガラス布基材エポキ
シ樹脂層及び中間層である紙基材エポキシ樹脂層
の硬さと打抜き加工性の関係を調べた結果、表面
層であるガラス布基材エポキシ樹脂層中のエポキ
シ樹脂は金属箔との接着（JIS−Ｃ−6481）を良
好にする為、ある程度の硬さを保持させる必要が
あり、一方、中間層のエポキシ樹脂は、CEM−
１材の打抜き剪断強度を下げ、打抜き穴仕上りを
良好とし、ランド周辺に生じるクラツクを少なく
し、ランドの密着力を向上させるべくやわらかく
する必要があるとの知見を得た。一般に、表面層
と中間層に異なつたエポキシ樹脂を用いたCEM
−１材には、第１図に示すように粘弾性曲線に、
温度Tg1及びTg2（ガラス転移温度）において極
大点があらわれ、このTg1及びTg2はエポキシ樹
脂の硬さに関係する。
そこで本発明は、中間層を紙基材、表面層をガ
ラス布基材とした金属箔張エポキシ樹脂積層板に
おいて、中間層のエポキシ樹脂のガラス転移温度
（Tg2）を表面層のエポキシ樹脂のガラス転移温
度（Tg1）より20〜50℃低くしたものである。
本発明の詳細は次の通りであある。
表面層に用いられるエポキシ樹脂組成物は、主
剤としてビスフエノール型エポキシ樹脂あるいは
難燃性エポキシ樹脂等が使用され、Tg1＝135℃
±10℃程度が好ましい。Tg1が125℃より低くな
ると加温時の金属箔接着強さ（JIS−Ｃ−6481）
が低下し、またTg1が145℃より高くなると打抜
き時に表面層にクラツクが入りやすくなり、打抜
き加工には適さなくなる。
中間層に用いられるエポキシ樹脂組成物は主剤
としてビスフエノール型エポキシ樹脂、難燃性エ
ポキシ樹脂及び可撓性エポキシ樹脂等が使用さ
れ、そのガラス転移温度Tg2はTg1に比較し20〜
50℃低くするものである。Tg1−Tg2＜20℃であ
れば表面層と中間層の硬さはほぼ同程度であり、
打抜き剪断強度を下げる事ができず、打抜きプレ
スの能力が不足する場合には打抜き加工を行なう
ランド周辺に微小なクラツクが入りランド剥れを
起こす。また、Tg1−Tg2＞50℃であれば表面層
中のガラス布が切断できなくなりランド剥れが生
じやすくなるのと同時に、中間層に層間剥離が発
生するなど打抜き加工性は悪くなる。
次に、本発明の実施例を説明する。
実施例
平織ガラス布（旭シユエーベル製、＃7628）
に、ビスフエノール型エポキシ樹脂（住友化学
製、ESA−001）45部、難燃性エポキシ樹脂（住
友化学製、ESB−400）39部、フエノールノボラ
ツク型エポキシ樹脂（ダウケミカル製、
DEN438）16部、ジシアンジアミド３部を配合し
てなる樹脂組成物を樹脂量40重量％となるように
含浸、乾燥してプリプレグＡ−１を得た。
厚さ10ミルスのコツトンリンター紙（ダイセル
製）に、ESB−400を65部、ESA−001を５部、
可撓性エポキシ樹脂（シエル化学製、Ep−871）
30部、ノボラツク型フエノール樹脂（大日本イン
キ製、TD−2093）25部を配合してなる樹脂組成
物を樹脂量60重量％となるように含浸乾燥してプ
リプレグＢ−１を得た。
プリプレグＢ−１を中間層に、プリプレグＡ−
１を表面層に、更に表面に厚さ35μの銅箔を重ね
て圧力100Kg／cm2、温度150℃で80分間加熱加圧
し、厚さ1.6mmのCEM−１材を得た。
比較例 １
実施例と同じコツトンリンター紙に、ESB−
400を65部、Ep−871を35部、TD−2093を25部配
合してなる樹脂組成物を樹脂量60重量％となるよ
うに含浸、乾燥してプリプレグＢ−２を得た。
プリプレグＡ−１、プリプレグＢ−２、銅箔を
プリプレグＢ−２を中間層にして実施例と同様に
組合せ、実施例と同一条件で加熱加圧して厚さ
1.6mmのCEM−１材を得た。
比較例 ２
実施例と同じコツトンリンター紙に、ESB−
400を65部、ESA−001を35部、TD−2093を25部
配合してなる樹脂組成物を樹脂量60重量％となる
ように含浸、乾燥してプリプレグＢ−３を得た。
プリプレグＡ−１、プリプレグＢ−３、銅箔を
プリプレグＢ−３を中間層にして実施例と同様に
組合せ、実施例と同一条件で加熱加圧して厚さ
1.6mmのCEM−１材を得た。
比較例 ３
実施例と同じ平織りガラス布に、ESA−001を
５部、ESB−400を65部、Ep−871を30部、TD−
2093を25部配合してなる樹脂組成物を樹脂量40重
量％になるよう含浸、乾燥してプリプレグＡ−２
を得た。
プリプレグＡ−２、プリプレグＢ−１、銅箔を
プリプレグＡ−２を表面層にして実施例と同様に
組合せ、実施例と同一条件で加熱加圧して厚さ
1.6mmのCEM−１材を得た。
以上、実施例、比較例で得たCEM−１材の特
性試験結果を第１表に示す。
The present invention relates to a metal foil-clad epoxy resin laminate having good punching workability. In recent years, CEM-1 material, which has good punching workability and excellent general performance in terms of heat resistance and electrical performance, has been used for printed wiring boards, i.e., metal foil-clad epoxy with a paper base for the intermediate layer and a glass cloth base for the surface layer. Demand for resin laminates is increasing. Due to high-density wiring, it is now common to use punching to punch out holes for mounting 1 mm diameter parts on 2 mm diameter lands. However, when the punching process is performed using currently commercially available CEM-1 material, a phenomenon occurs in which the lands come off during the soldering process of the parts or the cutting process of the parts in the subsequent process. This phenomenon becomes particularly noticeable when punching at high temperatures or when the punching press has insufficient pressing capacity. From this situation,
As a CEM-1 material, it is desired to develop a material with excellent punching workability even for high-density wiring. The purpose of the present invention is to improve the punching workability of CEM-1 material, which is an epoxy resin metal foil-clad laminate in which the intermediate layer is a paper base and the surface layer is a glass cloth base. . In order to improve punching workability, the present inventor has
As a result of investigating the relationship between the hardness and punching workability of the glass cloth-based epoxy resin layer that is the surface layer of CEM-1 material and the paper-based epoxy resin layer that is the intermediate layer, we found that the glass cloth-based epoxy resin that is the surface layer The epoxy resin in the layer needs to maintain a certain degree of hardness in order to have good adhesion with the metal foil (JIS-C-6481).On the other hand, the epoxy resin in the middle layer is CEM-
We found that it is necessary to lower the punching shear strength of the material, improve the finish of the punched holes, reduce cracks around the land, and make the land softer to improve its adhesion. Generally, CEM uses different epoxy resins for the surface layer and the middle layer.
-1 material has a viscoelastic curve as shown in Figure 1.
Maximum points appear at temperatures Tg 1 and Tg 2 (glass transition temperature), and these Tg 1 and Tg 2 are related to the hardness of the epoxy resin. Therefore, the present invention aims to improve the glass transition temperature (Tg 2 ) of the epoxy resin in the intermediate layer by adjusting the glass transition temperature (Tg 2 ) of the epoxy resin in the surface layer in a metal foil-clad epoxy resin laminate in which the intermediate layer is a paper base material and the surface layer is a glass cloth base material. The temperature is 20 to 50°C lower than the glass transition temperature (Tg 1 ). The details of the invention are as follows. The epoxy resin composition used for the surface layer uses bisphenol type epoxy resin or flame-retardant epoxy resin as the main component, and has a Tg 1 = 135°C.
A temperature of about ±10°C is preferable. When Tg 1 is lower than 125℃, the metal foil adhesion strength when heated (JIS-C-6481)
If the temperature decreases and Tg 1 becomes higher than 145°C, cracks will easily form in the surface layer during punching, making it unsuitable for punching. The epoxy resin composition used for the intermediate layer uses bisphenol type epoxy resin, flame retardant epoxy resin, flexible epoxy resin, etc. as the main component, and its glass transition temperature Tg 2 is 20 to 20% compared to Tg 1 .
It lowers the temperature by 50℃. If Tg 1 −Tg 2 <20℃, the hardness of the surface layer and the intermediate layer are almost the same,
If the punching shear strength cannot be lowered and the punching press capacity is insufficient, minute cracks will form around the land where the punching process is performed, causing the land to peel off. Further, if Tg 1 −Tg 2 >50° C., the glass cloth in the surface layer cannot be cut and land peeling is likely to occur, and at the same time, interlayer peeling occurs in the intermediate layer, resulting in poor punching workability. Next, examples of the present invention will be described. Example: Plain woven glass cloth (manufactured by Asahi Schuebel, #7628)
45 parts of bisphenol type epoxy resin (manufactured by Sumitomo Chemical, ESA-001), 39 parts of flame retardant epoxy resin (manufactured by Sumitomo Chemical, ESB-400), phenol novolac type epoxy resin (manufactured by Dow Chemical,
A resin composition containing 16 parts of DEN438) and 3 parts of dicyandiamide was impregnated to a resin amount of 40% by weight, and dried to obtain prepreg A-1. 65 parts of ESB-400, 5 parts of ESA-001, on 10 mils thick cotton linter paper (manufactured by Daicel).
Flexible epoxy resin (Ciel Chemical, Ep-871)
Prepreg B-1 was obtained by impregnating and drying a resin composition containing 30 parts and 25 parts of novolak type phenolic resin (TD-2093, manufactured by Dainippon Ink) to a resin amount of 60% by weight. Prepreg B-1 as the middle layer, prepreg A-
1 as a surface layer, and a 35 μm thick copper foil was further layered on the surface and heated and pressed at a pressure of 100 Kg/cm 2 and a temperature of 150° C. for 80 minutes to obtain a CEM-1 material with a thickness of 1.6 mm. Comparative Example 1 ESB-
Prepreg B-2 was obtained by impregnating a resin composition containing 65 parts of 400, 35 parts of Ep-871, and 25 parts of TD-2093 to a resin amount of 60% by weight and drying. Prepreg A-1, prepreg B-2, and copper foil were combined in the same manner as in the example with prepreg B-2 as an intermediate layer, and heated and pressed under the same conditions as in the example to determine the thickness.
A 1.6 mm CEM-1 material was obtained. Comparative Example 2 ESB-
A resin composition containing 65 parts of 400, 35 parts of ESA-001, and 25 parts of TD-2093 was impregnated to a resin amount of 60% by weight, and dried to obtain prepreg B-3. Prepreg A-1, prepreg B-3, and copper foil were combined in the same manner as in the example with prepreg B-3 as an intermediate layer, and heated and pressed under the same conditions as in the example to determine the thickness.
A 1.6 mm CEM-1 material was obtained. Comparative Example 3 5 parts of ESA-001, 65 parts of ESB-400, 30 parts of Ep-871, and TD-
A resin composition containing 25 parts of 2093 is impregnated to a resin content of 40% by weight and dried to produce prepreg A-2.
I got it. Prepreg A-2, prepreg B-1, and copper foil were combined in the same manner as in the example with prepreg A-2 as the surface layer, and heated and pressed under the same conditions as in the example to determine the thickness.
A 1.6 mm CEM-1 material was obtained. Table 1 shows the characteristics test results of the CEM-1 materials obtained in the Examples and Comparative Examples.
【表】
第１表から明らかなように、本発明では、２mm
φのランドに打抜き加工により１mmφの部品取り
付け用穴を明けられる事から高密度配線化への市
場ニーズに充分対応でき、その工業的価値は極め
て大である。[Table] As is clear from Table 1, in the present invention, 2 mm
Since it is possible to punch out holes for mounting parts of 1 mm diameter in the φ land, it can fully meet the market needs for high-density wiring, and its industrial value is extremely large.
図面は自由減衰型粘弾性測定装置（昇温速度２
℃／min使用によるCEM−１材の粘弾性曲線の
一例を示す曲線図である。
The drawing shows a free damping type viscoelasticity measurement device (heating rate 2
It is a curve diagram which shows an example of the viscoelastic curve of CEM-1 material by using °C/min.
Claims (1)
た金属箔張エポキシ樹脂積層板において、中間層
のエポキシ樹脂のガラス転移温度（Tg2）を表面
層のエポキシ樹脂のガラス転移温度（Tg1）より
20〜50℃低くしたことを特徴とする金属箔張エポ
キシ樹脂積層板。1 In a metal foil-clad epoxy resin laminate with a paper base as the intermediate layer and a glass cloth base as the surface layer, the glass transition temperature (Tg 2 ) of the epoxy resin in the intermediate layer is the glass transition temperature (Tg 2 ) of the epoxy resin in the surface layer. From Tg 1 )
A metal foil-clad epoxy resin laminate featuring a temperature lowered by 20 to 50°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5865884A JPS60201944A (en) | 1984-03-27 | 1984-03-27 | Metallic foil lined epoxy resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5865884A JPS60201944A (en) | 1984-03-27 | 1984-03-27 | Metallic foil lined epoxy resin laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201944A JPS60201944A (en) | 1985-10-12 |
| JPH0153636B2 true JPH0153636B2 (en) | 1989-11-15 |
Family
ID=13090688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5865884A Granted JPS60201944A (en) | 1984-03-27 | 1984-03-27 | Metallic foil lined epoxy resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201944A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319248A (en) * | 1986-07-14 | 1988-01-27 | 松下電工株式会社 | Metallic foil-lined laminated board |
| JP2501031B2 (en) * | 1986-07-14 | 1996-05-29 | 松下電工株式会社 | Metal foil laminated board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243235B2 (en) * | 1972-11-21 | 1977-10-28 | ||
| JPS517505A (en) * | 1974-07-08 | 1976-01-21 | Yoshiaki Ichikawa | Sentanniukio sonyushita tomeikanoheisetsushita kyuyuhoosu |
| JPS5114967A (en) * | 1974-07-27 | 1976-02-05 | Sumitomo Bakelite Co | |
| JPS5129911A (en) * | 1974-09-06 | 1976-03-13 | Alps Electric Co Ltd | JIKIHETSUDONIOKERUHOORUDOKEESU NO SEIZOHOHO |
| JPS6210844Y2 (en) * | 1979-07-12 | 1987-03-14 |
-
1984
- 1984-03-27 JP JP5865884A patent/JPS60201944A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60201944A (en) | 1985-10-12 |
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