JPH0155970B2 - - Google Patents

Info

Publication number
JPH0155970B2
JPH0155970B2 JP28181884A JP28181884A JPH0155970B2 JP H0155970 B2 JPH0155970 B2 JP H0155970B2 JP 28181884 A JP28181884 A JP 28181884A JP 28181884 A JP28181884 A JP 28181884A JP H0155970 B2 JPH0155970 B2 JP H0155970B2
Authority
JP
Japan
Prior art keywords
wafer
cutting
pressure sensor
pressure
sensitive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP28181884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61149316A (ja
Inventor
Yoshiteru Oomura
Hiroshi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP59281818A priority Critical patent/JPS61149316A/ja
Publication of JPS61149316A publication Critical patent/JPS61149316A/ja
Publication of JPH0155970B2 publication Critical patent/JPH0155970B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Pressure Sensors (AREA)
JP59281818A 1984-12-24 1984-12-24 圧力センサウエハの切断方法 Granted JPS61149316A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59281818A JPS61149316A (ja) 1984-12-24 1984-12-24 圧力センサウエハの切断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59281818A JPS61149316A (ja) 1984-12-24 1984-12-24 圧力センサウエハの切断方法

Publications (2)

Publication Number Publication Date
JPS61149316A JPS61149316A (ja) 1986-07-08
JPH0155970B2 true JPH0155970B2 (th) 1989-11-28

Family

ID=17644419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59281818A Granted JPS61149316A (ja) 1984-12-24 1984-12-24 圧力センサウエハの切断方法

Country Status (1)

Country Link
JP (1) JPS61149316A (th)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110671A (ja) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd 半導体圧力センサの測定方法
JPS63110672A (ja) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd 半導体圧力センサの測定方法
US9034666B2 (en) 2003-12-29 2015-05-19 Vladimir Vaganov Method of testing of MEMS devices on a wafer level
CN101341459B (zh) * 2006-01-05 2012-05-30 弗拉多米尔·瓦格诺夫 三维力输入控制器件及其制造
JP2015133460A (ja) * 2014-01-16 2015-07-23 株式会社ディスコ ウェーハの分割方法
JP6817854B2 (ja) * 2017-02-28 2021-01-20 株式会社ディスコ 樹脂パッケージ基板の分割方法

Also Published As

Publication number Publication date
JPS61149316A (ja) 1986-07-08

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