JPH0158936U - - Google Patents

Info

Publication number
JPH0158936U
JPH0158936U JP15437587U JP15437587U JPH0158936U JP H0158936 U JPH0158936 U JP H0158936U JP 15437587 U JP15437587 U JP 15437587U JP 15437587 U JP15437587 U JP 15437587U JP H0158936 U JPH0158936 U JP H0158936U
Authority
JP
Japan
Prior art keywords
curing
resin
kneading
filler
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15437587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15437587U priority Critical patent/JPH0158936U/ja
Publication of JPH0158936U publication Critical patent/JPH0158936U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図、第４図は本考案に係る樹脂タブレツトを製造
する装置を示す構成図、第３図は従来の樹脂タブ
レツトを示す断面図である。 １……タブレツト、２……熱硬化性樹脂配合物
。 Fig. 1 is a sectional view showing one embodiment of the present invention;
4 are block diagrams showing an apparatus for manufacturing a resin tablet according to the present invention, and FIG. 3 is a sectional view showing a conventional resin tablet. 1... Tablet, 2... Thermosetting resin compound.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] エポキシ樹脂、硬化剤、充填剤を主成分とし、
これらを加熱混練して硬化させてなる熱硬化性樹
脂配合物を主体としてペレツト状に成形したこと
を特徴とする半導体封止用樹脂タブレツト。 The main ingredients are epoxy resin, curing agent, and filler.
A resin tablet for semiconductor encapsulation, characterized in that it is formed into a pellet shape mainly using a thermosetting resin compound obtained by heat-kneading and curing these.
JP15437587U 1987-10-08 1987-10-08 Pending JPH0158936U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15437587U JPH0158936U (en) 1987-10-08 1987-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15437587U JPH0158936U (en) 1987-10-08 1987-10-08

Publications (1)

Publication Number Publication Date
JPH0158936U true JPH0158936U (en) 1989-04-13

Family

ID=31431044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15437587U Pending JPH0158936U (en) 1987-10-08 1987-10-08

Country Status (1)

Country Link
JP (1) JPH0158936U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035103A (en) * 1989-06-01 1991-01-10 Hitachi Ltd Tablet manufacturing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035103A (en) * 1989-06-01 1991-01-10 Hitachi Ltd Tablet manufacturing equipment

Similar Documents

Publication Publication Date Title
JPH0158936U (en)
JPS6382945U (en)
JPS6185159U (en)
JPH0245637U (en)
JPH0195756U (en)
JPS59123337U (en) Resin composition tablet for semiconductor encapsulation
JPS6397223U (en)
JPH024258U (en)
JPH0361354U (en)
JPS61140532U (en)
JPH0252443U (en)
JPS5877046U (en) Resin material for semiconductor resin encapsulation molding
JPS6163843U (en)
JPS61106044U (en)
JPH0160547U (en)
JPS62126835U (en)
JPS62149846U (en)
JPH0170350U (en)
JPH02116745U (en)
JPS61102055U (en)
JPH01139443U (en)
JPS63106611U (en)
JPS6439635U (en)
JPS62140741U (en)
JPS6450442U (en)