JPH0160576U - - Google Patents
Info
- Publication number
- JPH0160576U JPH0160576U JP15592387U JP15592387U JPH0160576U JP H0160576 U JPH0160576 U JP H0160576U JP 15592387 U JP15592387 U JP 15592387U JP 15592387 U JP15592387 U JP 15592387U JP H0160576 U JPH0160576 U JP H0160576U
- Authority
- JP
- Japan
- Prior art keywords
- powder coating
- circuit board
- coating film
- printed circuit
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は、この考案の一実施例に係るハイブリ
ツドＩＣの粉体塗装前の印刷回路基板を示す分解
斜視図、第２図は、同ハイブリツドＩＣの外観斜
視図、第３図は、同ハイブリツドＩＣの第２図
―線における要部断面図、第４図は、従来のハ
イブリツドＩＣの要部断面図である。
１：ハイブリツドＩＣ、２：印刷回路基板、４
：ＤＩＰ―ＩＣ、５：樹脂枠、５ａ，５ｂ：側面
、６：粉体塗装膜。
FIG. 1 is an exploded perspective view showing a printed circuit board before powder coating of a hybrid IC according to an embodiment of the invention, FIG. 2 is an external perspective view of the hybrid IC, and FIG. FIG. 4 is a cross-sectional view of the main part of the conventional hybrid IC taken along the line in FIG. 2. 1: Hybrid IC, 2: Printed circuit board, 4
: DIP-IC, 5: Resin frame, 5a, 5b: Side surface, 6: Powder coating film.
Claims (1)
体塗装膜で被覆してなる電子部品において、 前記回路素子の側部を囲い、その外側面に傾斜
を有し、前記粉体塗装膜で被覆される枠体を前記
印刷回路基板に装着したことを特徴とする電子部
品。[Claims for Utility Model Registration] An electronic component formed by covering a printed circuit board on which a circuit element is mounted with a powder coating film, which surrounds the side of the circuit element and has an inclined outer surface. . An electronic component, characterized in that a frame coated with the powder coating film is attached to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155923U JPH0445273Y2 (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155923U JPH0445273Y2 (en) | 1987-10-12 | 1987-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160576U true JPH0160576U (en) | 1989-04-17 |
| JPH0445273Y2 JPH0445273Y2 (en) | 1992-10-23 |
Family
ID=31433988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987155923U Expired JPH0445273Y2 (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445273Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360597A (en) * | 1986-09-01 | 1988-03-16 | 富士通株式会社 | Resin sealing of electronuc parts |
-
1987
- 1987-10-12 JP JP1987155923U patent/JPH0445273Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360597A (en) * | 1986-09-01 | 1988-03-16 | 富士通株式会社 | Resin sealing of electronuc parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445273Y2 (en) | 1992-10-23 |