JPH0162666U - - Google Patents

Info

Publication number
JPH0162666U
JPH0162666U JP15709887U JP15709887U JPH0162666U JP H0162666 U JPH0162666 U JP H0162666U JP 15709887 U JP15709887 U JP 15709887U JP 15709887 U JP15709887 U JP 15709887U JP H0162666 U JPH0162666 U JP H0162666U
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
circuit
circuit board
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15709887U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15709887U priority Critical patent/JPH0162666U/ja
Publication of JPH0162666U publication Critical patent/JPH0162666U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】
第１図ａ〜ｃは本考案混成集積回路装置の一実
施例を説明する製造工程図、第２図は本考案の他
の実施例を示す混成集積回路装置の側面図、第３
図および第４図は本考案の混成集積回路装置が用
いるクリツプ端子の構造断面図である。 １……セラミツグ基板、２……多層回路、３…
…フリツプチツプ、４……半田バンプ、５……ク
リツプ端子、６……Ａｇ系接着剤、７……シリコ
ーン樹脂、８……絶縁性接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 膜技術により回路が形成され且つ前記回路上に
    フリツプチツプを搭載する混成集積回路基板と、
    前記回路基板を挿入するクリツプ端子とが接着剤
    で固定されることを特徴とする混成集積回路装置
    。
JP15709887U 1987-10-13 1987-10-13 Pending JPH0162666U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15709887U JPH0162666U (ja) 1987-10-13 1987-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15709887U JPH0162666U (ja) 1987-10-13 1987-10-13

Publications (1)

Publication Number Publication Date
JPH0162666U true JPH0162666U (ja) 1989-04-21

Family

ID=31436242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15709887U Pending JPH0162666U (ja) 1987-10-13 1987-10-13

Country Status (1)

Country Link
JP (1) JPH0162666U (ja)

Similar Documents

Publication Publication Date Title
JPH0162666U (ja)
JPS6413144U (ja)
JPS6355551U (ja)
JPS63149570U (ja)
JPS6418752U (ja)
JPS63177045U (ja)
JPS6226050U (ja)
JPS63191673U (ja)
JPS63201369U (ja)
JPS58182435U (ja) 半導体素子の外付け端子構造
JPS6081674U (ja) セラミツク混成集積回路装置
JPS5965571U (ja) 部品取付装置
JPS6169863U (ja)
JPH01130592U (ja)
JPS63170964U (ja)
JPS6355445U (ja)
JPS61156262U (ja)
JPS6054340U (ja) 集積回路
JPS6192064U (ja)
JPS5999452U (ja) 混成集積回路装置
JPS63167782U (ja)
JPH0265356U (ja)
JPS58182458U (ja) 回路ユニツト
JPH0476080U (ja)
JPS59176154U (ja) 混成集積回路装置