JPH0440554U - - Google Patents

Info

Publication number
JPH0440554U
JPH0440554U JP1990081830U JP8183090U JPH0440554U JP H0440554 U JPH0440554 U JP H0440554U JP 1990081830 U JP1990081830 U JP 1990081830U JP 8183090 U JP8183090 U JP 8183090U JP H0440554 U JPH0440554 U JP H0440554U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lens body
lead frame
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990081830U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990081830U priority Critical patent/JPH0440554U/ja
Publication of JPH0440554U publication Critical patent/JPH0440554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本考案第一実施例のＬＥＤランプに係
る断面図、第２図は同じく表面実装型ＬＥＤラン
プの断面図、第３図は本考案第二実施例に係るＬ
ＥＤランプの断面図、第４図は同じく表面実装型
ＬＥＤランプの断面図、第５図は本考案第三実施
例に係るＬＥＤランプの断面図、第６図は同じく
表面実装型ＬＥＤランプの断面図、第７図は従来
のＬＥＤランプの断面図、第８図は同じく表面実
装型ＬＥＤランプの斜視図である。 １……発光ダイオード、２……ボンデイングワ
イヤ、３……リードフレーム、４……レンズ体、
１０……保持体、１１……凹面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光ダイオードと、該発光ダイオードが搭載さ
    れるリードフレームと、これらを被覆するレンズ
    体とを備え、該レンズ体は、透明無機質フイラー
    を混入した透光性の熱可塑性樹脂を射出して形成
    されたことを特徴とする発光ダイオードランプ。
JP1990081830U 1990-07-31 1990-07-31 Pending JPH0440554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990081830U JPH0440554U (ja) 1990-07-31 1990-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990081830U JPH0440554U (ja) 1990-07-31 1990-07-31

Publications (1)

Publication Number Publication Date
JPH0440554U true JPH0440554U (ja) 1992-04-07

Family

ID=31628113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990081830U Pending JPH0440554U (ja) 1990-07-31 1990-07-31

Country Status (1)

Country Link
JP (1) JPH0440554U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681368U (ja) * 1993-05-06 1994-11-22 株式会社テンヨー 額 縁
JP2004319591A (ja) * 2003-04-11 2004-11-11 Sharp Corp 半導体発光装置およびその製造方法
JP2011223044A (ja) * 2000-04-26 2011-11-04 Osram Opto Semiconductors Gmbh ルミネセンス変換エレメントを備えた光放出半導体素子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851588A (ja) * 1971-10-27 1973-07-19
JPH01152676A (ja) * 1987-12-09 1989-06-15 Rohm Co Ltd 発光ダイオード装置
JPH0231451A (ja) * 1988-07-20 1990-02-01 Mitsui Petrochem Ind Ltd 発光ダイオード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851588A (ja) * 1971-10-27 1973-07-19
JPH01152676A (ja) * 1987-12-09 1989-06-15 Rohm Co Ltd 発光ダイオード装置
JPH0231451A (ja) * 1988-07-20 1990-02-01 Mitsui Petrochem Ind Ltd 発光ダイオード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681368U (ja) * 1993-05-06 1994-11-22 株式会社テンヨー 額 縁
JP2011223044A (ja) * 2000-04-26 2011-11-04 Osram Opto Semiconductors Gmbh ルミネセンス変換エレメントを備えた光放出半導体素子
JP2004319591A (ja) * 2003-04-11 2004-11-11 Sharp Corp 半導体発光装置およびその製造方法

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