JPH0163141U - - Google Patents
Info
- Publication number
- JPH0163141U JPH0163141U JP1987157800U JP15780087U JPH0163141U JP H0163141 U JPH0163141 U JP H0163141U JP 1987157800 U JP1987157800 U JP 1987157800U JP 15780087 U JP15780087 U JP 15780087U JP H0163141 U JPH0163141 U JP H0163141U
- Authority
- JP
- Japan
- Prior art keywords
- screw
- integrated circuit
- conductive material
- cooling
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
第１図は本考案に係る冷却構造をメモリ系集積
回路に実施した状態を示す側断面図である。
１……集積回路、２……基板、３……コールド
プレート、４……冷水、５……循環路、６……ね
じ孔、７……熱伝導ねじ、８……シート。
FIG. 1 is a side sectional view showing a state in which a cooling structure according to the present invention is implemented in a memory system integrated circuit. DESCRIPTION OF SYMBOLS 1... Integrated circuit, 2... Board, 3... Cold plate, 4... Cold water, 5... Circulation path, 6... Screw hole, 7... Heat conduction screw, 8... Sheet.
Claims (1)
けられ、内部に冷媒の循環路を有しかつ前記集積
回路とそれぞれ対向するねじ孔が形成された冷却
板と、前記ねじ孔に螺合する熱良導性材料からな
るねじとを備え、このねじと前記集積回路との間
に弾性を有する熱良導性材料によつて形成された
シートを介装したことを特徴とする集積回路の冷
却構造。 A cooling plate is attached in parallel to a substrate on which a plurality of integrated circuits are mounted, has a cooling medium circulation path therein, and has screw holes facing each of the integrated circuits, and a cooling plate that is screwed into the screw holes. A cooling structure for an integrated circuit, comprising a screw made of a good conductive material, and a sheet made of an elastic thermally conductive material is interposed between the screw and the integrated circuit. .
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157800U JPH0163141U (en) | 1987-10-15 | 1987-10-15 | |
| US07/222,818 US4942497A (en) | 1987-07-24 | 1988-07-21 | Cooling structure for heat generating electronic components mounted on a substrate |
| CA000572835A CA1290078C (en) | 1987-07-24 | 1988-07-22 | Cooling structure for heat generating electronic components mounted on a substrate |
| EP88306812A EP0302641B1 (en) | 1987-07-24 | 1988-07-25 | Cooling structure for heat generating electronic components mounted on a substrate |
| DE88306812T DE3885028T2 (en) | 1987-07-24 | 1988-07-25 | Cooling structure for electronic heat generating components mounted on a substrate. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157800U JPH0163141U (en) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163141U true JPH0163141U (en) | 1989-04-24 |
Family
ID=31437558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987157800U Pending JPH0163141U (en) | 1987-07-24 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163141U (en) |
-
1987
- 1987-10-15 JP JP1987157800U patent/JPH0163141U/ja active Pending
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