JPH0165135U - - Google Patents

Info

Publication number
JPH0165135U
JPH0165135U JP1987161504U JP16150487U JPH0165135U JP H0165135 U JPH0165135 U JP H0165135U JP 1987161504 U JP1987161504 U JP 1987161504U JP 16150487 U JP16150487 U JP 16150487U JP H0165135 U JPH0165135 U JP H0165135U
Authority
JP
Japan
Prior art keywords
bonding pad
metal layer
internal
internal bonding
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987161504U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161504U priority Critical patent/JPH0165135U/ja
Publication of JPH0165135U publication Critical patent/JPH0165135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第１の実施例のボンデイング
パツドの断面図、第２図は第１図のボンデイング
パツドの平面図、第３図は第１図のボンデイング
パツドの組立後の断面図、第４図は第２の実施例
の断面図、第５図は従来のボンデイングパツドの
上面図、第６図はこの組立後の断面図である。 １……外部ボンデイングパツド部、２……内部
ボンデイングパツド部、３……カバー膜、４……
絶縁膜、５……引き出し線、６……シリコン基板
、７……カバー膜開口部、８……Ａｕワイヤー、
９……Ａｕボール、１０……ボンデイングパツド
、１１……封止樹脂、１２……拡散層。 Fig. 1 is a sectional view of the bonding pad according to the first embodiment of the present invention, Fig. 2 is a plan view of the bonding pad of Fig. 1, and Fig. 3 is a cross-sectional view of the bonding pad of Fig. 1 after assembly. 4 is a sectional view of the second embodiment, FIG. 5 is a top view of a conventional bonding pad, and FIG. 6 is a sectional view of the conventional bonding pad after assembly. DESCRIPTION OF SYMBOLS 1...External bonding pad part, 2...Internal bonding pad part, 3...Cover film, 4...
Insulating film, 5... Leading wire, 6... Silicon substrate, 7... Cover film opening, 8... Au wire,
9... Au ball, 10... Bonding pad, 11... Sealing resin, 12... Diffusion layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属層から成る内部ボンデイングパツド部と、
この内部ボンデイングパツド部を取り巻いて形成
した金属層から成る外部ボンデイングパツド部か
ら成る２重の構造を有し、かつ引き出し線とのコ
ンタクトを内部ボンデイングパツド部よりとつて
いることを特徴とする集積回路素子のボンデイン
グパツド。 an internal bonding pad portion made of a metal layer;
It has a double structure consisting of an external bonding pad made of a metal layer surrounding this internal bonding pad, and the contact with the lead wire is made from the internal bonding pad. Bonding pads for integrated circuit devices.
JP1987161504U 1987-10-21 1987-10-21 Pending JPH0165135U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161504U JPH0165135U (en) 1987-10-21 1987-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161504U JPH0165135U (en) 1987-10-21 1987-10-21

Publications (1)

Publication Number Publication Date
JPH0165135U true JPH0165135U (en) 1989-04-26

Family

ID=31444496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161504U Pending JPH0165135U (en) 1987-10-21 1987-10-21

Country Status (1)

Country Link
JP (1) JPH0165135U (en)

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