JPH0428449U - - Google Patents

Info

Publication number
JPH0428449U
JPH0428449U JP1990069002U JP6900290U JPH0428449U JP H0428449 U JPH0428449 U JP H0428449U JP 1990069002 U JP1990069002 U JP 1990069002U JP 6900290 U JP6900290 U JP 6900290U JP H0428449 U JPH0428449 U JP H0428449U
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
oxide film
utility
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990069002U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990069002U priority Critical patent/JPH0428449U/ja
Publication of JPH0428449U publication Critical patent/JPH0428449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例の絶縁型樹脂封止
半導体装置の断面図、第２図は従来装置の断面図
である。 １……パツケージの樹脂、１ａ……絶縁樹脂膜
、２……放熱板、２ａ……放熱板に形成した酸化
膜、２ｂ……放熱板に形成したニツケルメツキ層
、３……外部放熱板、４……ペレツト、５……リ
ード、６……ボンデイングワイヤ、７……ソルダ
。 FIG. 1 is a sectional view of an insulated resin-sealed semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional device. DESCRIPTION OF SYMBOLS 1... Resin of the package, 1a... Insulating resin film, 2... Heat sink, 2a... Oxide film formed on the heat sink, 2b... Nickel plating layer formed on the heat sink, 3... External heat sink, 4 ... pellet, 5 ... lead, 6 ... bonding wire, 7 ... solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁型樹脂封止半導体装置において、その半導
体装置の放熱板のペレツト取付け面と反対側に酸
化膜を形成したことを特徴とする絶縁型樹脂封止
半導体装置。 An insulated resin-sealed semiconductor device characterized in that an oxide film is formed on a side of a heat sink of the semiconductor device opposite to a pellet mounting surface.
JP1990069002U 1990-06-28 1990-06-28 Pending JPH0428449U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990069002U JPH0428449U (en) 1990-06-28 1990-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990069002U JPH0428449U (en) 1990-06-28 1990-06-28

Publications (1)

Publication Number Publication Date
JPH0428449U true JPH0428449U (en) 1992-03-06

Family

ID=31603934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990069002U Pending JPH0428449U (en) 1990-06-28 1990-06-28

Country Status (1)

Country Link
JP (1) JPH0428449U (en)

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