JPH0165135U - - Google Patents
Info
- Publication number
- JPH0165135U JPH0165135U JP1987161504U JP16150487U JPH0165135U JP H0165135 U JPH0165135 U JP H0165135U JP 1987161504 U JP1987161504 U JP 1987161504U JP 16150487 U JP16150487 U JP 16150487U JP H0165135 U JPH0165135 U JP H0165135U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- metal layer
- internal
- internal bonding
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の第１の実施例のボンデイング
パツドの断面図、第２図は第１図のボンデイング
パツドの平面図、第３図は第１図のボンデイング
パツドの組立後の断面図、第４図は第２の実施例
の断面図、第５図は従来のボンデイングパツドの
上面図、第６図はこの組立後の断面図である。 １……外部ボンデイングパツド部、２……内部
ボンデイングパツド部、３……カバー膜、４……
絶縁膜、５……引き出し線、６……シリコン基板
、７……カバー膜開口部、８……Ａｕワイヤー、
９……Ａｕボール、１０……ボンデイングパツド
、１１……封止樹脂、１２……拡散層。
パツドの断面図、第２図は第１図のボンデイング
パツドの平面図、第３図は第１図のボンデイング
パツドの組立後の断面図、第４図は第２の実施例
の断面図、第５図は従来のボンデイングパツドの
上面図、第６図はこの組立後の断面図である。 １……外部ボンデイングパツド部、２……内部
ボンデイングパツド部、３……カバー膜、４……
絶縁膜、５……引き出し線、６……シリコン基板
、７……カバー膜開口部、８……Ａｕワイヤー、
９……Ａｕボール、１０……ボンデイングパツド
、１１……封止樹脂、１２……拡散層。
Claims (1)
- 金属層から成る内部ボンデイングパツド部と、
この内部ボンデイングパツド部を取り巻いて形成
した金属層から成る外部ボンデイングパツド部か
ら成る２重の構造を有し、かつ引き出し線とのコ
ンタクトを内部ボンデイングパツド部よりとつて
いることを特徴とする集積回路素子のボンデイン
グパツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161504U JPH0165135U (ja) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161504U JPH0165135U (ja) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165135U true JPH0165135U (ja) | 1989-04-26 |
Family
ID=31444496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161504U Pending JPH0165135U (ja) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165135U (ja) |
-
1987
- 1987-10-21 JP JP1987161504U patent/JPH0165135U/ja active Pending