JPH0167734U - - Google Patents
Info
- Publication number
- JPH0167734U JPH0167734U JP1987162188U JP16218887U JPH0167734U JP H0167734 U JPH0167734 U JP H0167734U JP 1987162188 U JP1987162188 U JP 1987162188U JP 16218887 U JP16218887 U JP 16218887U JP H0167734 U JPH0167734 U JP H0167734U
- Authority
- JP
- Japan
- Prior art keywords
- resist
- temperature sensor
- temperature
- nozzle
- spinner head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案の第１の実施例を示す図、第２
図は本考案の第２の実施例を示す図である。
１……スピンナーヘツド、２……スピンナーカ
ツプ、３……冷却部、４……冷却装置、５……レ
ジスト貯蔵容器、６……レジスト圧送ポンプ、７
……Ｎ２ガス導入口、８……フアン、９……Ｎ２
ガス噴出口、１０……レジスト滴下ノズル、１１
……温度コントローラ、１２……第１の温度セン
サ、１３……第２の温度センサ、１４……ウエハ
、１５……Ｎ２ガスアキユムレータ、１６……小
孔、１７……パイプ。
FIG. 1 is a diagram showing the first embodiment of the present invention, and FIG.
The figure shows a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Spinner head, 2... Spinner cup, 3... Cooling section, 4... Cooling device, 5... Resist storage container, 6... Resist pressure pump, 7
... N2 gas inlet, 8...fan, 9... N2
Gas outlet, 10...Resist dropping nozzle, 11
...Temperature controller, 12...First temperature sensor, 13...Second temperature sensor, 14...Wafer, 15... N2 gas accumulator, 16...Small hole, 17...Pipe.
Claims (1)
をノズルより滴下し、スピンナーヘツドの回転に
よる遠心力を該ウエハに作用させてレジストを塗
布するスピンナー方式のレジスト塗布装置におい
て、前記ノズル内のレジスト及び前記スピンナー
ヘツド上の半導体ウエハを冷媒により温度調整す
る冷却部と、前記ノズルより滴下されるレジスト
の温度をモニタする第１の温度センサと、前記ス
ピンナーヘツド上に設置された半導体ウエハの温
度をモニタする第２の温度センサと、第１、第２
の温度センサからの信号を処理し、前記冷却部に
制御指令を発する温度コントローラとを有するこ
とを特徴とするレジスト塗布装置。 In a spinner-type resist coating apparatus that drips resist onto a semiconductor wafer on a spinner head from a nozzle and applies centrifugal force due to the rotation of the spinner head to the wafer, the resist in the nozzle and on the spinner head is coated. a first temperature sensor that monitors the temperature of the resist dropped from the nozzle; and a second temperature sensor that monitors the temperature of the semiconductor wafer placed on the spinner head. temperature sensor, first and second
1. A resist coating apparatus comprising: a temperature controller that processes a signal from a temperature sensor and issues a control command to the cooling section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162188U JPH0167734U (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162188U JPH0167734U (en) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167734U true JPH0167734U (en) | 1989-05-01 |
Family
ID=31445789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162188U Pending JPH0167734U (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167734U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223394A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate processing method |
| JP2001291660A (en) * | 2000-04-11 | 2001-10-19 | Tokyo Electron Ltd | Film forming method and film forming apparatus |
-
1987
- 1987-10-23 JP JP1987162188U patent/JPH0167734U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223394A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate processing method |
| JP2001291660A (en) * | 2000-04-11 | 2001-10-19 | Tokyo Electron Ltd | Film forming method and film forming apparatus |