JPH0170331U - - Google Patents
Info
- Publication number
- JPH0170331U JPH0170331U JP1987165541U JP16554187U JPH0170331U JP H0170331 U JPH0170331 U JP H0170331U JP 1987165541 U JP1987165541 U JP 1987165541U JP 16554187 U JP16554187 U JP 16554187U JP H0170331 U JPH0170331 U JP H0170331U
- Authority
- JP
- Japan
- Prior art keywords
- etching liquid
- spin etcher
- nozzle
- diagram showing
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本考案の一実施例の概略を示す図、第
２図ａ，ｂは本考案の一実施例に用いたエツチン
グノズルを示す図、第３図は本考案の他の実施例
に用いるエツチングノズルを示す図、第４図ａ，
ｂは従来のエツチングノズルを示す図、第５図ａ
，ｂは従来の他のエツチングノズルを示す図であ
る。
１……ロード室、２……主処理室、３……水洗
乾燥室、４……アンロード室、５，５′……エレ
ベータ、６……基板、７，７′……カセツト、８
……ベルト搬送、９，９′……真空吸着ステージ
、１０……エツチングノズル、１１……ＥＰＤ（
終点検出器）、１２……水洗乾燥ヘツド、１３…
…エツチング液噴射穴、１４……中心部の噴射穴
、１５，１５′……外周部の噴射穴、１６，１６
′……カツトバルブ、１７，１７′……流量コン
トローラ、１８，１８′……圧力調整弁、１９，
１９′……エツチング液供給ポンプ。
Figure 1 is a diagram showing an outline of an embodiment of the present invention, Figures 2a and b are diagrams showing an etching nozzle used in an embodiment of the invention, and Figure 3 is a diagram showing an etching nozzle used in an embodiment of the invention. A diagram showing the etching nozzle used, FIG. 4a,
b is a diagram showing a conventional etching nozzle, Figure 5a is a diagram showing a conventional etching nozzle.
, b are diagrams showing other conventional etching nozzles. 1... Loading chamber, 2... Main processing chamber, 3... Washing/drying room, 4... Unloading chamber, 5, 5'... Elevator, 6... Board, 7, 7'... Cassette, 8
...Belt conveyance, 9,9'...Vacuum adsorption stage, 10...Etching nozzle, 11...EPD (
end point detector), 12... washing drying head, 13...
...Etching liquid injection hole, 14...Injection hole in the center, 15, 15'...Injection hole in the outer periphery, 16, 16
'... Cut valve, 17, 17'... Flow rate controller, 18, 18'... Pressure regulating valve, 19,
19'... Etching liquid supply pump.
Claims (1)
極メタル及び各種薄膜をウエツト方式にてエツチ
ングするスピンエツチヤーに関して、エツチング
液スプレーノズルを複数個にし、かつ各ノズルの
エツチング液の流量と圧力を制御可能にしたこと
を特徴とするスピンエツチヤー。 In the semiconductor manufacturing process, a spin etcher that wet-etches various electrode metals and various thin films on semiconductor substrates has multiple etching liquid spray nozzles, and the flow rate and pressure of the etching liquid for each nozzle can be controlled. A spin etcher characterized by the fact that it did.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165541U JPH0170331U (en) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165541U JPH0170331U (en) | 1987-10-28 | 1987-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170331U true JPH0170331U (en) | 1989-05-10 |
Family
ID=31452120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165541U Pending JPH0170331U (en) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170331U (en) |
-
1987
- 1987-10-28 JP JP1987165541U patent/JPH0170331U/ja active Pending
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