JPS6448030U - - Google Patents

Info

Publication number
JPS6448030U
JPS6448030U JP1987144174U JP14417487U JPS6448030U JP S6448030 U JPS6448030 U JP S6448030U JP 1987144174 U JP1987144174 U JP 1987144174U JP 14417487 U JP14417487 U JP 14417487U JP S6448030 U JPS6448030 U JP S6448030U
Authority
JP
Japan
Prior art keywords
capillary
bonding
bonding position
replaced
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987144174U
Other languages
Japanese (ja)
Other versions
JPH0528764Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987144174U priority Critical patent/JPH0528764Y2/ja
Publication of JPS6448030U publication Critical patent/JPS6448030U/ja
Application granted granted Critical
Publication of JPH0528764Y2 publication Critical patent/JPH0528764Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案実施例のワイヤボンデイング装
置のキヤピラリ位置決め手段の構成図、第2図は
本考案実施例のキヤピラリ中心位置修正過程を説
明する図、第3図はボンデイング位置とキヤピラ
リとの位置関係を示す図である。 1……目合わせ回路、2……実ボンデイング位
置信号、3……キヤピラリ位置演算回路、4……
キヤピラリ位置信号、5……キヤピラリ位置制御
回路、6……キヤピラリ駆動信号、7……キヤピ
ラリ、7a……駆動部、8……ワイヤ、10……
第n番目のボンデイング位置、11……入力時の
第n+1番目のボンデイング位置、12……目合
わせ後の第n+1番目のボンデイング位置、15
……入力時の第n+1番目のボンデイング位置1
1に対応したキヤピラリ中心位置、16……目合
わせ後の第n+1番目のボンデイング位置12に
対応したキヤピラリ中心位置、17……修正キヤ
ピラリ中心位置、18……第n+1番目の修正ボ
ンデイング位置、21……キヤピラリの中心軸、
22……キヤピラリ先端、31……第n+1番目
のボンデイング位置、35……第n+1番目のボ
ンデイング位置31に対応したキヤピラリ中心位
置、dx……キヤピラリ中心とキヤピラリ先端と
のx方向のずれ、dy……キヤピラリ中心とキヤ
ピラリ先端とのy方向のずれ、r……キヤピラリ
の先端半径。
Fig. 1 is a block diagram of the capillary positioning means of the wire bonding apparatus according to the embodiment of the present invention, Fig. 2 is a diagram illustrating the capillary center position correction process according to the embodiment of the present invention, and Fig. 3 is the position of the bonding position and the capillary. It is a figure showing a relationship. 1... Alignment circuit, 2... Actual bonding position signal, 3... Capillary position calculation circuit, 4...
Capillary position signal, 5... Capillary position control circuit, 6... Capillary drive signal, 7... Capillary, 7a... Drive section, 8... Wire, 10...
nth bonding position, 11... n+1st bonding position at the time of input, 12... n+1th bonding position after alignment, 15
... n+1st bonding position 1 at the time of input
16...Capillary center position corresponding to the n+1st bonding position 12 after alignment, 17...Corrected capillary center position, 18...N+1th corrected bonding position, 21... ...center axis of the capillary,
22...Capillary tip, 31...N+1th bonding position, 35...Capillary center position corresponding to the n+1th bonding position 31, dx...Difference in the x direction between the capillary center and the capillary tip, dy... ...Displacement in the y direction between the center of the capillary and the tip of the capillary, r...The radius of the tip of the capillary.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンデイング装置において、予め入力さ
れているボンデイング位置を、目合わせによつて
得られたボンデイング位置に置き換え、該置き換
え後のボンデイング位置に対応するキヤピラリ中
心位置を算出し、これをキヤピラリ位置信号とし
て出力するキヤピラリ位置演算回路と;前記のキ
ヤピラリ位置信号を受け、これに基づきキヤピラ
リの位置決めを行うキヤピラリ位置制御回路と;
を具備することを特徴とするワイヤボンデイング
装置。
In the wire bonding device, the bonding position input in advance is replaced with the bonding position obtained by alignment, the capillary center position corresponding to the replaced bonding position is calculated, and this is output as a capillary position signal. a capillary position calculation circuit that receives the capillary position signal and positions the capillary based on the capillary position signal;
A wire bonding device comprising:
JP1987144174U 1987-09-21 1987-09-21 Expired - Lifetime JPH0528764Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (en) 1987-09-21 1987-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (en) 1987-09-21 1987-09-21

Publications (2)

Publication Number Publication Date
JPS6448030U true JPS6448030U (en) 1989-03-24
JPH0528764Y2 JPH0528764Y2 (en) 1993-07-23

Family

ID=31411643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987144174U Expired - Lifetime JPH0528764Y2 (en) 1987-09-21 1987-09-21

Country Status (1)

Country Link
JP (1) JPH0528764Y2 (en)

Also Published As

Publication number Publication date
JPH0528764Y2 (en) 1993-07-23

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