JPH0171456U - - Google Patents
Info
- Publication number
- JPH0171456U JPH0171456U JP1987167504U JP16750487U JPH0171456U JP H0171456 U JPH0171456 U JP H0171456U JP 1987167504 U JP1987167504 U JP 1987167504U JP 16750487 U JP16750487 U JP 16750487U JP H0171456 U JPH0171456 U JP H0171456U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- connecting portion
- lead frame
- component support
- component installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Description
第１図は本考案の一実施例の半導体用リードフ
レームの端面を示す平面図、第２図はその正面図
、第３図は第２図の切断面線−から見た断面
図、第４図は本実施例によるリードフレームに半
導体チツプを固着した状態を示す平面図、第５図
は本考案の他の実施例を示す平面図、第６図は先
行技術による半導体用リードフレームの端面を示
す平面図、第７図は他の先行技術を示す図である
。
１１……半導体用リードフレーム、１２……帯
状金属板、１３……半導体チツプ支持部材、１５
……半導体チツプ設置部、１６……金線接続部、
１７……半導体チツプ、１８……接続用金線。
1 is a plan view showing an end surface of a semiconductor lead frame according to an embodiment of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a sectional view taken along the cutting plane line - in FIG. The figure is a plan view showing a state in which a semiconductor chip is fixed to a lead frame according to the present embodiment, FIG. 5 is a plan view showing another embodiment of the present invention, and FIG. The plan view shown in FIG. 7 is a diagram showing another prior art. 11... Semiconductor lead frame, 12... Band-shaped metal plate, 13... Semiconductor chip support member, 15
...Semiconductor chip installation part, 16...Gold wire connection part,
17... Semiconductor chip, 18... Gold wire for connection.
Claims (1)
方向に沿つて櫛歯状に形成され、前記電子部品支
持部材はその遊端部に形成された電子部品設置部
と接続部を含む、そのような電子部品用リードフ
レームにおいて、 前記接続部は、前記電子部品設置部の配列方向
に対して直角に配設されて成ることを特徴とする
電子部品用リードフレーム。[Claims for Utility Model Registration] A plurality of electronic component support members are formed in a comb-teeth shape along one array direction on a band-shaped metal plate, and the electronic component support member is formed at an electronic component installation portion at its free end. 1. A lead frame for electronic components including: and a connecting portion, wherein the connecting portion is arranged perpendicularly to the arrangement direction of the electronic component installation portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167504U JPH0171456U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167504U JPH0171456U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171456U true JPH0171456U (en) | 1989-05-12 |
Family
ID=31455861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987167504U Pending JPH0171456U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171456U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595984U (en) * | 1982-07-02 | 1984-01-14 | 余語 良三 | Ball control device in pachinko machines |
| JPS59159577A (en) * | 1983-03-03 | 1984-09-10 | Toshiba Corp | Electrode member for semiconductor light emitting display and manufacture thereof |
| JPS63161685A (en) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | Manufacture of lead frame for light emitting device |
-
1987
- 1987-10-30 JP JP1987167504U patent/JPH0171456U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595984U (en) * | 1982-07-02 | 1984-01-14 | 余語 良三 | Ball control device in pachinko machines |
| JPS59159577A (en) * | 1983-03-03 | 1984-09-10 | Toshiba Corp | Electrode member for semiconductor light emitting display and manufacture thereof |
| JPS63161685A (en) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | Manufacture of lead frame for light emitting device |