JPH01752A - heat sink - Google Patents
heat sinkInfo
- Publication number
- JPH01752A JPH01752A JP62-155688A JP15568887A JPH01752A JP H01752 A JPH01752 A JP H01752A JP 15568887 A JP15568887 A JP 15568887A JP H01752 A JPH01752 A JP H01752A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- heat dissipation
- superconductor
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は集積回路の封止体の放熱板の構成に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to the structure of a heat sink of a sealed body of an integrated circuit.
集積回路の封止体の放熱を良好にするためには従来、銅
基板のステム、キャップやアルミニウム放熱フィンを用
いるのが通例であった。In order to improve the heat dissipation of a sealed integrated circuit, it has conventionally been customary to use a copper substrate stem, a cap, or an aluminum heat dissipation fin.
しかし、上記従来技術によると、銅やアルミニウムの熱
伝導が必ずしも良好ではなく、ジョセフィン効果素子に
よる集積回路等の封止体の如く、冷却効果の大なる特性
を要する場合には放熱特性が充分でないという問題点が
あった。However, according to the above-mentioned conventional technology, the thermal conductivity of copper and aluminum is not necessarily good, and the heat dissipation characteristics are not sufficient in cases where a large cooling effect is required, such as in a sealed body such as an integrated circuit using a Josephine effect element. There was a problem.
本発明はかかる従来技術の問題点をなくし、ジョセフィ
ン効果素子による集積回路を液体窒素で冷却する場合に
放熱特性のすぐれた放熱板の構成を提供する２１１を目
的とする。It is an object of the present invention 211 to eliminate the problems of the prior art and to provide a structure of a heat sink with excellent heat dissipation characteristics when an integrated circuit using a Josephine effect element is cooled with liquid nitrogen.
上記目的を達成するために、本発明は集積回路の放熱板
あるいは放熱体にイツトリウム、バリウム、銅酸化物等
の超電導体を用いる手段をとる。In order to achieve the above object, the present invention takes a means of using a superconductor such as yttrium, barium, or copper oxide for the heat sink or heat sink of an integrated circuit.
超電導体は臨界温以下で電気抵抗がゼロになる物質であ
り、電気抵抗がゼロになることは、すなわち、熱による
格子振動が臨界値以下でホノンを生成し、熱エネルギー
がホノンに吸収される事を意味し、熱伝導率が極めて大
となることを意味し、すなわち超′屯導体は臨界値以下
では極めて大きな放熱特性をもつ作用があることとなる
。A superconductor is a material whose electrical resistance becomes zero below a critical temperature.The fact that electrical resistance becomes zero means that lattice vibrations due to heat generate phonons below a critical temperature, and thermal energy is absorbed by the phonons. This means that the thermal conductivity is extremely high.In other words, the superconductor has an extremely large heat dissipation property below a critical value.
以下、実施例により本発明を詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図は本発明の一実施例を示す放熱ステムの断面図で
あり、イツトリウム、バリウム、銅酸化物から成る超電
導基板１には、金属リード線３がガラス２により封着さ
れて成り、＋ＩＡステム内に、−′ヨセフソン効果素子
による集積回路が組み立てられて成り、金属又は、超電
導体から成るキャップにて封止されて成る。FIG. 1 is a sectional view of a heat dissipation stem showing an embodiment of the present invention, in which metal lead wires 3 are sealed with glass 2 to a superconducting substrate 1 made of yttrium, barium, and copper oxide. An integrated circuit using a -' Josephson effect element is assembled in the stem, and the stem is sealed with a cap made of metal or superconductor.
第２図は本発明の他の実施例を示す放熱板の断面図であ
り、イツトリウム、バリウム、銅酸化物から成る超電導
放熱フィン２１には集積回路封止体にビス止めするビス
穴２２が形成さて成る。尚、液体窒素をパイプ内に巡回
させながら集積回路チップの裏面から超電導体から放熱
体を押し当てて冷却を取っても良い事はいうまでもない
。FIG. 2 is a sectional view of a heat sink showing another embodiment of the present invention, in which a superconducting heat sink fin 21 made of yttrium, barium, and copper oxide has screw holes 22 for screwing into the integrated circuit package. Now it's done. It goes without saying that cooling may be achieved by pressing a heat radiator from the superconductor onto the back side of the integrated circuit chip while circulating liquid nitrogen inside the pipe.
〔発明の効果〕
本発明に於て、集積回路の放熱体に超電導体を用いるス
バにより、熱放熱特性がきわめて良好となり、とりわけ
ジオ。セフイン効果素子による集積回路は臨界温度以下
で動作させる必要があり、本発明は臨界温度以下に保つ
には必要となる。[Effects of the Invention] In the present invention, by using a superconductor as a heat dissipating body of an integrated circuit, the heat dissipation characteristics are extremely good, and especially geothermal. An integrated circuit using a Cefine effect element must be operated at a temperature below a critical temperature, and the present invention is necessary to maintain the temperature below the critical temperature.
ｔｉ′Ｓ１図及び第２図は発明の実施例を示す放熱体の
断面図である。
ｌ・・・超電導基板
２・・・力′ラス
３・・・リード線
２１・・・超電導放熱フィン
２２・・・ビス穴
以上
出願人 セイコーエプソン株式会社
代理人弁理士 最 上 務 他１名ti'S1 and FIG. 2 are cross-sectional views of a heat sink showing an embodiment of the invention. l...Superconducting substrate 2...Las 3...Lead wire 21...Superconducting heat dissipation fin 22...screw hole or more Applicant: Seiko Epson Corporation, Patent Attorney, Tsutomu Mogami, and 1 other person
Claims (1)
プあるい集積回路封止体積表面に設置する放熱フィンは
イットリウム、バリウム、銅酸化物等の超電導体から成
る事を特徴とする放熱板。A heat dissipation plate characterized in that the substrate stem, cap, or heat dissipation fin installed on the surface of the integrated circuit sealing volume of a package for sealing an integrated circuit is made of a superconductor such as yttrium, barium, or copper oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155688A JPH01752A (en) | 1987-06-23 | heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155688A JPH01752A (en) | 1987-06-23 | heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64752A JPS64752A (en) | 1989-01-05 |
| JPH01752A true JPH01752A (en) | 1989-01-05 |
Family
ID=
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