JPH0180940U - - Google Patents
Info
- Publication number
- JPH0180940U JPH0180940U JP1987176773U JP17677387U JPH0180940U JP H0180940 U JPH0180940 U JP H0180940U JP 1987176773 U JP1987176773 U JP 1987176773U JP 17677387 U JP17677387 U JP 17677387U JP H0180940 U JPH0180940 U JP H0180940U
- Authority
- JP
- Japan
- Prior art keywords
- substrate support
- resin
- main surface
- semiconductor element
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例のリード・フレームを示す平面図、第
３図及び第４図は従来例を示す断面図である。
１……半導体素子、２……基板支持体、３……
封止樹脂、４……保護樹脂、５……外部リード、
６……共通細条、８……絶縁膜。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view showing a lead frame of this embodiment, and FIGS. 3 and 4 are sectional views showing a conventional example. 1...Semiconductor element, 2...Substrate support, 3...
Sealing resin, 4... Protective resin, 5... External lead,
6... Common strip, 8... Insulating film.
Claims (1)
の主面に固着された半導体素子と前記半導体素子
を包覆し前記基板支持体の反主面を露出させる封
止樹脂とを備えた樹脂封止型半導体装置において
、前記基板支持体の露出部分に絶縁膜を設けたこ
とを特徴とする樹脂封止型半導体装置。 A resin comprising a substrate support that also serves as a heat sink, a semiconductor element fixed to a main surface of the substrate support, and a sealing resin that covers the semiconductor element and exposes the opposite main surface of the substrate support. A resin-sealed semiconductor device, characterized in that an insulating film is provided on an exposed portion of the substrate support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176773U JPH0180940U (en) | 1987-11-19 | 1987-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176773U JPH0180940U (en) | 1987-11-19 | 1987-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180940U true JPH0180940U (en) | 1989-05-30 |
Family
ID=31468476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176773U Pending JPH0180940U (en) | 1987-11-19 | 1987-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180940U (en) |
-
1987
- 1987-11-19 JP JP1987176773U patent/JPH0180940U/ja active Pending