JPH0183364U - - Google Patents
Info
- Publication number
- JPH0183364U JPH0183364U JP1987177945U JP17794587U JPH0183364U JP H0183364 U JPH0183364 U JP H0183364U JP 1987177945 U JP1987177945 U JP 1987177945U JP 17794587 U JP17794587 U JP 17794587U JP H0183364 U JPH0183364 U JP H0183364U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- wiring board
- circuit wiring
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図はこの考案の一実施例を示す要
部拡大図と断面図、第３図、第４図は従来例を示
す斜視図と断面図である。
図中、１は印刷回路配線板、１ａは透孔、２は
板金、２ａは板金突出脚、３は銅箔パターン、４
は半田、５は板金突出脚の透孔である。尚、図中
同一符号は同一又は相当部分を示す。
FIGS. 1 and 2 are an enlarged view and a sectional view of essential parts showing an embodiment of this invention, and FIGS. 3 and 4 are a perspective view and a sectional view of a conventional example. In the figure, 1 is a printed circuit wiring board, 1a is a through hole, 2 is a sheet metal, 2a is a sheet metal protruding leg, 3 is a copper foil pattern, and 4
5 is solder, and 5 is a through hole in the protruding leg of the sheet metal. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
の銅箔パターンに半田付けして成る板金の取付構
造において、上記板金突出部の上記印刷回路配線
板厚み下部の部位に透孔を設け、この透孔を通じ
て半田が充填されるようにしたことを特徴とする
印刷回路配線板。 In a sheet metal mounting structure formed by penetrating a through hole in a printed circuit wiring board and soldering a protrusion to a predetermined copper foil pattern, the through hole is provided at a portion of the sheet metal protrusion below the thickness of the printed circuit wiring board. , a printed circuit wiring board characterized in that solder is filled through the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177945U JPH0183364U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177945U JPH0183364U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183364U true JPH0183364U (en) | 1989-06-02 |
Family
ID=31469590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987177945U Pending JPH0183364U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183364U (en) |
-
1987
- 1987-11-20 JP JP1987177945U patent/JPH0183364U/ja active Pending