JPH0436272U - - Google Patents
Info
- Publication number
- JPH0436272U JPH0436272U JP7659390U JP7659390U JPH0436272U JP H0436272 U JPH0436272 U JP H0436272U JP 7659390 U JP7659390 U JP 7659390U JP 7659390 U JP7659390 U JP 7659390U JP H0436272 U JPH0436272 U JP H0436272U
- Authority
- JP
- Japan
- Prior art keywords
- bottom part
- notch
- view
- printed wiring
- shaped groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例による端子リード部
分の斜視図、第２図は本考案の第１図の半田付部
の拡大図、第３図は、電解コンデンサの斜視図、
第４図は電解コンデンサを基板に取付けた断面図
、第５図は、半田付部の拡大図である。
１……外装ケース、２……端子リード、３……
底面カバー、４……リング状突起、５……プリン
ト配線基板、６……銅箔パターン、７……半田、
８……基板孔、９……切欠き状の溝、１０……電
解コンデンサ。
Fig. 1 is a perspective view of a terminal lead portion according to an embodiment of the present invention, Fig. 2 is an enlarged view of the soldering part of Fig. 1 of the present invention, and Fig. 3 is a perspective view of an electrolytic capacitor.
FIG. 4 is a sectional view of the electrolytic capacitor attached to the board, and FIG. 5 is an enlarged view of the soldered portion. 1...Exterior case, 2...Terminal lead, 3...
Bottom cover, 4...Ring-shaped protrusion, 5...Printed wiring board, 6...Copper foil pattern, 7...Solder,
8... Board hole, 9... Notch-shaped groove, 10... Electrolytic capacitor.
Claims (1)
底面部分に、前記底面部分と底面以外の部分とを
少なくとも一ヶ所以上連結した切欠き状の溝を設
けたことを特徴とするプリント配線基板。 1. A printed wiring board, characterized in that a notch-shaped groove is provided in a bottom part of a component to be mounted, connecting the bottom part and a part other than the bottom part at least at one or more places.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7659390U JPH0436272U (en) | 1990-07-20 | 1990-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7659390U JPH0436272U (en) | 1990-07-20 | 1990-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436272U true JPH0436272U (en) | 1992-03-26 |
Family
ID=31618205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7659390U Pending JPH0436272U (en) | 1990-07-20 | 1990-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436272U (en) |
-
1990
- 1990-07-20 JP JP7659390U patent/JPH0436272U/ja active Pending