JPH018365Y2 - - Google Patents

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Publication number
JPH018365Y2
JPH018365Y2 JP1983013670U JP1367083U JPH018365Y2 JP H018365 Y2 JPH018365 Y2 JP H018365Y2 JP 1983013670 U JP1983013670 U JP 1983013670U JP 1367083 U JP1367083 U JP 1367083U JP H018365 Y2 JPH018365 Y2 JP H018365Y2
Authority
JP
Japan
Prior art keywords
thermal head
heating resistor
glass layer
thin film
metal thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983013670U
Other languages
Japanese (ja)
Other versions
JPS59120158U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983013670U priority Critical patent/JPS59120158U/en
Publication of JPS59120158U publication Critical patent/JPS59120158U/en
Application granted granted Critical
Publication of JPH018365Y2 publication Critical patent/JPH018365Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 (技術分野) 本考案は熱ストレスに強く、長寿命なサーマル
ヘツドに関するものである。
[Detailed Description of the Invention] (Technical Field) The present invention relates to a thermal head that is resistant to heat stress and has a long life.

(背景技術) 従来の薄膜型サーマルヘツドの断面図を第1図
に示す。1はアルミナセラミツク基板、2は蓄熱
層、3は発熱抵抗体、4は給電体、5は酸化防止
および摩耗防止の保護膜である。蓄熱層2は酸化
ケイ素を主成分とするガラス層、発熱抵抗体3は
窒化タンタルなどが用いられている。従来、サー
マルヘツドの劣化の原因として発熱抵抗体とガラ
ス層の密着力が弱いことに起因することが多かつ
た。
(Background Art) A cross-sectional view of a conventional thin film type thermal head is shown in FIG. 1 is an alumina ceramic substrate, 2 is a heat storage layer, 3 is a heating resistor, 4 is a power supply body, and 5 is a protective film for preventing oxidation and preventing wear. The heat storage layer 2 is made of a glass layer containing silicon oxide as a main component, and the heating resistor 3 is made of tantalum nitride or the like. Conventionally, deterioration of thermal heads has often been caused by weak adhesion between the heating resistor and the glass layer.

(考案の課題) 本考案のサーマルヘツドは、発熱抵抗体とガラ
ス層の間に金属薄膜を有することを特徴とし、そ
の目的は発熱抵抗体の密着力の向上であり、以下
詳細に説明する。
(Problems of the Invention) The thermal head of the present invention is characterized by having a metal thin film between the heating resistor and the glass layer, and its purpose is to improve the adhesion of the heating resistor, which will be described in detail below.

(考案の構成および作用) 第2図は本考案によるサーマルヘツドの断面図
であり、1はアルミナ基板、2はガラス層、3は
発熱抵抗体、4は給電体、5は保護膜、6は発熱
抵抗体の密着力の向上のために形成した金属薄膜
である。6の金属薄膜の条件としては、次のこと
が必要である。
(Structure and operation of the invention) Fig. 2 is a sectional view of the thermal head according to the invention, in which 1 is an alumina substrate, 2 is a glass layer, 3 is a heating resistor, 4 is a power supply, 5 is a protective film, and 6 is a This is a metal thin film formed to improve the adhesion of the heating resistor. The following conditions are required for the metal thin film No.6.

1 蒸着あるいはスパツタリングなどによつて形
成が容易なこと。
1. Easy to form by vapor deposition or sputtering.

2 ガラス層との密着が良好なこと。2 Good adhesion to the glass layer.

3 発熱体との密着が良好なこと。3 Good adhesion to the heating element.

4 金属薄膜自身の機械的強度が優れているこ
と。
4. The metal thin film itself has excellent mechanical strength.

ここで、上記2)項を満たすためには、ガラス
層中の酸素との親和力が強いことが必要である。
酸素との親和力が強い金属として、カルシウム、
マグネシウム、リチウム、アルミニウム、チタ
ン、マンガン、バナジウム、クロム、ナトリウ
ム、亜鉛などをあげることができる。この中から
上記1)項および4)項を満たす金属を選び出す
と、アルミニウム、チタン、マンガン、クロムを
あげることができる。アルミニウム、チタン、マ
ンガン、クロムは発熱体と金属間結合を生じ、
3)項は満たす。
Here, in order to satisfy the above item 2), it is necessary that the glass layer has a strong affinity with oxygen.
Calcium, a metal with a strong affinity for oxygen,
Examples include magnesium, lithium, aluminum, titanium, manganese, vanadium, chromium, sodium, and zinc. Among these metals, aluminum, titanium, manganese, and chromium can be selected as metals that satisfy the above-mentioned items 1) and 4). Aluminum, titanium, manganese, and chromium form intermetallic bonds with heating elements,
Item 3) is satisfied.

発熱抵抗体とガラス層の間に形成された金属薄
膜は、ガラス層および発熱抵抗体両者と結合力が
強く、発熱体の密着力としては、従来のガラスの
上に直接発熱体を形成した場合よりも強くなり、
熱ストレスによる劣化にも強くなる。
The metal thin film formed between the heating resistor and the glass layer has a strong bond with both the glass layer and the heating resistor, and the adhesion of the heating element is similar to that of a conventional heating element formed directly on glass. become stronger than
It is also resistant to deterioration due to heat stress.

金属薄膜の厚さは、発熱抵抗体の抵抗値を著し
く減少させない程度が良く、100Å以下が適当で
ある。
The thickness of the metal thin film should be such that it does not significantly reduce the resistance value of the heating resistor, and is suitably 100 Å or less.

本考案によるサーマルヘツドと従来のサーマル
ヘツドの寿命試験の結果、本考案の方が2倍寿命
が長く良好な結果を得た。以下にその際のサーマ
ルヘツドの構成および試験条件を示す。
As a result of a life test of the thermal head according to the present invention and a conventional thermal head, the life of the present invention was twice as long and good results were obtained. The configuration of the thermal head and test conditions are shown below.

サーマルヘツドの構成 アルミナ基板 1.0mmt ガラス層 50μmt 金属薄膜層 クロム70Å(従来のサーマルヘツ
ドはこの部分はない) 発熱体 窒化タンタル2000Å、8ドツト/mm、
抵抗値500Ω/ドツト 保護膜 酸化ケイ素2μm、五酸化タンタル5μm 通電条件 通電時間2.5msec、くり返し周期
10msec、印加パワー0.4W/ドツト、10ド
ツト連続通電 発熱体破損までの通電パルス数 従来のサーマルヘツド 2億パルス、 本考案のサーマルヘツド 4億パルス 上記実施例で、厚さ2000Åの窒化タンタルの面
積抵抗は10〜15Ω/□程度であり、厚さ70Åのク
ロムの面積抵抗は20kΩ/□程度で、両者の比は
1000倍以上ある。従つて、電流の大部分は発熱体
を流れ、金属薄膜層をもうけたことによる発熱体
の電流への影響は無視できる。
Thermal head composition Alumina substrate 1.0mmt Glass layer 50μmt Metal thin film layer Chromium 70Å (conventional thermal head does not have this part) Heating element Tantalum nitride 2000Å, 8 dots/mm,
Resistance value 500Ω/dot Protective film Silicon oxide 2μm, tantalum pentoxide 5μm Current conditions Current application time 2.5msec, repetition cycle
10 msec, applied power 0.4 W/dot, 10 dots continuous energization Number of energizing pulses until heating element breaks Conventional thermal head 200 million pulses Inventive thermal head 400 million pulses In the above example, the area of tantalum nitride with a thickness of 2000 Å The resistance is about 10 to 15Ω/□, and the area resistance of chromium with a thickness of 70Å is about 20kΩ/□, and the ratio of the two is
There are more than 1000 times more. Therefore, most of the current flows through the heating element, and the effect of providing the metal thin film layer on the current of the heating element can be ignored.

発熱抵抗体とガラス層の間に金属薄膜を形成し
たことによる発熱体の密着力の向上は、次のよう
に説明することができる。第3図は、本考案によ
るサーマルヘツドの構成物質の結合を示す図であ
る。ガラス層2と金属薄膜6との界面7では、ガ
ラス中の酸素と金属の強い結合M−Oが存在し、
また、金属薄膜6と発熱抵抗体3との界面8で
は、M−Taの強い結合が存在している。これら
界面での結合は、従来の窒化タンタル.ガラス層
間の結合よりも強く、したがつて、サーマルヘツ
ドの使用時の熱ストレスにも強くなるという利点
がある。
The improvement in the adhesion of the heating element by forming the metal thin film between the heating resistor and the glass layer can be explained as follows. FIG. 3 is a diagram showing the combination of constituent materials of the thermal head according to the present invention. At the interface 7 between the glass layer 2 and the metal thin film 6, a strong bond M-O exists between oxygen in the glass and the metal,
Furthermore, a strong M-Ta bond exists at the interface 8 between the metal thin film 6 and the heating resistor 3. Bonding at these interfaces is similar to conventional tantalum nitride. It has the advantage that it is stronger than the bond between glass layers and is therefore more resistant to thermal stress during use of a thermal head.

(考案の効果) 本考案は、発熱抵抗体とガラス層の間に金属薄
膜を形成し、発熱抵抗体の密着力を向上させてい
るので、長寿命のサーマルヘツドに利用すること
ができる。
(Effects of the Invention) The present invention improves the adhesion of the heating resistor by forming a metal thin film between the heating resistor and the glass layer, so it can be used in a long-life thermal head.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のサーマルヘツドの断面図、第2
図は本考案によるサーマルヘツドの断面図、第3
図は本考案のサーマルヘツドの構成物質の結合を
示す図である。 1……アルミナ基板、2……ガラス層、3……
発熱抵抗体、4……給電体、5……保護膜、6…
…金属薄膜、7……ガラス層と金属薄膜との界
面、8……金属薄膜と発熱抵抗体との界面。
Figure 1 is a sectional view of a conventional thermal head, Figure 2 is a sectional view of a conventional thermal head.
The figure is a cross-sectional view of the thermal head according to the present invention.
The figure is a diagram showing the combination of constituent materials of the thermal head of the present invention. 1...Alumina substrate, 2...Glass layer, 3...
Heat generating resistor, 4... Power supply, 5... Protective film, 6...
... Metal thin film, 7... Interface between glass layer and metal thin film, 8... Interface between metal thin film and heating resistor.

Claims (1)

【実用新案登録請求の範囲】 (1) 基板と、その上のガラス層と、その上の発熱
抵抗体と、その上の給電体及び保護膜とを有す
るサーマルヘツドにおいて、ガラス層と発熱抵
抗体の間にガラス層と発熱抵抗体の両方に直接
接する金属薄膜がもうけられることを特徴とす
るサーマルヘツド。 (2) 前記金属薄膜がアルミニウム、チタン、マン
ガン及びクロムから選ばれる一つであるごとき
実用新案登録請求の範囲第1項記載のサーマル
ヘツド。
[Claims for Utility Model Registration] (1) In a thermal head having a substrate, a glass layer thereon, a heating resistor thereon, a power supply body and a protective film thereon, the glass layer and the heating resistor A thermal head characterized in that a thin metal film is formed between the glass layer and the heating resistor in direct contact with both the glass layer and the heating resistor. (2) The thermal head according to claim 1, wherein the metal thin film is one selected from aluminum, titanium, manganese, and chromium.
JP1983013670U 1983-02-03 1983-02-03 thermal head Granted JPS59120158U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983013670U JPS59120158U (en) 1983-02-03 1983-02-03 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983013670U JPS59120158U (en) 1983-02-03 1983-02-03 thermal head

Publications (2)

Publication Number Publication Date
JPS59120158U JPS59120158U (en) 1984-08-13
JPH018365Y2 true JPH018365Y2 (en) 1989-03-06

Family

ID=30145054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983013670U Granted JPS59120158U (en) 1983-02-03 1983-02-03 thermal head

Country Status (1)

Country Link
JP (1) JPS59120158U (en)

Also Published As

Publication number Publication date
JPS59120158U (en) 1984-08-13

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