JPH0184431U - - Google Patents
Info
- Publication number
- JPH0184431U JPH0184431U JP1987181569U JP18156987U JPH0184431U JP H0184431 U JPH0184431 U JP H0184431U JP 1987181569 U JP1987181569 U JP 1987181569U JP 18156987 U JP18156987 U JP 18156987U JP H0184431 U JPH0184431 U JP H0184431U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wedge
- mount portion
- lead
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/759—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent discrete passive device
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係るワイヤボンデイング装置
の一部断面図側面図、第２図は従来のワイヤボン
デイング装置の一部断面側面図、第３図は従来の
ワイヤボンデイング装置の平面図、第４図はペレ
ツトマウントする部分のリードフレームの部分平
面図、第５図はウエツジの斜視図である。
１……リードフレーム、３……ワイヤボンデイ
ング装置、６……ウエツジ、８……金属細線、１
０……マウント部、１１……リード、１４……ペ
レツト、１５……位置決めピン、１７……ノズル
。
FIG. 1 is a partially sectional side view of a wire bonding device according to the present invention, FIG. 2 is a partially sectional side view of a conventional wire bonding device, FIG. 3 is a plan view of a conventional wire bonding device, and FIG. The figure is a partial plan view of the lead frame in which the pellets are mounted, and FIG. 5 is a perspective view of the wedge. 1...Lead frame, 3...Wire bonding device, 6...Wedge, 8...Thin metal wire, 1
0...Mount part, 11...Lead, 14...Pellet, 15...Positioning pin, 17...Nozzle.
Claims (1)
ト部とペレツトマウント部の周囲に近接配置した
リードとを位置決めピンにて位置決めし、半導体
ペレツトの電極とリード遊端部とをボンデイング
用のウエツジを介して金属細線で、電気的に接続
するワイヤボンデイング装置において、 上記位置決めピン上にウエツジの下方をエアー
ブローするノズルを付設したことを特徴とするワ
イヤボンデイング装置。[Claim for Utility Model Registration] A pellet mount portion on which a semiconductor pellet is mounted and a lead arranged close to the pellet mount portion are positioned using positioning pins, and the electrode of the semiconductor pellet and the free end of the lead are bonded. 1. A wire bonding device for electrically connecting a thin metal wire through a wedge, characterized in that a nozzle for blowing air below the wedge is attached to the positioning pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181569U JPH0184431U (en) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181569U JPH0184431U (en) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184431U true JPH0184431U (en) | 1989-06-05 |
Family
ID=31473050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181569U Pending JPH0184431U (en) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184431U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2006229370B2 (en) * | 2005-03-29 | 2011-11-03 | I. Mar Planning Inc. | Ink transfer split roller unit and printing machine |
-
1987
- 1987-11-27 JP JP1987181569U patent/JPH0184431U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2006229370B2 (en) * | 2005-03-29 | 2011-11-03 | I. Mar Planning Inc. | Ink transfer split roller unit and printing machine |