JPH0367431U - - Google Patents
Info
- Publication number
- JPH0367431U JPH0367431U JP1989128126U JP12812689U JPH0367431U JP H0367431 U JPH0367431 U JP H0367431U JP 1989128126 U JP1989128126 U JP 1989128126U JP 12812689 U JP12812689 U JP 12812689U JP H0367431 U JPH0367431 U JP H0367431U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor pellet
- lead
- substrate
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す拡大縦断面図、
第２図は平面図、第３図は要部斜視図、第４図は
リードフレームの基板の側端縁部を示す斜視図、
第５図ａ，ｂはリードの立上り部に形成されたボ
ンデイング面の具体例を示す斜視説明図である。
第６図は従来の半導体装置を示す拡大縦断面図、
第７図は平面図である。
１′……基板、２′，２′……リード、３′…
…半導体ペレツト、４′，４′……金属細線、６
′……外装樹脂材、１１……立上り片、１２……
ボンデイング面。
FIG. 1 is an enlarged longitudinal sectional view showing an embodiment of the present invention;
FIG. 2 is a plan view, FIG. 3 is a perspective view of the main part, and FIG. 4 is a perspective view showing the side edge of the lead frame substrate.
FIGS. 5A and 5B are perspective explanatory views showing a specific example of a bonding surface formed on a rising portion of a lead.
FIG. 6 is an enlarged vertical cross-sectional view showing a conventional semiconductor device;
FIG. 7 is a plan view. 1'...Substrate, 2', 2'...Lead, 3'...
...Semiconductor pellet, 4', 4'...Thin metal wire, 6
'...Exterior resin material, 11...Rising piece, 12...
Bonding side.
Claims (1)
ペレツトの近傍に配置した複数のリードと上記半
導体ペレツトとを金属細線で電気的に接続し、上
記基板とリードを含む主要部を外装樹脂材にて封
止してなる半導体装置において、 上記リード先端部を、端面が半導体ペレツトと
略面一となるように折り曲げ、上記リードの端面
に金属細線を接続したことを特徴とする半導体装
置。[Claims for Utility Model Registration] A semiconductor pellet is mounted on a substrate, and a plurality of leads placed near the semiconductor pellet are electrically connected to the semiconductor pellet by thin metal wires, and the main parts including the substrate and the leads are mounted. in a semiconductor device sealed with an exterior resin material, characterized in that the tip of the lead is bent so that the end face is substantially flush with the semiconductor pellet, and a thin metal wire is connected to the end face of the lead. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128126U JPH0367431U (en) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128126U JPH0367431U (en) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367431U true JPH0367431U (en) | 1991-07-01 |
Family
ID=31675852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128126U Pending JPH0367431U (en) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367431U (en) |
-
1989
- 1989-10-31 JP JP1989128126U patent/JPH0367431U/ja active Pending
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