JPH0184431U - - Google Patents

Info

Publication number
JPH0184431U
JPH0184431U JP1987181569U JP18156987U JPH0184431U JP H0184431 U JPH0184431 U JP H0184431U JP 1987181569 U JP1987181569 U JP 1987181569U JP 18156987 U JP18156987 U JP 18156987U JP H0184431 U JPH0184431 U JP H0184431U
Authority
JP
Japan
Prior art keywords
pellet
wedge
mount portion
lead
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987181569U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987181569U priority Critical patent/JPH0184431U/ja
Publication of JPH0184431U publication Critical patent/JPH0184431U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/759—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent discrete passive device

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るワイヤボンデイング装置
の一部断面図側面図、第２図は従来のワイヤボン
デイング装置の一部断面側面図、第３図は従来の
ワイヤボンデイング装置の平面図、第４図はペレ
ツトマウントする部分のリードフレームの部分平
面図、第５図はウエツジの斜視図である。 １……リードフレーム、３……ワイヤボンデイ
ング装置、６……ウエツジ、８……金属細線、１
０……マウント部、１１……リード、１４……ペ
レツト、１５……位置決めピン、１７……ノズル
。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体ペレツトをマウントしたペレツトマウン
    ト部とペレツトマウント部の周囲に近接配置した
    リードとを位置決めピンにて位置決めし、半導体
    ペレツトの電極とリード遊端部とをボンデイング
    用のウエツジを介して金属細線で、電気的に接続
    するワイヤボンデイング装置において、 上記位置決めピン上にウエツジの下方をエアー
    ブローするノズルを付設したことを特徴とするワ
    イヤボンデイング装置。
JP1987181569U 1987-11-27 1987-11-27 Pending JPH0184431U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987181569U JPH0184431U (ja) 1987-11-27 1987-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987181569U JPH0184431U (ja) 1987-11-27 1987-11-27

Publications (1)

Publication Number Publication Date
JPH0184431U true JPH0184431U (ja) 1989-06-05

Family

ID=31473050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987181569U Pending JPH0184431U (ja) 1987-11-27 1987-11-27

Country Status (1)

Country Link
JP (1) JPH0184431U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2006229370B2 (en) * 2005-03-29 2011-11-03 I. Mar Planning Inc. Ink transfer split roller unit and printing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2006229370B2 (en) * 2005-03-29 2011-11-03 I. Mar Planning Inc. Ink transfer split roller unit and printing machine

Similar Documents

Publication Publication Date Title
JPS63178342U (ja)
JPH0236053U (ja)
JPS6346855U (ja)
JPH0474460U (ja)
JPH01121929U (ja)
JPS6377341U (ja)
JPH032640U (ja)
JPS61203564U (ja)
JPH0313754U (ja)
JPS62112142U (ja)
JPH0273743U (ja)
JPH0217843U (ja)
JPH0252452U (ja)
JPS6190245U (ja)
JPS61127635U (ja)
JPH0367431U (ja)
JPS6183039U (ja)
JPH0192135U (ja)
JPH0367450U (ja)
JPH0224548U (ja)
JPH0245651U (ja)
JPS61127634U (ja)
JPH0476037U (ja)
JPS6181141U (ja)
JPH0184449U (ja)