JPH0184449U - - Google Patents
Info
- Publication number
- JPH0184449U JPH0184449U JP1987180583U JP18058387U JPH0184449U JP H0184449 U JPH0184449 U JP H0184449U JP 1987180583 U JP1987180583 U JP 1987180583U JP 18058387 U JP18058387 U JP 18058387U JP H0184449 U JPH0184449 U JP H0184449U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- shape
- semiconductor
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す上面概略図、
第２図は第１図のＡ―Ａ線断面図、第３図は従来
のリードフレームを使用したモールド封止済の断
面概略図である。 １……アイランド、２，２ａ，２ｂ，２ｃ……
リード、３……半導体素子、４，４ａ，４ｂ，４
ｃ……ボンデイングワイヤー、５……モールド樹
脂。
第２図は第１図のＡ―Ａ線断面図、第３図は従来
のリードフレームを使用したモールド封止済の断
面概略図である。 １……アイランド、２，２ａ，２ｂ，２ｃ……
リード、３……半導体素子、４，４ａ，４ｂ，４
ｃ……ボンデイングワイヤー、５……モールド樹
脂。
Claims (1)
- 半導体装置に使用されるリードフレームであつ
て、半導体素子を搭載する部分と外部電極となる
リード部分が同一平面にない形状を有するリード
フレームの内部リード先端部を凹状に加工したこ
とを特徴とする半導体装置用リードフレーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180583U JPH0184449U (ja) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180583U JPH0184449U (ja) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184449U true JPH0184449U (ja) | 1989-06-05 |
Family
ID=31472097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180583U Pending JPH0184449U (ja) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184449U (ja) |
-
1987
- 1987-11-26 JP JP1987180583U patent/JPH0184449U/ja active Pending