JPH0377444U - - Google Patents
Info
- Publication number
- JPH0377444U JPH0377444U JP1989138262U JP13826289U JPH0377444U JP H0377444 U JPH0377444 U JP H0377444U JP 1989138262 U JP1989138262 U JP 1989138262U JP 13826289 U JP13826289 U JP 13826289U JP H0377444 U JPH0377444 U JP H0377444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- tip
- lead wire
- probe
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の一実施例による半導体装置
の縦断面図である。第２図は、本考案の他の実施
例２による半導体装置の縦断面図である。第３図
は従来の半導体装置の縦断面図である。 ５……ガラス、２，２′，６，６′，１１，１
１′……ジユメツト線、３，７，１２……チツプ
、４，８……探針、９……空胴、１，１０……樹
脂、１３……ワイヤ、１４，１５……ロー材。
の縦断面図である。第２図は、本考案の他の実施
例２による半導体装置の縦断面図である。第３図
は従来の半導体装置の縦断面図である。 ５……ガラス、２，２′，６，６′，１１，１
１′……ジユメツト線、３，７，１２……チツプ
、４，８……探針、９……空胴、１，１０……樹
脂、１３……ワイヤ、１４，１５……ロー材。
Claims (1)
- 一方のリード線の先端に半導体チツプを搭載し
、該半導体チツプの電極を他方のリード線の先端
に接合されている探針ではさみ込み、少くとも前
記半導体チツプと前記探針とを樹脂で覆う構造と
したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138262U JPH0377444U (ja) | 1989-11-28 | 1989-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138262U JPH0377444U (ja) | 1989-11-28 | 1989-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377444U true JPH0377444U (ja) | 1991-08-05 |
Family
ID=31685372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989138262U Pending JPH0377444U (ja) | 1989-11-28 | 1989-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377444U (ja) |
-
1989
- 1989-11-28 JP JP1989138262U patent/JPH0377444U/ja active Pending