JPH0187554U - - Google Patents
Info
- Publication number
- JPH0187554U JPH0187554U JP1987182924U JP18292487U JPH0187554U JP H0187554 U JPH0187554 U JP H0187554U JP 1987182924 U JP1987182924 U JP 1987182924U JP 18292487 U JP18292487 U JP 18292487U JP H0187554 U JPH0187554 U JP H0187554U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- frame
- support bar
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、リードフレームの一部省略平面図、
第２図ａ，ｂは、第１図におけるＸ―Ｘ矢視図、
第３図は、他の実施例を示す一部省略平面図、第
４図ａ，ｂは、第３図におけるＹ―Ｙ矢視図、第
５図は、更に他の実施例を示す一部省略平面図、
第６図ａ，ｂは、第５図におけるＺ―Ｚ矢視図、
第７図は、従来のリードフレームを示す平面図、
第８図は、封止用樹脂の充填状態を示す断面概略
図である。
１……リードフレーム、１１……レール、１２
……サポートバー、１３……ダイパツド、１４…
…インナリード、１５……アウトリード、２……
整流部、２１〜２６……整流板、Ａ……リードフ
レームのゲート近傍部分。
Fig. 1 is a partially omitted plan view of the lead frame;
Figures 2a and b are XX arrow views in Figure 1,
3 is a partially omitted plan view showing another embodiment, FIGS. 4a and 4b are Y--Y arrow views in FIG. 3, and FIG. Abbreviated floor plan,
Figures 6a and b are Z-Z arrow views in Figure 5;
FIG. 7 is a plan view showing a conventional lead frame;
FIG. 8 is a schematic cross-sectional view showing the filling state of the sealing resin. 1...Lead frame, 11...Rail, 12
...Support bar, 13...Die pad, 14...
...Inner lead, 15... Outer lead, 2...
Rectifier, 21 to 26... Rectifier plate, A... Portion near the gate of the lead frame.
Claims (1)
イパツドを形成し、該ダイパツドに向けてインナ
リードを設けるとともに、該インナリードにアウ
トリードを延設して成るリードフレームであつて
、 樹脂封止用金型のゲート近傍に配設される前記
サポートバー又はインナリードを突出させて幅広
の整流部を形成した樹脂封止半導体装置用リード
フレーム。 (2) 前記整流部は樹脂の流入方向に対して所定
角度に屈曲したことを特徴とする実用新案登録請
求の範囲第１項記載の樹脂封止半導体装置用リー
ドフレーム。[Claims for Utility Model Registration] (1) A lead formed by forming a die pad between a pair of rails via a support bar, providing an inner lead toward the die pad, and extending an out lead to the inner lead. A lead frame for a resin-sealed semiconductor device, which is a frame and has a wide rectifying portion formed by protruding the support bar or inner lead disposed near a gate of a resin-sealing mold. (2) The lead frame for a resin-sealed semiconductor device according to claim 1, wherein the rectifying portion is bent at a predetermined angle with respect to the inflow direction of the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182924U JPH0187554U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182924U JPH0187554U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187554U true JPH0187554U (en) | 1989-06-09 |
Family
ID=31474363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987182924U Pending JPH0187554U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187554U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5298472A (en) * | 1976-02-16 | 1977-08-18 | Hitachi Ltd | Lead frame for resin molding |
-
1987
- 1987-12-02 JP JP1987182924U patent/JPH0187554U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5298472A (en) * | 1976-02-16 | 1977-08-18 | Hitachi Ltd | Lead frame for resin molding |