JPH0187562U - - Google Patents

Info

Publication number
JPH0187562U
JPH0187562U JP1987184574U JP18457487U JPH0187562U JP H0187562 U JPH0187562 U JP H0187562U JP 1987184574 U JP1987184574 U JP 1987184574U JP 18457487 U JP18457487 U JP 18457487U JP H0187562 U JPH0187562 U JP H0187562U
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging device
light
connection part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987184574U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184574U priority Critical patent/JPH0187562U/ja
Publication of JPH0187562U publication Critical patent/JPH0187562U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】
第１図は本考案による一実施例の側面図、第２
図は同実施例の分解図、第３図は同実施例におけ
る導体パターンの一例を示す図、第４図は従来の
固体撮像装置のパツケージ構造を示す図である。 １１：固体撮像素子、１２：突起電極、１３：
透明基板、１４：導体パターン、１６：カラーフ
イルタ、１７：封止樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 受光素子及び電荷転送素子が形成され、且つ入
    出力電極部に突起電極を形成してなる固体撮像素
    子と、 透光性基板と、 上記固体撮像素子の突起電極と対向する位置に
    接続部が形成され、該接続部から外周部に延びる
    他方の先端に外部接続部が形成された上記透光性
    基板上の導体パターンと、 上記固体撮像素子背面を被つて固体撮像素子を
    透光性基板に固定する封止材とを備えてなること
    を特徴とする固体撮像装置。
JP1987184574U 1987-12-02 1987-12-02 Pending JPH0187562U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184574U JPH0187562U (ja) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184574U JPH0187562U (ja) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187562U true JPH0187562U (ja) 1989-06-09

Family

ID=31475925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184574U Pending JPH0187562U (ja) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187562U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056989A (ja) * 1990-11-05 1993-01-14 Matsushita Electron Corp 撮像装置およびその製造方法
US10236312B2 (en) 2015-02-16 2019-03-19 Sony Corporation Camera module and electronic apparatus to lower risk of breakage of camera module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056989A (ja) * 1990-11-05 1993-01-14 Matsushita Electron Corp 撮像装置およびその製造方法
US10236312B2 (en) 2015-02-16 2019-03-19 Sony Corporation Camera module and electronic apparatus to lower risk of breakage of camera module

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