JPH0448646U - - Google Patents
Info
- Publication number
- JPH0448646U JPH0448646U JP1990091449U JP9144990U JPH0448646U JP H0448646 U JPH0448646 U JP H0448646U JP 1990091449 U JP1990091449 U JP 1990091449U JP 9144990 U JP9144990 U JP 9144990U JP H0448646 U JPH0448646 U JP H0448646U
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- light receiving
- amplifier circuit
- electrode layer
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Description
第１図は本考案の一実施例を示す断面図である
。
。
Claims (1)
- 第１電極層、非晶質半導体層及び第２電極層を
順次積層してなる受光素子と、この受光素子の出
力信号を増幅するべく受光素子に接続される増幅
回路とを、同一基板上に配すると共に、受光素子
、増幅回路及びこれらの接続部を、電気的に接地
した導電性ペーストで覆つたことを特徴とする光
センサ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091449U JPH0448646U (ja) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091449U JPH0448646U (ja) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448646U true JPH0448646U (ja) | 1992-04-24 |
Family
ID=31827094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990091449U Pending JPH0448646U (ja) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448646U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066583A (ja) * | 2006-09-08 | 2008-03-21 | Asahi Kasei Electronics Co Ltd | 光センサ |
-
1990
- 1990-08-30 JP JP1990091449U patent/JPH0448646U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066583A (ja) * | 2006-09-08 | 2008-03-21 | Asahi Kasei Electronics Co Ltd | 光センサ |