JPH0187567U - - Google Patents
Info
- Publication number
- JPH0187567U JPH0187567U JP1987184216U JP18421687U JPH0187567U JP H0187567 U JPH0187567 U JP H0187567U JP 1987184216 U JP1987184216 U JP 1987184216U JP 18421687 U JP18421687 U JP 18421687U JP H0187567 U JPH0187567 U JP H0187567U
- Authority
- JP
- Japan
- Prior art keywords
- concave mirror
- led lamp
- led chip
- led
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図Ａ，Ｂは夫々本考案のＬＥＤランプの側
面（断面）図及び正面図、第２図Ａ及びＢは夫々
本考案のＬＥＤランプの製造過程を示す斜視図及
び同図Ａ中―線に沿う断面図、第３図Ａ，Ｂ
は夫々樹脂が固まつた後にベースを取外した状態
を示す斜視図及びその―線に沿う断面図、第
３図Ｃ，Ｄは夫々金属ベースの斜視図及びこれに
液状未硬化樹脂を注入した状態を示す断面図、第
４図及び第５図は従来の代表的なＬＥＤランプの
断面図である。
２……ＬＥＤチツプ、１１……ＬＥＤランプ、
１２……金属ベース、１２ａ……凹面鏡、１３，
１４……リード板、１３ａ，１３ｂ，１４ａ……
溝、１５……スペーサ、１６，１７……光透過性
（エポキシ）樹脂、２２……ベース。
Figures 1A and B are side (cross-sectional) and front views of the LED lamp of the present invention, respectively, and Figures 2A and B are perspective views showing the manufacturing process of the LED lamp of the present invention, respectively, and the middle line in Figure A. Cross-sectional view along Figure 3 A, B
3A and 3B are perspective views showing the base removed after the resin has hardened, and a sectional view taken along the - line, respectively. Figures 3C and 3D are perspective views of the metal base and the state in which liquid uncured resin is injected into it. FIGS. 4 and 5 are cross-sectional views of typical conventional LED lamps. 2...LED chip, 11...LED lamp,
12...metal base, 12a...concave mirror, 13,
14...Lead plate, 13a, 13b, 14a...
Groove, 15... Spacer, 16, 17... Light transmitting (epoxy) resin, 22... Base.
補正 昭６３．６．２９
実用新案登録請求の範囲を次のように補正する
。Amendment June 29, 1983 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
(1) 光無線データ伝送に用いられるＬＥＤラン
プであつて、光の放射方向に対して後向きに配置
されたＬＥＤチツプと、該ＬＥＤチツプから出た
光を有効に反射すべく該ＬＥＤチツプの前方に対
向配置された凹面鏡とからなり、上記ＬＥＤチツ
プは薄い金属製のリード板に取付けられ、上記凹
面鏡の前方に配置されるように光透過性樹脂でモ
ールドされたことを特徴とするＬＥＤランプ。
(2) 凹面鏡は金属製である実用新案登録請求の
範囲第１項記載のＬＥＤランプ。
(3) 凹面鏡は上記光透過性樹脂の表面に鍍金、
コーテイング、又はスパツタリングなどにより反
射特性を持たせたものである実用新案登録請求の
範囲第１項記載のＬＥＤランプ。[Claims for Utility Model Registration] (1) An LED lamp used for optical wireless data transmission, which includes an LED chip that is placed backward with respect to the direction of light emission, and an LED lamp that effectively uses the light emitted from the LED chip. It consists of a concave mirror placed oppositely in front of the LED chip to reflect the light.
The LED lamp is attached to a thin metal lead plate and is molded with a light-transmitting resin so as to be placed in front of the concave mirror. (2) The LED lamp according to claim 1, wherein the concave mirror is made of metal. (3) The concave mirror is plated on the surface of the above-mentioned light-transmitting resin .
Resolved by coating or sputtering , etc.
1. The LED lamp according to claim 1 of the utility model registration claim, which has radiation characteristics.
Claims (1)
ＬＥＤチツプと、該ＬＥＤチツプからの出射光の
大部分を有効に反射すべく該ＬＥＤチツプ前方に
対向配置された凹面鏡と、該凹面鏡の周縁部の所
定箇所にその一端を固定され、その他端に上記Ｌ
ＥＤチツプを取付けた薄い金属製のリード板と、
上記凹面鏡の前方上該リード板が隠れる程度にモ
ールド成型された光透過性樹脂とより成ることを
特徴とするＬＥＤランプ。 (2) 凹面鏡は金属製である実用新案登録請求の
範囲第１項記載のＬＥＤランプ。 (3) 凹面鏡は非金属製の材料の表面に鍍金、コ
ーテイング、又はスパツタリングにより金属製の
薄膜を形成して反射特性を持たせたものである実
用新案登録請求の範囲第１項記載のＬＥＤランプ
。[Claims for Utility Model Registration] (1) An LED chip arranged facing backward with respect to the direction of light emission, and opposed arrangement in front of the LED chip to effectively reflect most of the light emitted from the LED chip. one end is fixed to a predetermined location on the periphery of the concave mirror, and the other end is fixed to the above-mentioned L.
A thin metal lead plate with an ED chip attached,
An LED lamp comprising a light-transmitting resin molded on the front side of the concave mirror to such an extent that the lead plate is hidden. (2) The LED lamp according to claim 1, wherein the concave mirror is made of metal. (3) The concave mirror is a non-metallic material with a thin metal film formed on the surface by plating, coating, or sputtering to give it reflective properties.The LED lamp according to claim 1 of the utility model registration claim. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184216U JPH0187567U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184216U JPH0187567U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187567U true JPH0187567U (en) | 1989-06-09 |
Family
ID=31475591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987184216U Pending JPH0187567U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187567U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344710A (en) * | 2005-06-08 | 2006-12-21 | Sony Corp | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD, SEMICONDUCTOR LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD |
-
1987
- 1987-12-02 JP JP1987184216U patent/JPH0187567U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344710A (en) * | 2005-06-08 | 2006-12-21 | Sony Corp | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD, SEMICONDUCTOR LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD |
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