JPH0187588U - - Google Patents
Info
- Publication number
- JPH0187588U JPH0187588U JP18425687U JP18425687U JPH0187588U JP H0187588 U JPH0187588 U JP H0187588U JP 18425687 U JP18425687 U JP 18425687U JP 18425687 U JP18425687 U JP 18425687U JP H0187588 U JPH0187588 U JP H0187588U
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- circuit board
- integrated circuit
- microwave integrated
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Waveguides (AREA)
Description
第１図、第２図はいずれも本考案の実施例のＭ
ＩＣ基板の取付構造を示し、第２図は上面図、第
１図は第２図における―線断面図である。第
３図、第４図は従来のＭＩＣ基板の取付構造の断
面図である。
１……ＭＩＣ基板、２……開孔、３……第１の
メタライズ層、４ａ，４ｂ……回路パターン、５
……素子、６……ダイキヤスト製ベース、６ａ…
…突起、７……第２のメタライズ層、８……半田
部、９……スルーホール。
Fig. 1 and Fig. 2 are both M of the embodiment of the present invention.
2 is a top view, and FIG. 1 is a sectional view taken along the line -- in FIG. 2, showing the mounting structure of the IC board. 3 and 4 are cross-sectional views of a conventional MIC board mounting structure. DESCRIPTION OF SYMBOLS 1... MIC board, 2... Opening, 3... First metallized layer, 4a, 4b... Circuit pattern, 5
...Element, 6...Die-cast base, 6a...
...Protrusion, 7...Second metallized layer, 8...Solder part, 9...Through hole.
Claims (1)
ロ波集積回路基板と、このマイクロ波集積回路基
板の裏面及び前記開孔内に設けられた第１のメタ
ライズ層と、前記開孔に挿入し得る突起が一体成
形されたダイキヤスト製ベースと、前記突起上に
形成された半田付可能な材料よりなる第２のメタ
ライズ層と、前記第１のメタライズ層と前記第２
のメタライズ層を接続する半田部と、から成るこ
とを特徴とするマイクロ波集積回路基板の取付構
造。 ２ 前記第２のメタライズ層はＮｉから成ること
を特徴とする実用新案登録請求の範囲第１項に記
載のマイクロ波集積回路基板の取付構造。[Claims for Utility Model Registration] 1. A microwave integrated circuit board made of ceramic and provided with an aperture, a first metallized layer provided on the back surface of the microwave integrated circuit board and in the aperture, and the a die-cast base integrally formed with a protrusion that can be inserted into the opening; a second metallized layer made of a solderable material formed on the protrusion; the first metallized layer and the second metallized layer;
A mounting structure for a microwave integrated circuit board, characterized by comprising: a solder portion connecting metallized layers of the substrate; 2. The mounting structure for a microwave integrated circuit board according to claim 1, wherein the second metallized layer is made of Ni.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18425687U JPH0510391Y2 (en) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18425687U JPH0510391Y2 (en) | 1987-12-01 | 1987-12-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0187588U true JPH0187588U (en) | 1989-06-09 |
| JPH0510391Y2 JPH0510391Y2 (en) | 1993-03-15 |
Family
ID=31475629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18425687U Expired - Lifetime JPH0510391Y2 (en) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510391Y2 (en) |
-
1987
- 1987-12-01 JP JP18425687U patent/JPH0510391Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510391Y2 (en) | 1993-03-15 |