JPH0187588U - - Google Patents

Info

Publication number
JPH0187588U
JPH0187588U JP18425687U JP18425687U JPH0187588U JP H0187588 U JPH0187588 U JP H0187588U JP 18425687 U JP18425687 U JP 18425687U JP 18425687 U JP18425687 U JP 18425687U JP H0187588 U JPH0187588 U JP H0187588U
Authority
JP
Japan
Prior art keywords
metallized layer
circuit board
integrated circuit
microwave integrated
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18425687U
Other languages
English (en)
Other versions
JPH0510391Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18425687U priority Critical patent/JPH0510391Y2/ja
Publication of JPH0187588U publication Critical patent/JPH0187588U/ja
Application granted granted Critical
Publication of JPH0510391Y2 publication Critical patent/JPH0510391Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】
第１図、第２図はいずれも本考案の実施例のＭ
ＩＣ基板の取付構造を示し、第２図は上面図、第
１図は第２図における―線断面図である。第
３図、第４図は従来のＭＩＣ基板の取付構造の断
面図である。 １……ＭＩＣ基板、２……開孔、３……第１の
メタライズ層、４ａ，４ｂ……回路パターン、５
……素子、６……ダイキヤスト製ベース、６ａ…
…突起、７……第２のメタライズ層、８……半田
部、９……スルーホール。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ セラミツクよりなり開孔が設けられたマイク
    ロ波集積回路基板と、このマイクロ波集積回路基
    板の裏面及び前記開孔内に設けられた第１のメタ
    ライズ層と、前記開孔に挿入し得る突起が一体成
    形されたダイキヤスト製ベースと、前記突起上に
    形成された半田付可能な材料よりなる第２のメタ
    ライズ層と、前記第１のメタライズ層と前記第２
    のメタライズ層を接続する半田部と、から成るこ
    とを特徴とするマイクロ波集積回路基板の取付構
    造。 ２ 前記第２のメタライズ層はＮｉから成ること
    を特徴とする実用新案登録請求の範囲第１項に記
    載のマイクロ波集積回路基板の取付構造。
JP18425687U 1987-12-01 1987-12-01 Expired - Lifetime JPH0510391Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18425687U JPH0510391Y2 (ja) 1987-12-01 1987-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18425687U JPH0510391Y2 (ja) 1987-12-01 1987-12-01

Publications (2)

Publication Number Publication Date
JPH0187588U true JPH0187588U (ja) 1989-06-09
JPH0510391Y2 JPH0510391Y2 (ja) 1993-03-15

Family

ID=31475629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18425687U Expired - Lifetime JPH0510391Y2 (ja) 1987-12-01 1987-12-01

Country Status (1)

Country Link
JP (1) JPH0510391Y2 (ja)

Also Published As

Publication number Publication date
JPH0510391Y2 (ja) 1993-03-15

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