JPH0187596U - - Google Patents

Info

Publication number
JPH0187596U
JPH0187596U JP1987184203U JP18420387U JPH0187596U JP H0187596 U JPH0187596 U JP H0187596U JP 1987184203 U JP1987184203 U JP 1987184203U JP 18420387 U JP18420387 U JP 18420387U JP H0187596 U JPH0187596 U JP H0187596U
Authority
JP
Japan
Prior art keywords
housing
inert gas
cooling module
holes
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987184203U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184203U priority Critical patent/JPH0187596U/ja
Publication of JPH0187596U publication Critical patent/JPH0187596U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す断面図、第２図
は従来技術を示す断面図である。 １……冷却流路、２……冷却プレート、３……
ハウジング、４……プリント基板、５……ハウジ
ング部材、６……ベローズ、７，８……栓、９…
…電子素子、１０……シリンダ、１１……熱伝導
性材料、１２……注入孔、１３……排出孔、３０
……不活性ガス。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子を実装した基板を筐体内に密閉し、
    内部に不活性ガスを充填した冷却モジユールにお
    いて、 上記筐体内の空気と不活性ガスとを置換すべく
    、該筐体の構成部材３に該不活性ガス３０注入用
    の孔１２と、該空気排出用の孔１３とを形成した
    ことを特徴とする冷却モジユール。
JP1987184203U 1987-12-02 1987-12-02 Pending JPH0187596U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184203U JPH0187596U (ja) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184203U JPH0187596U (ja) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187596U true JPH0187596U (ja) 1989-06-09

Family

ID=31475580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184203U Pending JPH0187596U (ja) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187596U (ja)

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