JPH0189755U - - Google Patents
Info
- Publication number
- JPH0189755U JPH0189755U JP1987185559U JP18555987U JPH0189755U JP H0189755 U JPH0189755 U JP H0189755U JP 1987185559 U JP1987185559 U JP 1987185559U JP 18555987 U JP18555987 U JP 18555987U JP H0189755 U JPH0189755 U JP H0189755U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- body part
- double
- adhesive tape
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の斜視図である。
１……本体部、２……パツド、３……両面接着
テープ、４……ＳＯＰのＦ―ＩＣ。
テープ、４……ＳＯＰのＦ―ＩＣ。
Claims (1)
- 半導体基板上に形成した電子回路上に搭載して
パツケージ内に収容できる上面にＩＣを搭載する
本体部と、該本体部の前記上面に形成された前記
ＩＣとの接続用の複数のパツドと、前記本体部の
底面に貼付けられた両面接着テープとを有するこ
とを特徴とするＩＣ搭載用基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185559U JPH0189755U (ja) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185559U JPH0189755U (ja) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189755U true JPH0189755U (ja) | 1989-06-13 |
Family
ID=31476860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987185559U Pending JPH0189755U (ja) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189755U (ja) |
-
1987
- 1987-12-04 JP JP1987185559U patent/JPH0189755U/ja active Pending
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